2,849 research outputs found

    Concept, realization and characterization of serially powered pixel modules

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    We prove and demonstrate here for the example of the large scale pixel detector of ATLAS that Serial Powering of pixel modules is a viable alternative and that has been devised and implemented for ATLAS pixel modules using dedicated on-chip voltage regulators and modified flex hybrids circuits. The equivalent of a pixel ladder consisting of six serially powered pixel modules with about 0.3Mpixels has been built and the performance with respect to noise and threshold stability and operation failures has been studied. We believe that Serial Powering in general will be necessary for future large scale tracking detectors

    System Tests of the ATLAS Pixel Detector

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    The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment at the LHC (Large Hadron Collider) will be a pixel detector, which is presently under construction. Once installed into the experimental area, access will be extremely limited. To ensure that the integrated detector assembly operates as expected, a fraction of the detector which includes the power supplies and monitoring system, the optical readout, and the pixel modules themselves, has been assembled and operated in a laboratory setting for what we refer to as system tests. Results from these tests are presented.Comment: 5 Pages, 9 Figures, to appear in Proceedings of the Eleventh Workshop on Electronics for LHC and Future Experiment

    Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

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    In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 x 10**15 neq/cm2, while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.Comment: Preprint submitted to Nuclear Instruments and Methods A, 11 pages, 13 fig

    Measurement of the cross-section and charge asymmetry of WW bosons produced in proton-proton collisions at s=8\sqrt{s}=8 TeV with the ATLAS detector

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    This paper presents measurements of the W+μ+νW^+ \rightarrow \mu^+\nu and WμνW^- \rightarrow \mu^-\nu cross-sections and the associated charge asymmetry as a function of the absolute pseudorapidity of the decay muon. The data were collected in proton--proton collisions at a centre-of-mass energy of 8 TeV with the ATLAS experiment at the LHC and correspond to a total integrated luminosity of 20.2~\mbox{fb^{-1}}. The precision of the cross-section measurements varies between 0.8% to 1.5% as a function of the pseudorapidity, excluding the 1.9% uncertainty on the integrated luminosity. The charge asymmetry is measured with an uncertainty between 0.002 and 0.003. The results are compared with predictions based on next-to-next-to-leading-order calculations with various parton distribution functions and have the sensitivity to discriminate between them.Comment: 38 pages in total, author list starting page 22, 5 figures, 4 tables, submitted to EPJC. All figures including auxiliary figures are available at https://atlas.web.cern.ch/Atlas/GROUPS/PHYSICS/PAPERS/STDM-2017-13

    Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

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    3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.Comment: 8 pages, 8 figures, presented at RD09 - 9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, 30 September - 2 October 2009, Florence, Ital

    Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

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    Presented at: 9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors - RD09. Florence, Italy, 30 September - 2 October 20093D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 γ-ray sources, charge collection tests with Sr90 β-source and an overview of preliminary results from the CERN beam test.publishedVersio

    Search for chargino-neutralino production with mass splittings near the electroweak scale in three-lepton final states in √s=13 TeV pp collisions with the ATLAS detector