20 research outputs found
Evaluation of Planar Silicon Pixel Sensors with the RD53A Readout Chip for the Phase-2 Upgrade of the CMS Inner Tracker
The Large Hadron Collider (LHC) at CERN will undergo an upgrade in order to
increase its luminosity to cms. The
increased luminosity during this High-Luminosity running phase (HL-LHC),
starting around 2029, means a higher rate of proton-proton interactions, hence
a larger ionizing dose and particle fluence for the detectors. The current
tracking system of the CMS experiment will be fully replaced in order to cope
with the new operating conditions. Prototype planar pixel sensors for the CMS
Inner Tracker with square m m and rectangular m m pixels read out by the RD53A chip were
characterized in the lab and at the DESY-II testbeam facility in order to
identify designs that meet the requirements of CMS at the HL-LHC. A spatial
resolution of approximately 3.4m (2m) is obtained using the modules
with m m (m m) pixels
at the optimal angle of incidence before irradiation. After irradiation to a 1
MeV neutron equivalent fluence of
cm, a resolution of 9.4m is achieved at a bias voltage of 800 V
using a module with m m pixel size. All modules
retain a hit efficiency in excess of 99\% after irradiation to fluences up to
cm. Further studies of the electrical properties of
the modules, especially crosstalk, are also presented in this paper
Evaluation of HPK - planar pixel sensors for the CMS Phase-2 upgrade
To cope with the challenging environment of the planned high luminosity
upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in
2029, CMS will replace its entire tracking system. The requirements for the
tracker are largely determined by the long operation time of 10 years with an
instantaneous peak luminosity of up to cms in
the ultimate performance scenario. Depending on the radial distance from the
interaction point, the silicon sensors will receive a particle fluence
corresponding to a non-ionizing energy loss of up to cm . This paper focuses on planar pixel sensor design
and qualification up to a fluence of
cm.
For the development of appropriate planar pixel sensors an R\&D program was
initiated, which includes - sensors on 150 mm (6'') wafers with an
active thickness of 150 with pixel sizes of
and manufactured by Hamamatsu. Single chip modules with
ROC4Sens and RD53A readout chips were made. Irradiation with protons and
neutrons, as well was an extensive test beam campaign at DESY were carried out.
This paper presents the investigation of various assemblies mainly with
ROC4Sens readout chips. It demonstrates that multiple designs fulfill the
requirements in terms of breakdown voltage, leakage current and efficiency. The
single point resolution for pixels is measured as 4.0
for non-irradiated samples, and 6.3 after irradiation to
cm
The CMS Phase-1 Pixel Detector Upgrade
The CMS detector at the CERN LHC features a silicon pixel detector as its
innermost subdetector. The original CMS pixel detector has been replaced with
an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end
technical stop of the LHC in 2016/2017. The upgraded CMS pixel detector is
designed to cope with the higher instantaneous luminosities that have been
achieved by the LHC after the upgrades to the accelerator during the first long
shutdown in 2013-2014. Compared to the original pixel detector, the upgraded
detector has a better tracking performance and lower mass with four barrel
layers and three endcap disks on each side to provide hit coverage up to an
absolute value of pseudorapidity of 2.5. This paper describes the design and
construction of the CMS Phase-1 pixel detector as well as its performance from
commissioning to early operation in collision data-taking
Comparative evaluation of analogue front-end designs for the CMS Inner Tracker at the High Luminosity LHC
Publisher Copyright: © 2021 CERN for the benefit of the CMS collaboration..The CMS Inner Tracker, made of silicon pixel modules, will be entirely replaced prior to the start of the High Luminosity LHC period. One of the crucial components of the new Inner Tracker system is the readout chip, being developed by the RD53 Collaboration, and in particular its analogue front-end, which receives the signal from the sensor and digitizes it. Three different analogue front-ends (Synchronous, Linear, and Differential) were designed and implemented in the RD53A demonstrator chip. A dedicated evaluation program was carried out to select the most suitable design to build a radiation tolerant pixel detector able to sustain high particle rates with high efficiency and a small fraction of spurious pixel hits. The test results showed that all three analogue front-ends presented strong points, but also limitations. The Differential front-end demonstrated very low noise, but the threshold tuning became problematic after irradiation. Moreover, a saturation in the preamplifier feedback loop affected the return of the signal to baseline and thus increased the dead time. The Synchronous front-end showed very good timing performance, but also higher noise. For the Linear front-end all of the parameters were within specification, although this design had the largest time walk. This limitation was addressed and mitigated in an improved design. The analysis of the advantages and disadvantages of the three front-ends in the context of the CMS Inner Tracker operation requirements led to the selection of the improved design Linear front-end for integration in the final CMS readout chip.Peer reviewe
