2,572 research outputs found
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Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form
An innovative method for rapid prototyping (RP) of electronic circuits with components
characteristic of typical electronics applications was demonstrated using an enhanced version of
a previously developed hybrid stereolithography (SL) and direct write (DW) system, where an
existing SL machine was integrated with a three-axis DW fluid dispensing system for combined
arbitrary form electronic systems manufacturing. This paper presents initial efforts at embedding
functional electronic circuits using the hybrid SL/DW system. A simple temperature-sensitive
circuit was selected, which oscillated an LED at a frequency proportional to the temperature
sensed by the thermistor. The circuit was designed to incorporate all the required electronic
components within a 2.5” x 2” x 0.5” SL part. Electrical interconnects between electronic
components were deposited on the SL part with a DW system using silver conductive ink lines.
Several inks were deposited, cured, and tested on a variety of SL resin substrates, and the E 1660
ink (Ercon Inc, Wareham, MA) was selected due to its measured lowest average resistivity on
the SL substrates. The finished circuit was compared with Printed Circuit Board (PCB)
technology for functionality. The electronic components used here include a low voltage battery,
LM 555 timer chip, resistors, a thermistor, capacitors, and Light Emitting Diodes (LEDs). This
circuit was selected because it (1) represented a simple circuit combining many typically used
electronic components and thus provided a useful demonstration for integrated electronic
systems manufacturing applicable to a wide variety of devices, and (2) provided an indication of
the parasitic resistances and capacitances introduced by the fabrication process due to its
sensitivity to manufacturing variation. The hybrid technology can help achieve significant size
reductions, enable systems integration in atypical forms, a natural resistance to reverse
engineering and possibly increase maximum operating temperatures of electronic circuits as
compared to the traditional PCB process. This research demonstrates the ability of the hybrid
SL/DW technology for fabricating combined electronic systems for unique electronics
applications in which arbitrary form is a requirement and traditional PCB technology cannot be
used.Mechanical Engineerin
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Integration of Direct-Write (DW) and Ultrasonic Consolidation (UC) Technologies to Create Advanced Structures with Embedded Electrical Circuitry
In many instances conductive traces are needed in small, compact and enclosed areas.
However, with traditional manufacturing techniques, embedded electrical traces or antenna
arrays have not been a possibility. By integrating Direct Write and Ultrasonic Consolidation
technologies, electronic circuitry, antennas and other devices can be manufactured directly into a
solid metal structure and subsequently completely enclosed. This can achieve a significant
reduction in mass and volume of a complex electronic system without compromising
performance.Mechanical Engineerin
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Hybrid Manufacturing: Integrating Direct Write and Stereolithography
A commercial stereolithography (SL) machine was modified to integrate fluid dispensing or
direct-write (DW) technology with SL in an integrated manufacturing environment for
automated and efficient hybrid manufacturing of complex electrical devices, combining threedimensional (3D) electrical circuitry with SL-manufactured parts. The modified SL system
operates similarly to a commercially available machine, although build interrupts were used to
stop and start the SL build while depositing fluid using the DW system. An additional linear
encoder was attached to the SL platform z-stage and used to maintain accurate part registration
during the SL and DW build processes. Individual STL files were required as part of the
manufacturing process plan. The DW system employed a three-axis translation mechanism that
was integrated with the commercial SL machine. Registration between the SL part, SL laser and
the DW nozzle was maintained through the use of 0.025-inch diameter cylindrical reference
holes manufactured in the part during SL. After depositing conductive ink using DW, the SL
laser was commanded to trace the profile until the ink was cured. The current system allows for
easy exchange between SL and DW in order to manufacture fully functional 3D electrical
circuits and structures in a semi-automated environment. To demonstrate the manufacturing
capabilities, the hybrid SL/DW setup was used to make a simple multi-layer SL part with
embedded circuitry. This hybrid system is not intended to function as a commercial system, it is
intended for experimental demonstration only. This hybrid SL/DW system has the potential for
manufacturing fully functional electromechanical devices that are more compact, less expensive,
and more reliable than their conventional predecessors, and work is ongoing in order to fully
automate the current system.Mechanical Engineerin
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