28,088 research outputs found
Stress-Induced Delamination Of Through Silicon Via Structures
Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Aerospace Engineerin
Supersymmetric reduced models with a symmetry based on Filippov algebra
Generalizations of the reduced model of super Yang-Mills theory obtained by
replacing the Lie algebra structure to Filippov -algebra structures are
studied. Conditions for the reduced model actions to be supersymmetric are
examined. These models are related with what we call \{cal N}_{min}=2 super
-brane actions.Comment: v3: In the previous versions we overlooked that Eq.(3.9) holds more
generally, and missed some supersymmetric actions. Those are now included and
modifications including a slight change in the title were made accordingly.
1+18 page
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Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias
Continual scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently threedimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effects of thermally induced stresses on interfacial reliability of TSV structures. First, three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results From finite element analysis (FEA). The stress analysis suggests interfacial delamination as a potential failure mechanism for the TSV structure. An analytical solution is then obtained for the steady-state energy release rate as the upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. With these results, the effects of the TSV dimensions (e.g., via diameter and wafer thickness) on the interfacial reliability are elucidated. Furthermore, the effects of via material properties are discussed.Aerospace Engineerin
A size of ~1 AU for the radio source Sgr A* at the centre of the Milky Way
Although it is widely accepted that most galaxies have supermassive black
holes (SMBHs) at their centers^{1-3}, concrete proof has proved elusive.
Sagittarius A* (Sgr A*)^4, an extremely compact radio source at the center of
our Galaxy, is the best candidate for proof^{5-7}, because it is the closest.
Previous Very Long Baseline Interferometry (VLBI) observations (at 7mm) have
detected that Sgr A* is ~2 astronomical unit (AU) in size^8, but this is still
larger than the "shadow" (a remarkably dim inner region encircled by a bright
ring) arising from general relativistic effects near the event horizon^9.
Moreover, the measured size is wavelength dependent^{10}. Here we report a
radio image of Sgr A* at a wavelength of 3.5mm, demonstrating that its size is
\~1 AU. When combined with the lower limit on its mass^{11}, the lower limit on
the mass density is 6.5x10^{21} Msun pc^{-3}, which provides the most stringent
evidence to date that Sgr A* is an SMBH. The power-law relationship between
wavelength and intrinsic size (The size is proportional to wavelength^{1.09}),
explicitly rules out explanations other than those emission models with
stratified structure, which predict a smaller emitting region observed at a
shorter radio wavelength.Comment: 18 pages, 4 figure
Visualizing the meaning of texts
We implemented SmartINFO, an experimental system for the visualization of the meaning of texts. SmartINFO consists of 4 modules: a universal grammar engine (UGE), an anaphora engine, a concept engine and a visualization engine. We discuss two methods of visualizing meanings of text. One approach is a word-centered approach and the other, a clausal-centered approach. © 2005 IEEE
Superconductivity and the high field ordered phase in the heavy fermion compound PrOsSb
Superconductivity is observed in the filled skutterudite compound \PrOsSb{}
below a critical temperature temperature K and appears to
develop out of a nonmagnetic heavy Fermi liquid with an effective mass , where is the free electron mass.
Features associated with a cubic crystalline electric field are present in
magnetic susceptibility, specific heat, electrical resistivity, and inelastic
neutron scattering measurements, yielding a Pr energy level scheme
consisting of a nonmagnetic doublet ground state, a low lying
triplet excitied state at K, and much higher temperature
triplet and singlet excited states. Measurements also
indicate that the superconducting state is unconventional and consists of two
distinct superconducting phases. At high fields and low temperatures, an
ordered phase of magnetic or quadrupolar origin is observed, suggesting that
the superconductivity may occur in the vicinity of a magnetic or quadrupolar
quantum critical point.Comment: 11 pages, 4 figures, presented at the 3rd international symposium on
Advance Science Research (ASR 2002), JAERI Tokai, Ibaraki, Japa
Two--Electron Atoms in Short Intense Laser Pulses
We discuss a method of solving the time dependent Schrodinger equation for
atoms with two active electrons in a strong laser field, which we used in a
previous paper [A. Scrinzi and B. Piraux, Phys. Rev. A 56, R13 (1997)] to
calculate ionization, double excitation and harmonic generation in Helium by
short laser pulses. The method employs complex scaling and an expansion in an
explicitly correlated basis. Convergence of the calculations is documented and
error estimates are provided. The results for Helium at peak intensities up to
10^15 W/cm^2 and wave length 248 nm are accurate to at least 10 %. Similarly
accurate calculations are presented for electron detachment and double
excitation of the negative hydrogen ion.Comment: 14 pages, including figure
String solitons in the M5-brane worldvolume with a Nambu-Poisson structure and Seiberg-Witten map
We analyze BPS equations for string-like configurations derived from the
M5-brane worldvolume action with a Nambu-Poisson structure constructed in
arXiv:0804.3629, arXiv:0805.2898. We solve the BPS equations up to the first
order in the parameter which characterizes the strength of the
Nambu-Poisson bracket. We compare our solutions to previously constructed BPS
string solitons in the conventional description of M5-brane in a constant
three-form background via Seiberg-Witten map, and find agreement.Comment: v2: minor corrections, the title slightly changed. 10 pages. v3: some
clarifying comment
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