Hochstromanwendungen mit Hochtemperatursupraleitern. Technische Leiterentwicklung und Bau von Funktionsmodellen. Arbeitspaket 1: 2223 BPSCCO Bandleiterherstellung und Bau eines Kabelleiter-Funktionsmodells Abschlussbericht

In the materials sector, the work was primarily concerned with production of 2223 BPSCCO multifilament tape conductors, manufactured by the powder-in-tube method. Starting from 1 m lengths, it was possible over the period covered by the report to increase the conductor lengths to as much as 600 m and attain current densities in the superconductor of j_c=21 kA/cm"2, which puts us in a leading position worldwide. The good progress made with the production process was largely due to bringing in Vacuumschmelze Hanau, whose know-how of multifilament production and wire shaping considerably accelerated the bringing out of long lengths of a 55-filament standard conductor for development of the planned cable demonstrators. Current densities of 41 kA/cm"2 have already be demonstrated in short tape lengths (ca. 0.7 m). The use of AgMg enclosure tubes (77 K) made the Bi-tapes considerably easier to handle. Tensile strengths of up to 120 MPa have been achieved and j_c=16 kA/cm"2 (77 K) was measured on the still unoptimized tapes. Rapid progress with the production of tape conductors made it possible to have ready on time the working model of a 10 m cable conductor, which was produced on a 20 m long computer-controlled cabling machine. There are 4 layers of Bi-tapes with a total length of 2 km and a current carrying capacity of 5000 A - 86% of the design value, the 14% reduction being accounted for by the magnetic field effect (7%) and degradation effects in the production process (7%) - based on a field strength criterion of 1 #mu#V/cm. With the aid of a patented cabling scheme, it was possible to attain a uniform current distribution over all layers and devise a low-loss external serving of 0.8 W/m (at 2000 A). This last is essential for economic operation of future high-performance HTSC cables. (orig.)Available from TIB Hannover: F98B1818+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Integrierter optischer Netzschalter mit Faserkopplung Abschlussbericht

The goal of the project is the development of a manufacturing technology for integrated optical devices with passive alignment fibre coupling. The main task is the monolitic integration of the V-grove alignment structures (Silicon micromechanics) together with the waveguides on a single chip. The project demonstrator is a complete module with a 2 x 2 optical switch. Such type of switches are used for line changing and optical cross-connects in telecommunication systems or cross-bar switches in datacommunication. Results: -Si rib-waveguides with an attenuation of 0,1 dB/cm are manufactured. - Monolitic 2 x 2 switches with Si rib-waveguides and MMI elements are produced after extensive modelling of various switching concepts by taking into account the manufacturing tolerances of different processes. - Various processes for the manufacturing of on-chip waveguide endfaces with right angle for the alignment free passive fibre coupling were investigated and an optimised sawing technique is selected. - Devices with passive optical fibre coupling were manufactured but the results will not promise a satisfactory yield in a volume production. -Therefore two alternative concepts with passive alignment in the material system PFCB polymer on silicon were developed and tested. The attenuation of the waveguides with 1300 nm and 1550 nm wavelength is in the order of 0,2 dB/cm. A high quality on-chip fiber coupling with low optical loss is achieved with sawed endfaces. The technique is well suited for volume production because a good reproduction of the results is possible. (orig.)SIGLEAvailable from TIB Hannover: F98B2059+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Fertigungsintegrierte Oberflaechenbehandlung (FIO). Teilvorhaben 1: Cyanidfreies Versilbern und prototypische Realisierung von Beschichtungsreaktoren Abschlussbericht

SIGLEAvailable from TIB Hannover: F00B845+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman

Ball Grid Array Gehaeusetechnologie fuer Multi-Chip-Module Abschlussbericht

Evaluation of organic multilayer MCM-substrate materials of projekt partner STP in terms of dimension stability at thermal and mechanical treatment during assembly processes. Compatibility of organic and metallic substrate surfaces (by STP and atotech) with contact materials for assembly is evaluated. Analysis of surface tension, performance of adhesion test and wirebond test. Definition of suitable materials and topography. Description of the suitable assembly processes diebonding, wirebonding, molding, ball apply and evaluation with special testvehicles. Selection of mold compounds with respect to influence on package dimension stability and optimal processability. Describing the limits of unreinforced dielectrica materials. Evaluation and description of a flexible ball apply equipment for low volume production. Deduction of design rules for manufacturing of substrate. For essential reliability evaluations as well as for the thermal characterization of MCMs (with SMD, Flip chip, and Die- and wirebond chips) special testvehicles are used. The testvehicles have meandering structures at the innerlayers and are mounted with individual testable chips. Pick and place technology of MCM-package and Flip chips to board level is evaluated and the requirements for measuring, recognition and placing are evaluated and defined. Evaluation results of testvehicles lead to general recommendations of suitable materials for manufacturing of substrate and assembly processes of MCM-BGA package. They are completely used for the design of two demonstrators for automotive (BMW) and telecomunication (Blaupunkt). (orig.)SIGLEAvailable from TIB Hannover: F00B616+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman