In this work, plasmon-induced
heterointerface thinning for Schottky barrier modification of core/shell
SiC/SiO2 nanowires is conducted by femtosecond (fs) laser
irradiation. The incident energy of polarized fs laser (50 fs, 800
nm) is confined in the SiO2 shell of the nanowire due to
strong plasmonic localization in the region of the electrode–nanowire
junction. With intense nonlinear absorption in SiO2, the
thickness of the SiO2 layer can be thinned in a controllable
way. The tuning of the SiO2 barrier layer allows the promotion
of electron transportation at the electrode–nanowire interface.
The switching voltage of the rectifying junction made by the SiC/SiO2 nanowire can be significantly tuned from 15.7 to 1 V. When
selectively thinning at source and drain electrodes and leaving the
SiO2 barrier layer at the gate electrode intact, a metal/oxide/semiconductor
(MOS) device is fabricated with low leakage current. This optically
controlled interfacial engineering technology should be applicable
for MOS components and other heterogeneous integration structures