Ball Grid Array Gehaeusetechnologie fuer Multi-Chip-Module Abschlussbericht

Evaluation of organic multilayer MCM-substrate materials of projekt partner STP in terms of dimension stability at thermal and mechanical treatment during assembly processes. Compatibility of organic and metallic substrate surfaces (by STP and atotech) with contact materials for assembly is evaluated. Analysis of surface tension, performance of adhesion test and wirebond test. Definition of suitable materials and topography. Description of the suitable assembly processes diebonding, wirebonding, molding, ball apply and evaluation with special testvehicles. Selection of mold compounds with respect to influence on package dimension stability and optimal processability. Describing the limits of unreinforced dielectrica materials. Evaluation and description of a flexible ball apply equipment for low volume production. Deduction of design rules for manufacturing of substrate. For essential reliability evaluations as well as for the thermal characterization of MCMs (with SMD, Flip chip, and Die- and wirebond chips) special testvehicles are used. The testvehicles have meandering structures at the innerlayers and are mounted with individual testable chips. Pick and place technology of MCM-package and Flip chips to board level is evaluated and the requirements for measuring, recognition and placing are evaluated and defined. Evaluation results of testvehicles lead to general recommendations of suitable materials for manufacturing of substrate and assembly processes of MCM-BGA package. They are completely used for the design of two demonstrators for automotive (BMW) and telecomunication (Blaupunkt). (orig.)SIGLEAvailable from TIB Hannover: F00B616+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman