2,373 research outputs found
Reconstructions of the Ge(0 0 1) surface
We have performed dipole calculations of energies of the Ge(0 0 1) surface to compare the ground states of b(2 Ă 1), c(4 Ă 2), p(2 Ă 2) and p(4 Ă 1) symmetry dimer reconstructions. We have found that p(2 Ă 2) is the lowest energy reconstruction at zero temperature
Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology
Our paper presents a non-destructive thermal transient measurement method
that is able to reveal differences even in the micron size range of MEMS
structures. Devices of the same design can have differences in their
sacrificial layers as consequence of the differences in their manufacturing
processes e.g. different etching times. We have made simulations examining how
the etching quality reflects in the thermal behaviour of devices. These
simulations predicted change in the thermal behaviour of MEMS structures having
differences in their sacrificial layers. The theory was tested with
measurements of similar MEMS devices prepared with different etching times. In
the measurements we used the T3Ster thermal transient tester equipment. The
results show that deviations in the devices, as consequence of the different
etching times, result in different temperature elevations and manifest also as
shift in time in the relevant temperature transient curves.Comment: Submitted on behalf of TIMA Editions
(http://irevues.inist.fr/tima-editions
Thermal measurement and modeling of multi-die packages
Thermal measurement and modeling of multi-die packages became a hot topic
recently in different fields like RAM chip packaging or LEDs / LED assemblies,
resulting in vertical (stacked) and lateral arrangement. In our present study
we show results for a mixed arrangement: an opto-coupler device has been
investigated with 4 chips in lateral as well as vertical arrangement. In this
paper we give an overview of measurement and modeling techniques and results
for stacked and MCM structures, describe our present measurement results
together with our structure function based methodology of validating the
detailed model of the package being studied. Also, we show how to derive
junction-to-pin thermal resistances with a technique using structure functions.Comment: Submitted on behalf of TIMA Editions
(http://irevues.inist.fr/tima-editions
A Novel Protocol-Authentication Algorithm Ruling Out a Man-in-the-Middle Attack in Quantum Cryptography
In this work we review the security vulnerability of Quantum Cryptography
with respect to "man-in-the-middle attacks" and the standard authentication
methods applied to counteract these attacks. We further propose a modified
authentication algorithm which features higher efficiency with respect to
consumption of mutual secret bits.Comment: 4 pages, submitted to the International Journal of Quantum
Information, Proceedings of the meeting "Foundations of Quantum Information",
Camerino, April 200
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