All-Solution-Processed InGaO 3

We fabricated the crystallized InGaZnO thin films by sol-gel process and high-temperature annealing at 900°C. Prior to the deposition of the InGaZnO, ZnO buffer layers were also coated by sol-gel process, which was followed by thermal annealing. After the synthesis and annealing of the InGaZnO, the InGaZnO thin film on the ZnO buffer layer with preferred orientation showed periodic diffraction patterns in the X-ray diffraction, resulting in a superlattice structure. This film consisted of nanosized grains with two phases of InGaO3(ZnO)1 and InGaO3(ZnO)2 in InGaZnO polycrystal. On the other hand, the use of no ZnO buffer layer and randomly oriented ZnO buffer induced the absence of the InGaZnO crystal related patterns. This indicated that the ZnO buffer with high c-axis preferred orientation reduced the critical temperature for the crystallization of the layered InGaZnO. The InGaZnO thin films formed with nanosized grains of two-phase InGaO3(ZnO)m superlattice showed considerably low thermal conductivity (1.14 Wm−1 K−1 at 325 K) due to the phonon scattering from grain boundaries as well as interfaces in the superlattice grain

Micro-nano hybrid structures with manipulated wettability using a two-step silicon etching on a large area

Nanoscale surface manipulation technique to control the surface roughness and the wettability is a challenging field for performance enhancement in boiling heat transfer. In this study, micro-nano hybrid structures (MNHS) with hierarchical geometries that lead to maximizing of surface area, roughness, and wettability are developed for the boiling applications. MNHS structures consist of micropillars or microcavities along with nanowires having the length to diameter ratio of about 100:1. MNHS is fabricated by a two-step silicon etching process, which are dry etching for micropattern and electroless silicon wet etching for nanowire synthesis. The fabrication process is readily capable of producing MNHS covering a wafer-scale area. By controlling the removal of polymeric passivation layers deposited during silicon dry etching (Bosch process), we can control the geometries for the hierarchical structure with or without the thin hydrophobic barriers that affect surface wettability. MNHS without sidewalls exhibit superhydrophilic behavior with a contact angle under 10°, whereas those with sidewalls preserved by the passivation layer display more hydrophobic characteristics with a contact angle near 60°

Pixel-wise classification in graphene-detection with tree-based machine learning algorithms

Mechanical exfoliation of graphene and its identification by optical inspection is one of the milestones in condensed matter physics that sparked the field of 2D materials. Finding regions of interest from the entire sample space and identification of layer number is a routine task potentially amenable to automatization. We propose supervised pixel-wise classification methods showing a high performance even with a small number of training image datasets that require short computational time without GPU. We introduce four different tree-based machine learning algorithms -- decision tree, random forest, extreme gradient boost, and light gradient boosting machine. We train them with five optical microscopy images of graphene, and evaluate their performances with multiple metrics and indices. We also discuss combinatorial machine learning models between the three single classifiers and assess their performances in identification and reliability. The code developed in this paper is open to the public and will be released at github.com/gjung-group/Graphene_segmentation.Comment: 12 pages, 6 figure

Nano-inspired fluidic interactivity for boiling heat transfer: Impact and criteria

The enhancement of boiling heat transfer, the most powerful energy-transferring technology, will lead to milestones in the development of high-efficiency, next-generation energy systems. Perceiving nano-inspired interface functionalities from their rough morphologies, we demonstrate interface-induced liquid refreshing is essential to improve heat transfer by intrinsically avoiding Leidenfrost phenomenon. High liquid accessibility of hemi-wicking and catalytic nucleation, triggered by the morphological and hydrodynamic peculiarities of nano-inspired interfaces, contribute to the critical heat flux (CHF) and the heat transfer coefficient (HTC). Our experiments show CHF is a function of universal hydrodynamic characteristics involving interfacial liquid accessibility and HTC is improved with a higher probability of smaller nuclei with less superheat. Considering the interface-induced and bulk liquid accessibility at boiling, we discuss functionalizing the interactivity between an interface and a counteracting fluid seeking to create a novel interface, a so-called smart interface, for a breakthrough in boiling and its pragmatic application in energy systems

A Study on the Thermal Characteristics of the Epoxy Insulator in the Stop Joint Box of HTS Power Cable

AbstractThe HTS power cable is cooled by the circulation of liquid nitrogen. The cooling capacity of refrigerator increases with cable length. As the length of power cable increases, a joint box should be installed to reduce the cooling capacity and pressure drop for unit cooling system. The type of joint box can be divided into two groups. There are NJB(Normal Joint Box) and SJB(Stop Joint Box). Generally, SJB can separate each cooling system. In case of long distance DC cable, it is necessary to separate the cooling line in the regular distance of cooling system so SJB should be used. However, SJB, which has a difference from the insulation method of existing joint box, uses solid electrical insulation method. At the primary cooling time, thermal stress is generated by the temperature difference between the internal and external epoxy. So to prevent the damage stress analysis is required for the electrical insulation structure of SJB. In this paper, using the FEM analysis we study the cooling method and optimal shape of SJB to reduce the thermal stress result from temperature difference during the cooling time