An investigation into using laser micro channelling to assist fibre integration via Ultrasonic Consolidation

Ultrasonic Consolidation (UC) is a layer-by-layer metal-based additive manufacturing process. Bonding between two layers is accomplished by energy transmission in form of ultrasonic oscillations inducing localised plastic deformation. The benefit of localised plastic deformation and bonding below melting temperatures has been effectively used for fibre integration. Thus, UC presents a feasible alternative to other metal-manufacturing processes as well as an attractive method for novel engineering materials production such as smart structures.Yet, high volume fibre embedding has been shown to result in delamination of foils and greater porosity at the bonding interfaces due to insufficient plastic flow around the fibres. Furthermore, post-functionality of delicate fibre types was limited. In this study a novel hybrid approach aiming to reduce the necessary plastic flow around fibres and high fibre volume embedding is presented. [Continues.

Exploring the mechanical strength of additively manufactured metal structures with embedded electrical materials

Ultrasonic Additive Manufacturing (UAM) enables the integration of a wide variety of components into solid metal matrices due to the process induced high degree of metal matrix plastic flow at low bulk temperatures. Exploitation of this phenomenon allows the fabrication of previously unobtainable novel engineered metal matrix components. The feasibility of directly embedding electrical materials within UAM metal matrices was investigated in this work. Three different dielectric materials were embedded into UAM fabricated aluminium metal-matrices with, research derived, optimal processing parameters. The effect of the dielectric material hardness on the final metal matrix mechanical strength after UAM processing was investigated systematically via mechanical peel testing and microscopy. It was found that when the Knoop hardness of the dielectric film was increased from 12.1 HK/0.01 kg to 27.3 HK/0.01 kg, the mechanical peel testing and linear weld density of the bond interface were enhanced by 15% and 16%, respectively, at UAM parameters of 1600 N weld force, 25 µm sonotrode amplitude, and 20 mm/s welding speed. This work uniquely identified that the mechanical strength of dielectric containing UAM metal matrices improved with increasing dielectric material hardness. It was therefore concluded that any UAM metal matrix mechanical strength degradation due to dielectric embedding could be restricted by employing a dielectric material with a suitable hardness (larger than 20 HK/0.01 kg). This result is of great interest and a vital step for realising electronic containing multifunctional smart metal composites for future industrial applications

Exploring the mechanical strength of additively manufactured metal structures with embedded electrical materials

Ultrasonic Additive Manufacturing (UAM) enables the integration of a wide variety of components into solid metal matrices due to the process induced high degree of metal matrix plastic flow at low bulk temperatures. Exploitation of this phenomenon allows the fabrication of previously unobtainable novel engineered metal matrix components. The feasibility of directly embedding electrical materials within UAM metal matrices was investigated in this work. Three different dielectric materials were embedded into UAM fabricated aluminium metal-matrices with, research derived, optimal processing parameters. The effect of the dielectric material hardness on the final metal matrix mechanical strength after UAM processing was investigated systematically via mechanical peel testing and microscopy. It was found that when the Knoop hardness of the dielectric film was increased from 12.1 HK/0.01 kg to 27.3 HK/0.01 kg, the mechanical peel testing and linear weld density of the bond interface were enhanced by 15% and 16%, respectively, at UAM parameters of 1600 N weld force, 25 µm sonotrode amplitude, and 20 mm/s welding speed. This work uniquely identified that the mechanical strength of dielectric containing UAM metal matrices improved with increasing dielectric material hardness. It was therefore concluded that any UAM metal matrix mechanical strength degradation due to dielectric embedding could be restricted by employing a dielectric material with a suitable hardness (larger than 20 HK/0.01 kg). This result is of great interest and a vital step for realising electronic containing multifunctional smart metal composites for future industrial applications

Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics

Embedded electronics and sensors are becoming increasingly important for the development of Industry 4.0. For small components, space constraints lead to full 3D integration requirements that are only achievable through Additive Manufacturing. Manufacturing metal components usually require high temperatures incompatible with electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with mechanical properties close to bulk, but with the integration of internal embedded electronics, sensors or optics. This paper describes a novel manufacturing route for embedding electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors and insulators were prepared separately from the UAM process thereby separating the electronics preparation from the part consolidation. A dual material polymer layer exhibited the best electrically insulating properties, while providing mechanical protection of printed conductive tracks stable up to 100 °C. General design and UAM process recommendations are given for 3D embedded electronics in a metal matrix

Multifunctional metal matrix composites with embedded printed electrical materials fabricated by Ultrasonic Additive Manufacturing

This work proposes a new method for the fabrication of Multifunctional Metal Matrix Composite (MMC) structures featuring embedded printed electrical materials through Ultrasonic Additive Manufacturing (UAM). Printed electrical circuitries combining conductive and insulating materials were directly embedded within the interlaminar region of UAM aluminium matrices to realise previously unachievable multifunctional composites. A specific surface flattening process was developed to eliminate the risk of short circuiting between the metal matrices and printed conductors, and simultaneously reduce the total thickness of the printed circuitry. This acted to improve the integrity of the UAM MMC’s and their resultant mechanical strength. The functionality of embedded printed circuitries was examined via four-point probe measurement. DualBeam Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) milling were used to investigate the microstructures of conductive materials to characterize the effect of UAM embedding energy whilst peel testing was used to quantify mechanical strength of MMC structures in combination with optical microscopy. Through this process, fully functioning MMC structures featuring embedded insulating and conductive materials were realised whilst still maintaining high peel resistances of ca. 70 N and linear weld densities of ca. 90%

