This paper presents a newly developed integrated
heating system, which can keep the IC under test at a constant
temperature of up to 250 ◦C. The heating system can be used
while the IC under test is mounted on its custom-designed
interface board, which controls the two supply voltages and
provides connectivity to an FPGA. Using a testing framework on
the FPGA, the test stimuli and operating clock can be provided
with at least 100 MHz. Thus, it is possible to fully vary all
three parameters—frequency, voltage, and temperature—during
continuous operation of the IC. A case study is performed with
a previously fabricated ASIC to test the proposed system
