1,757 research outputs found

    Advanced active pixel architectures in standard CMOS technology

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    This paper aims at exploring and validating the adoption of standard fabrication processes for the realization of CMOS active pixel sensors, for particle detection purposes. The goal is to implement a single-chip, complete radiation sensor system, including on a CMOS integrated circuit the sensitive devices, read-out and signal processing circuits. A prototype chip (RAPS01) based on these principles has been already fabricated, and a chip characterization has been carried out; in particular, the evaluation of the sensitivity of the sensor response on the actual operating conditions was estimated, as well as the response uniformity. Optimization and tailoring of the sensor structures for High Energy Physics applications are being evaluated in the design of the next generation chip (RAPS02). Basic features of the new chip includes digitally configurable readout and multi-mode access (i.e., either sparse of line-scan readout). © 2005 IEEE

    Assembly of the Inner Tracker Silicon Microstrip Modules

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    This note describes the organization of the mechanical assembly of the nearly 4000 silicon microstrip modules that were constructed in Italy for the Inner Tracker of the CMS experiment. The customization and the calibration of the robotic system adopted by the CMS Tracker community, starting from a general pilot project realized at CERN, is described. The step-by-step assembly procedure is illustrated in detail. Finally, the results for the mechanical precision of all assembled modules are reported

    Study of radiation damage and substrate resistivity effects from beam test of silicon microstrip detectors using LHC readout electronics

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    We present the beam test results of single-sided silicon microstrip detectors, with different substrate resistivities. The effects of radiation damage are studied for a detector irradiated to a fluence of 2.4 multiplied by 10**1**4 n/cm**2. The detectors are read out with the APV6 chip, which is compatible with the 40 MHz LHC clock. The performance of different detectors and readout modes are studied in terms of signal-to-noise ratio and efficiency

    Differential cross section measurements for the production of a W boson in association with jets in proton‚Äďproton collisions at ‚ąös = 7 TeV

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    Measurements are reported of differential cross sections for the production of a W boson, which decays into a muon and a neutrino, in association with jets, as a function of several variables, including the transverse momenta (pT) and pseudorapidities of the four leading jets, the scalar sum of jet transverse momenta (HT), and the difference in azimuthal angle between the directions of each jet and the muon. The data sample of pp collisions at a centre-of-mass energy of 7 TeV was collected with the CMS detector at the LHC and corresponds to an integrated luminosity of 5.0 fb[superscript ‚ąí1]. The measured cross sections are compared to predictions from Monte Carlo generators, MadGraph + pythia and sherpa, and to next-to-leading-order calculations from BlackHat + sherpa. The differential cross sections are found to be in agreement with the predictions, apart from the pT distributions of the leading jets at high pT values, the distributions of the HT at high-HT and low jet multiplicity, and the distribution of the difference in azimuthal angle between the leading jet and the muon at low values.United States. Dept. of EnergyNational Science Foundation (U.S.)Alfred P. Sloan Foundatio

    Optimasi Portofolio Resiko Menggunakan Model Markowitz MVO Dikaitkan dengan Keterbatasan Manusia dalam Memprediksi Masa Depan dalam Perspektif Al-Qur`an