Enabling dissimilar fibre embedding and explicit fibre layout in ultrasonic consolidation

Ultrasonic Consolidation (UC) is a manufacturing technique based on the ultrasonic metal welding of a sequence of metal foils which are bonded to one another in a layer by layer manner. It combines the ability of additive and subtractive manufacturing techniques to create complex three-dimensional shapes. Due to moderate applied pressures and the relatively low temperatures experienced by a sample during manufacture, UC operates as a solid-state process. UC could potentially enable the fabrication of smart structures via integration of sensor, actuator and reinforcement fibres within a single metal matrix. Previous issues with the optimal placement of fibres directly between foils during UC have been identified. Also, different types of integrated fibres require different UC process conditions and thus present complications when integrating them in combination. To truly exploit the full potential of UC for smart structure capabilities it is envisioned that a high volume fraction of dissimilar fibres are required to be integrated together within a single metal matrix structure. Research on a new method to consolidate fibres securely and more accurately during UC is presented. Channels created prior to UC within metal matrix composites are investigated as a method to aid the embedding of high volume fractions of different fibres in unison without damage. Initial research using a 200 W fibre laser as an enabling tool to create channels of specific geometry onto a previously UC processed surface is detailed. The research verifies that controlled channelling on a UC surface is possible and that channel geometry is dependent on: laser traverse speed, laser beam power, and shroud gas flow rate. © (2010) by the International Conference on Adaptive Structures and Technologies (ICAST)

Laser-machined microchannel effect on microstructure and oxide formation of an ultrasonically processed aluminum alloy

Ultrasonic consolidation (UC) has been proven to be a suitable method for fiber embedment into metal matrices. To aid successful embedment of high fiber volumes and to ensure their accurate positioning, research on producing microchannels in combination with adjacent shoulders formed by distribution of the melt onto unique UC sample surfaces with a fiber laser was carried out. This paper investigated the effect of the laser on the microstructure surrounding the channel within an Al 3003-H18 sample. The heat input and the extent of the heat-affected zone (HAZ) from one and multiple passes was examined. The paper explored the influence of air, as an assist gas, on the shoulders and possible oxide formation with regards to future bonding requirements during UC. The authors found that one laser pass resulted in a keyhole-shaped channel filled with a mixture of aluminum and oxides and a symmetrical HAZ surrounding the channel. Multiple passes resulted in the desired channel shape and a wide HAZ which appeared to be an eutectic microstructure. The distribution of molten material showed oxide formation all along the channel outline and especially within the shoulder

Use of a Holistic Design and Manufacturing Approach to Implement Optimized Additively Manufactured Mould Inserts for the Production of Injection-Moulded Thermoplastics

Injection moulding is one the most familiar processes for manufacturing of plastic parts by injecting molten thermoplastic polymers into a metallic mould. The cycle time of this process consists of the phases of injection, packing, cooling, and ejection of the final product. Shortening of cycle time is a key consideration to increase productivity. Therefore, in this manuscript the adoption of additively manufactured mould inserts with conformal cooling channels by means of selective laser melting (SLM) with the aim to reduce process cycles is presented. The design and manufacture of a mould insert with conformal cooling channels for producing pressure fitting thermoplastic parts is described. Numerical analysis of the injection process and simulation of shape distortions after SLM were conducted providing useful results for the design and manufacture of the mould insert. The results of the numerical analyses are compared with experimental 3D geometrical data of the additively manufactured mould insert. Temperature measurements during the real injection moulding process demonstrating promising findings. The adoption of the introduced method for the series production of injection moulded thermoplastics proves a shortening of cycle times of up to 32% and a final product shape quality improvement of up to 77% when using mould inserts with conformal cooling channels over the conventional mould inserts

Exploring the mechanical performance and material structures of integrated electrical circuits within solid state metal additive manufacturing matrices

Ultrasonic Additive Manufacturing (UAM) enables the integration of a wide variety of components into solid metal matrices due to a high degree of metal plastic flow at low matrix bulk temperatures. This phenomenon allows the fabrication of previously unobtainable novel engineered metal matrix components. The aim of this paper was to investigate the compatibility of electronic materials with UAM, thus exploring an entirely new realm of multifunctional components by integration of electrical structures within dense metal components processed in the solid-state. Three different dielectric materials were successfully embedded into UAM fabricated metal-matrices with, research derived, optimal processing parameters. The effect of dielectric material hardness on the final metal matrix mechanical strength after UAM processing was investigated systematically via mechanical peel testing and microscopy. The research resulted in a quantification of the role of material hardness on final UAM sample mechanical performance, which is of great interest for future industrial applications.Funding: the Engineering and Physical Science Research Council (EPSRC) as part of the Centre for Innovative Manufacturing in Additive Manufacturing</p