Rheological Characteristics of Municipal Thickened Excess Activated Sludge (TEAS): Impacts of pH, Temperature, Solid Concentration and Polymer Dose

Rheological characterization of sludge is known to be an essential tool to optimize flow, mixing and other process parameters in wastewater treatment plants. This study deals with the characterization of thickened excess activated sludge in comparison to raw primary sludge and excess activated sludge. The effects of key parameters (total solid concentration, temperature, and pH) on the rheology and flow behavior of thickened excess activated sludge were studied. The rheological investigations were carried out for total solid concentration range of 0.9–3.7 %w/w, temperature range of 23–55 °C, and pH range of 3.6–10.0. Different rheological model equations were fitted to the experimental data. The model equations with better fitting were used to calculate the yield stress, apparent, zero-rate, infinite-rate viscosities, flow consistency index, and flow index. The decrease in concentration from 3.7 to 3.1 %w/w resulted in a drastic reduction of yield stress from 27.6 to 11.0 Pa, while a further reduction of yield stress to 1.3 Pa was observed as solid concentration was reduced to 1.3 %w/w. The viscosity at higher shear rate (>600 s−1) decreased from 0.05 Pa·s down to 0.008 Pa·s when the total solid concentration was reduced from 3.7 to 0.9 %. Yield stress decreased from 20.1 Pa down to 8.3 Pa for the Bingham plastic model when the temperature was raised from 25 to 55 °C. Activation energy and viscosity also showed decreasing trends with increasing temperature. Yield stress of thickened excess activated sludge increased from a value of 6.0 Pa to 8.3 Pa when the pH was increased from 3.6 to 10.0. The effect of polymer dose on the rheological behavior of the thickening of excess activated sludge was also investigated, and the optimum polymer dosage for enhanced thickener performance was determined to be 1.3 kg/ton DS

Empirical investigation to explore potential gains from the amalgamation of Phase Changing Materials (PCMs) and wood shavings

The reduction of gained heat, heat peak shifting and the mitigation of air temperature fluctuations are some desirable properties that are sought after in any thermal insulation system. It cannot be overstated that these factors, in addition to others, govern the performance of such systems thus their effect on indoor ambient conditions. The effect of such systems extends also to Heating, Ventilation and Air-conditioning (HVAC) systems that are set up to operate optimally in certain conditions. Where literature shows that PCMs and natural materials such as wood-shavings can provide efficient passive insulation for buildings, it is evident that such approaches utilise methods that are of a degree of intricacy which requires specialist knowledge and complex techniques, such as micro-encapsulation for instance. With technical and economic aspects in mind, an amalgam of PCM and wood-shavings has been created for the purpose of being utilised as a feasible thermal insulation. The amalgamation was performed in the simplest of methods, through submerging the wood shavings in PCM. An experimental procedure was devised to test the thermal performance of the amalgam and compare this to the performance of the same un-amalgamated materials. Comparative analysis revealed that no significant thermal gains would be expected from such amalgamation. However, significant reduction in the total weight of the insulation system would be achieved that, in this case, shown to be up to 20.94%. Thus, further reducing possible strains on structural elements due to the application of insulation on buildings. This can be especially beneficial in vernacular architectural approaches where considerably large amounts and thicknesses of insulations are used. In addition, cost reduction could be attained as wood shavings are significantly cheaper compared to the cost of PCMs

Modeling the structural breakdown of solder paste using the structural kinetic model

Solder paste is the most important strategic bonding material used in the assembly of surface mount devices in electronic industries. It is known to exhibit a thixotropic behavior, which is recognized by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterization of this time-dependent rheological behavior of solder pastes is crucial for establishing the relationships between the pastes structure and flow behavior; and for correlating the physical parameters with paste printing performance. In this article, we present a novel method which has been developed for characterizing the time-dependent and non-Newtonian rheological behavior of solder pastes and flux mediums as a function of shear rates. We also present results of the study of the rheology of the solder pastes and flux mediums using the structural kinetic modeling approach, which postulates that the network structure of solder pastes breaks down irreversibly under shear, leading to time and shear-dependent changes in the flow properties. Our results show that for the solder pastes used in the study, the rate and extent of thixotropy was generally found to increase with increasing shear rate. The technique demonstrated in this study has wide utility for R&D personnel involved in new paste formulation, for implementing quality control procedures used in solder-paste manufacture and packaging; and for qualifying new flip-chip assembly lines