Electrochemical and wetting behavior of as-cast Sn-Zn-Sb lead free solders alloys

Ternary alloys SnZn12Sb8, SnZn10Sb10, SnZn8Sb12, SnZn6Sb14, and SnZn2Sb18 were prepared by induction melting. Electrochemical behavior and wetting (contact angle) of prepared as-cast samples were investigated using open circuit potential measurement and sessile drop technique. The results of electrochemical investigation show that open-circuit potential, few seconds after immersing of electrodes, shifts toward more negative values, indicating a relatively smaller rate of dissolution during the spontaneous dissolution process under the curentless conditions. After that period, the values of potential tend to be constant with time. It was found that all investigated alloys have poor wettability on copper substrate and the contact angle values decrease with increasing superheat temperature

Optimization of the aging regime of Al-based alloys

Successful simulation of problems and phenomena related to the changes of the alloys composition is possible by applying simplex plans. The concentration (simplex) triangle application for the design of the optimal regime of Al-5wt%Cu-Pb-Bi alloy aging process is presented in this paper. The iso-lines of the given alloy’s mechanical properties in temperature-aging time coordinates were obtained by applying the mathematical models based of the given aging regimes, and the obtained results of changed properties. Regression polynomial of the fourth degree was used as the mathematical model, whereas the effect of the aging regime has been observed through the changes of tensile strength and contraction. Based on the obtained results, we have come to the conclusion that the simplex lattice method can be successfully applied to a great number of heat treatment aspects when with the increase of the temperature the duration time must be reduced, and vice versa (aging, annealing, homogenizing, etc.)

The microstructure and properties of as-cast Sn-Zn-Bi solder alloys

U radu su prikazani rezultati ispitivanja strukturnih i mehaničkih karakteristika bezolovnih lemnih legura u sistemu kalaj-cink-bizmut. Nakon dobijanja legura u indukcionoj peći sa zaštitnom atmosferom, trostrukim pretapanjem odmerene količine čistih metala, izvršena su ispitivanja strukture tako dobijenih uzoraka legura optičkom i skenirajućom electronskom mikroskopijom (SEM). Energetskom disperzivnom spektroskopijom (EDS) određen je hemijski sastav faza prisutnih u strukturi legura. Izvršena su merenja tvrdoće, i zatezne čvrstoće ispitivanih legura. Sva istraživanja su sprovedena sa ciljem boljeg upoznavanja osobina legura u sistemu Sn-Zn-Bi, koji se smatra odgovarajućom zamenom olovnih lemnih legura.Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu and Sb) to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens' microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders

The microstructure and properties of as-cast Sn-Zn-Bi solder alloys

Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb) to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens’ microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders