Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology

A three-dimensional array of microelectrodes for use in intraneural stimulation and recording is presented. The 128 electrodes are at the tips of silicon needles, which are electrically insulated from each other. The needles in the array have differing heights, resulting in a true three-dimensional electrode structure. The distance between the needles is 120 ¿m, while the heights are 600, 425 and 250 ¿m. An overview of the technology for the realization of the device is given, and the contacting of the array is discussed. The array is connected to a gate array (containing multiplexing electronics, current sources and buffer amplifiers) through controlled collapse chip connection

Development of a solderbump technique for contacting a three-dimensional multi electrode array

The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacin

Strategy for control of muscle force using a 3D multi electrode array in intraneural stimulation

A control algorithm for regulation of the force produced by the rat EDL muscle is presented, using a 128-electrodes intraneural stimulation device. The algorithm is based on force regulation in nature; its task is basically to find a combination of rate coding and recruitment to produce a required force, keeping fatigue minimized. The algorithm was tested in a simulated environment, with satisfactory result

Development of a solder bump technique for contacting a three-dimensional multi electrode array

The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers of connections. Techniques adapted from the literature could successfully be scaled down to be used for 55x55 μm pads at 120 μm heart-to-heart spacing, yielding well-conducting, reasonably strong bonds