High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi₂Te₃‑Based Thermoelectric Devices

Abstract

Environmental thermal energy harvesting based on thermoelectric devices is greatly significant to the advancement of next-generation self-powered wearable electronic devices. However, the rigid electrodes and interface diffusion of electrodes/thermoelectric materials would lead to the wearable discomfort and performance degradation of the thermoelectric device. Here, a flake-structured Al thin-film electrode with high conductivity and excellent reliability is prepared by regulating the microstructure and crystallinity of the films. The as-prepared Al thin film not only maintains its robustness after 1000 bending cycles but also does not delaminate from the substrate when subjected to the 3M tape test, exhibiting excellent flexibility and adhesion to substrate. By comparing with the annealed interface of the double-layer Cu/Bi2Te3 film, the interface of the heat-treated Al/Bi2Te3 film has almost no element diffusion, demonstrating high interfacial thermal stability. Moreover, a thermoelectric temperature sensor based on the Al thin-film electrode is prepared. The sensitivity of the annealed sensor is still linear, and it can stably monitor the temperature variation, showing high reliability. This discovery could provide a facile and effective strategy to achieving highly reliable thermoelectric devices and flexible electronic devices without any additional diffusion barriers