The
microstructure of physically assembled gels depends on mechanical
loading and environmental stimuli such as temperature. Here, we report
the real-time change in the structure of physically assembled triblock
copolymer gels that consist of 10 and 20 wt % of poly(styrene)–poly(isoprene)–poly(styrene)
[PS–PI–PS] triblock copolymer in mineral oil (i) during
the gelation process with decreasing temperature, (ii) subjected to
large oscillatory deformation, and (iii) during the stress-relaxation
process after the application of a step strain. The presence of loosely
bounded PS aggregates at temperatures higher than the rheologically
determined gelation temperature (Tgel)
signifies the progressive gelation process spanning over a broad temperature
range. However, the microstructure fully develops at temperatures
sufficiently lower than Tgel. The microstructure
orients in the stretching direction with the applied strain. In an
oscillation strain cycle, such oriented structure has been observed
at low strain. However, at large strain, the oriented structure splits
because of strain localization suggesting that only a fraction of
PI blocks participates in load bearing. Both microstructure recovery
and time-dependent moduli during the stress-relaxation process after
the application of a step strain have been captured using a stretched-exponential
model. However, the microstructure recovery time has been found to
be 2 orders of magnitude slower than the stress-relaxation time at
room temperature, indicating a complex nature of stress relaxation
and microstructure recovery processes involving midblock relaxation,
endblock pullout, and reassociation. Due to their viscoelastic nature,
these gels’ mechanical responses are sensitive to strain, temperature,
and rate of deformation. Therefore, insights into the microstructural
change as a function of these parameters will assist these gels’
real-life applications and design new gels with improved properties