Design and tolerance analysis of a 5.7 GHz chip-size microstrip antenna on high resistivity silicon

This paper reports the FEM model, design, fabrication and characterization of a square patch antenna built on high-resistivity silicon (HRS) for operation at 5.7 GHz.Fundação para a Ciência e Tecnologia (FCT

Novel very small dual-band chip-size antenna for wireless sensor networks

We report on the design of a novel, very small dualband antenna having double-folded structure and suitable for onchip integration in wireless sensor network nodes. The antenna operates simultaneously at 2.4 GHz and 5.7 GHz with a -10 dB return-loss bandwidth of 50 MHz and 170 MHz, respectively. A prototype fabricated on a 4003 RogersTM substrate (dielectric permittivity of 3.38) has dimensions of 6x8.5 mm2.Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/ 2001, POCTI/ESE/38468/2001, FEDER)

Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems

We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated.Fundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001

Analysis of chip-size antennas on lossy substrates for short-range wireless micro systems

This paper presents the design and characterization of a patch antenna built on lossy substrates compatible with integrated circuits fabrication. Two different substrates were used for antenna implementation: high-resistivity silicon (HRS) and Corning Pyrex #7740 glass. The antenna prototypes were built to operate close to the 5 GHz ISM band where applications like HIPERLAN and IEEE802.11a are standardized. They operate at a center frequency of 5.705 GHz (HRS) and 5.995 GHz (Pyrex). The studied parameters were: substrate thickness, substrate losses, oxide thickness, metal conductivity and thickness. The antenna on HRS uses an area of 8 mm2, providing a 90 MHz bandwidth and ~0.3 dBi of gain. On a glass substrate, the antenna uses 12 mm2, provides 100 MHz bandwidth and ~3 dBi of gain.Fundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001

Integrated 5.7 GHz chip-size antenna for wireless sensor networks

We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%.Fundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001)

Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations

This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.EU (project Blue Whale IST-2000-30006)Portuguese Foundation for Science and Technology (FEDER, POCTI/ESE/38468/2001 and SFRH/BD/4717/2001

Integrated chip-size antenna for wireless microsystems : fabrication and design considerations

This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented.Fundação para a Ciência e Tecnologia (FCT) - (POCTI/ESE/38468/2001, SFRH/BD/4717/2001), EU (IST-2000-10036)

An integrated folded-patch antenna for wireless microsystems

A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks has been realized and characterized. Overall dimensions of 4x4x1 mm3, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through substrate electrical vias and 3-D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.Fundação para a Ciência e Tecnologia (FCT)(SFRH/BD/4717/2001, POCTI/ ESE/38468/2001, FEDER) and the European Commission (project Blue Whale IST 2000-30006)

Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale IST-2000-10036)

Design of a folded-patch chip-size antenna for short-range communications

We report on design of an integrated folded shorted-patch (FSP) chip-size antenna for operation at 5.7 GHz and use in short-range wireless communications. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows antenna on-chip integration. The operating characteristics of a folded S-P antenna built on two stacked glass substrates were analysed with respect to substrate thickness, middle patch length and substrate sidewall angles. Antenna size reduction down to 4x4x1 mm3, efficiency of 66% and bandwidth of 62 MHz are predicted.Fundação para a Ciência e Tecnologia (FCT), (SFRH/BD/4717/2001 and POCTI/ ESE/38468/2001, FEDER)