11 research outputs found
Schematic of the chemical bonding between the TiO<sup>−</sup> and the silane coupling agent.
<p>Schematic of the chemical bonding between the TiO<sup>−</sup> and the silane coupling agent.</p
FESEM images of two cured samples with different types of adhesion promoter (5.0%) after further annealing in an oven chamber at 300°C for 96 hours.
<p>FESEM images of two cured samples with different types of adhesion promoter (5.0%) after further annealing in an oven chamber at 300°C for 96 hours.</p
Chemical structure of the silane coupling agent.
<p>The R-O structure represents the methoxy or ethoxy functional group. The X- structure represents organic coupling groups such as the epoxy, amino or vinyl group.</p
Figure 1
<p>(a) A printed line pattern on an epoxy molding compound that was printed using silver ink. (b) An FIB cross-sectional view of the thickness of the printed silver layer.</p
Cross-sectional view of the silver film on the epoxy molding compound when no adhesion promoter was used.
<p>Cross-sectional view of the silver film on the epoxy molding compound when no adhesion promoter was used.</p
FESEM images of two cured samples with different types of adhesion promoters (5.0%) after sintering on a hotplate at 180°C for 1 hour.
<p>FESEM images of two cured samples with different types of adhesion promoters (5.0%) after sintering on a hotplate at 180°C for 1 hour.</p
Mass loss versus curing temperature.
<p>After the critical curing temperature was determined, all printed samples were cured using a hotplate at 180°C for 1 hour.</p
The DOE of the silver powder content and the solvent content.
<p>The DOE of the silver powder content and the solvent content.</p
Sample groups containing different weight percentages and types of adhesion promoter.
<p>Sample groups containing different weight percentages and types of adhesion promoter.</p