Physical and chemical signatures of a developing anticyclonic eddy in the Leeuwin Current, eastern Indian Ocean

A multidisciplinary cruise aboard the R/V Southern Surveyor was conducted in May 2006 to sample a developing anticyclonic eddy of the Leeuwin Current off Western Australia. The eddy formed from a meander of the Leeuwin Current in mid-April 2006 and remained attached to the current until mid-August. In this study, a combination of satellite data (altimeter, sea surface temperature, and chlorophyll a) and shipboard measurements (acoustic Doppler current profiler and conductivity-temperature-depth) were used to characterize the physical and chemical signatures of the eddy. The temperature-salinity properties of the mixed layer waters within the anticyclonic eddy and on the shelf were both connected to that of the Leeuwin Current, indicating the water mass in the eddy is mainly derived from the Leeuwin Current and the modified Leeuwin Current water on the shelf. Above the salinity maximum near the eddy center, there was a regionally significant concentration of nitrate (>0.9 μmol L-1), and the maximum (2 μmol L-1) was at 150 in depth, below the photic zone. Nitrification within the eddy and/or local upwelling due to the forming eddy could be responsible for this high concentration of nitrate near the eddy center which potentially makes the eddy a relatively productive feature in the Leeuwin Current

Accounting for the foreground contribution to the dust emission towards Kepler's supernova remnant

‘The definitive version is available at www3.interscience.wiley.com '. Copyright Royal Astronomical Society. DOI: 10.1111/j.1365-2966.2009.15061.xWhether or not supernovae contribute significantly to the overall dust budget is a controversial subject. Submillimetre (sub-mm) observations, sensitive to cold dust, have shown an excess at 450 and 850 μm in young remnants Cassiopeia A (Cas A) and Kepler. Some of the sub-mm emission from Cas A has been shown to be contaminated by unrelated material along the line of sight. In this paper, we explore the emission from material towards Kepler using sub-mm continuum imaging and spectroscopic observations of atomic and molecular gas, via H i, 12CO(J= 2–1) and 13CO(J= 2–1). We detect weak CO emission (peak T*A = 0.2–1 K, 1–2 km s−1 full width at half-maximum) from diffuse, optically thin gas at the locations of some of the sub-mm clumps. The contribution to the sub-mm emission from foreground molecular and atomic clouds is negligible. The revised dust mass for Kepler's remnant is 0.1–1.2 M⊙ , about half of the quoted values in the original study by Morgan et al., but still sufficient to explain the origin of dust at high redshifts.Peer reviewe

Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization

An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the lower metal (M1) and the upper metal (M2), and in a simple interconnect tree structure consisting of straight via-to-via line with an extra via in the middle of the line (a "dotted-I"). Multiple failure mechanisms have been observed during electromigration testing of via-to-via Cu interconnects. The failure times of the M2 test structures are significantly longer than that of identical M1 structures. It is proposed that this asymmetry is the result of a difference in the location of void formation and growth, which is believed to be related to the ease of electromigration-induced void nucleation and growth at the Cu/Si₃N₄ interface. However, voids were also detected in the vias instead of in the Cu lines for some cases of early failure of the test lines. These early failures are suspected to be related to the integrity and reliability of the Cu via. Different magnitudes and directions of electrical current were applied independently in two segments of the interconnect tree structure. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigration-resistant overlayer in Cu technology allows smaller voids to cause failure in Cu compared to Al. Moreover, the Si₃N₄ overlayer that serves as an interlevel diffusion barrier provides sites for easy nucleation of voids and also provides a high diffusivity path for electromigration. The results reported here suggest that while segments are not the fundamental reliability unit for circuit-level reliability assessments for Al or Cu, vias, rather than trees, might be the appropriate fundamental units for the assessment of Cu reliability.Singapore-MIT Alliance (SMA

Length Effects on the Reliability of Dual-Damascene Cu Interconnects

The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are âimmortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multiple failure mechanisms. Some long Cu interconnect segments have very large lifetimes, whereas in Al segments, lifetimes decrease continuously with increasing line length. It is postulated that the large lifetimes observed in long Cu lines result from liner rupture at the bottom of the vias, which allows continuous flow of Cu between the two bond pads. As a consequence, the average lifetimes of short lines and long lines can be higher than those of lines with intermediate lengths.Singapore-MIT Alliance (SMA

Doppler cooling of Ca+ ions in a Penning trap

Published versio

Effects of rapid prey evolution on predator-prey cycles

We study the qualitative properties of population cycles in a predator-prey system where genetic variability allows contemporary rapid evolution of the prey. Previous numerical studies have found that prey evolution in response to changing predation risk can have major quantitative and qualitative effects on predator-prey cycles, including: (i) large increases in cycle period, (ii) changes in phase relations (so that predator and prey are cycling exactly out of phase, rather than the classical quarter-period phase lag), and (iii) "cryptic" cycles in which total prey density remains nearly constant while predator density and prey traits cycle. Here we focus on a chemostat model motivated by our experimental system [Fussmann et al. 2000,Yoshida et al. 2003] with algae (prey) and rotifers (predators), in which the prey exhibit rapid evolution in their level of defense against predation. We show that the effects of rapid prey evolution are robust and general, and furthermore that they occur in a specific but biologically relevant region of parameter space: when traits that greatly reduce predation risk are relatively cheap (in terms of reductions in other fitness components), when there is coexistence between the two prey types and the predator, and when the interaction between predators and undefended prey alone would produce cycles. Because defense has been shown to be inexpensive, even cost-free, in a number of systems [Andersson and Levin 1999, Gagneux et al. 2006,Yoshida et al. 2004], our discoveries may well be reproduced in other model systems, and in nature. Finally, some of our key results are extended to a general model in which functional forms for the predation rate and prey birth rate are not specified.Comment: 35 pages, 8 figure

New insights into bacterial chemoreceptor array structure and assembly from electron cryotomography

FWN – Publicaties zonder aanstelling Universiteit Leide

Occupational Communication as Boundary Mechanism

Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/69000/2/10.1177_073088847400100404.pd