High-Quality Microprintable and Stretchable Conductors for High-Performance 5G Wireless Communication

Abstract

With the advent of 5G wireless and Internet of Things technologies, flexible and stretchable printed circuit boards (PCBs) should be designed to address all the specifications necessary to receive signal transmissions, maintaining the signal integrity, and providing electrical connections. Here, we propose a silver nanoparticle (AgNP)/silver nanowire (AgNW) hybrid conductor and high-quality microprinting technology for fabricating flexible and stretchable PCBs in high-performance 5G wireless communication. A simple and low-cost reverse offset printing technique using a commercial adhesive hand-roller was adapted to ensure high-resolution and excellent pattern quality. The AgNP/AgNW micropatterns were fabricated in various line widths, from 5 μm to 5 mm. They exhibited excellent pattern qualities, such as fine line spacing, clear edge definition and outstanding pattern uniformity. After annealing via intense pulsed light irradiation, they showed outstanding electrical resistivity (15.7 μΩ cm). Moreover, they could withstand stretching up to a strain of 90% with a small change in resistance. As a demonstration of their practical application, the AgNP/AgNW micropatterns were used to fabricate 5G communication antennas that exhibited excellent wireless signal processing at operating frequencies in the C-band (4–8 GHz). Finally, a wearable sensor fabricated with these AgNP/AgNW micropatterns could successfully detected fine finger movements in real time with excellent sensitivity