A Physical Model for Drain Noise in High Electron Mobility Transistors: Theory and Experiment

Abstract

We report the on-wafer characterization of SS-parameters and microwave noise temperature (T50T_{50}) of discrete metamorphic GaAs high electron mobility transistors (HEMTs) at 40 K and 300 K over a range of drain-source voltages (VDSV_{DS}). From these data, we extract a small-signal model and the drain noise temperature (TdT_{d}) at each bias and temperature. We find that TdT_d follows a superlinear trend with VDSV_{DS} at both temperatures. These trends are interpreted by attributing drain noise to a thermal component associated with the channel resistance and a component due to real-space transfer (RST) of electrons from the channel to the barrier [1]. In the present devices at the minimum T50T_{50}, RST contributes ∼10\sim 10% of the drain noise at cryogenic temperatures. At 300 K, the contribution increases to over ∼60\sim 60% of the total drain noise. This finding indicates that improving the confinement of electrons in the quantum well could enable room-temperature receivers with up to ∼50\sim 50% lower noise temperatures by decreasing the contribution of RST to drain noise.Comment: 6 pages, 6 figure

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