Selection of the silicon sensor thickness for the Phase-2 upgrade of the CMS Outer Tracker
Publisher Copyright: © 2021 CERN.During the operation of the CMS experiment at the High-Luminosity LHC the silicon sensors of the Phase-2 Outer Tracker will be exposed to radiation levels that could potentially deteriorate their performance. Previous studies had determined that planar float zone silicon with n-doped strips on a p-doped substrate was preferred over p-doped strips on an n-doped substrate. The last step in evaluating the optimal design for the mass production of about 200 m2 of silicon sensors was to compare sensors of baseline thickness (about 300 μm) to thinned sensors (about 240 μm), which promised several benefits at high radiation levels because of the higher electric fields at the same bias voltage. This study provides a direct comparison of these two thicknesses in terms of sensor characteristics as well as charge collection and hit efficiency for fluences up to 1.5 × 1015 neq/cm2. The measurement results demonstrate that sensors with about 300 μm thickness will ensure excellent tracking performance even at the highest considered fluence levels expected for the Phase-2 Outer Tracker.Peer reviewe
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other. The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system. Results from the first prototype module consisting of a sensor and two SSA chips are presented. The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam.Peer reviewe
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other. The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system. Results from the first prototype module consisting of a sensor and two SSA chips are presented. The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam
The CMS Phase-1 pixel detector upgrade
The CMS detector at the CERN LHC features a silicon pixel detector as its innermost subdetector. The original CMS pixel detector has been replaced with an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end technical stop of the LHC in 2016/2017. The upgraded CMS pixel detector is designed to cope with the higher instantaneous luminosities that have been achieved by the LHC after the upgrades to the accelerator during the first long shutdown in 2013–2014. Compared to the original pixel detector, the upgraded detector has a better tracking performance and lower mass with four barrel layers and three endcap disks on each side to provide hit coverage up to an absolute value of pseudorapidity of 2.5. This paper describes the design and construction of the CMS Phase-1 pixel detector as well as its performance from commissioning to early operation in collision data-taking.Peer reviewe
The DAQ and Control System for the CMS Phase-1 Pixel Detector
In 2017 a new pixel detector was installed in the CMS detector. This so-called Phase-1 pixel detector features four barrel layers in the central region and three disks per end in the forward regions. The upgraded pixel detector requires an upgraded data acquisition (DAQ) system to accept a new data format and larger event sizes. A new DAQ and control system has been developed based on a combination of custom and commercial microTCA parts. Custom mezzanine cards on standard carrier cards provide a front-end driver for readout, and two types of front-end controller for configuration and the distribution of clock and trigger signals. Before the installation of the detector the DAQ system underwent a series of integration tests, including readout of the pilot pixel detector, which was constructed with prototype Phase-1 electronics and operated in CMS from 2015 to 2016, quality assurance of the CMS Phase-1 detector during its assembly, and testing with the CMS Central DAQ. This paper describes the Phase-1 pixel DAQ and control system, along with the integration tests and results. A description of the operational experience and performance in data taking is included
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other.
The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system.
Results from the first prototype module consisting of a sensor and two SSA chips are presented.
The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam.
The obtained performance satisfies CMS requirements