Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

How to Implement an Asynchronous Test Wrapper for Network-on-Chip Nodes

International audienceThe Network-on-Chip (NoC) paradigm is currently known as an alternative solution for the on chip communication in the next SoC generation, especially, asynchronous NoCs. One of the challenges for asynchronous NoC-based systems design is testing asynchronous network architectures for manufacturing defects. To improve the testability of asynchronous NoCs, we have developed a scalable and configurable asynchronous Design-for-Test (DfT) architecture. In this architecture, each asynchronous network node is surrounded by an asynchronous test wrapper and the network communication channels are reused as a high-speed Test Access Mechanism (TAM). This architecture is designed to test all network elements (routers, communication channels), but it can also be used to test computational resources. In this paper, we introduce how to realize and implement the test wrapper in Quasi Delay Insensitive (QDI) asynchronous logic style. The validation and experimental results are also presented

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Efficient Simulation of Structural Faults for the Reliability Evaluation at System-Level

In recent technology nodes, reliability is considered a part of the standard design ¿ow at all levels of embedded system design. While techniques that use only low-level models at gate- and register transfer-level offer high accuracy, they are too inefficient to consider the overall application of the embedded system. Multi-level models with high abstraction are essential to efficiently evaluate the impact of physical defects on the system. This paper provides a methodology that leverages state-of-the-art techniques for efficient fault simulation of structural faults together with transaction-level modeling. This way it is possible to accurately evaluate the impact of the faults on the entire hardware/software system. A case study of a system consisting of hardware and software for image compression and data encryption is presented and the method is compared to a standard gate/RT mixed-level approac

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Test-Delivery Optimization in Manycore SOCs

We present two test-data delivery optimization algorithms for system-on-chip (SOC) designs with hundreds of cores, where a network-on-chip (NOC) is used as the interconnection fabric. We first present an e ective algorithm based on a subsetsum formulation to solve the test-delivery problem in NOCs with arbitrary topology that use dedicated routing. We further propose an algorithm for the important class of NOCs with grid topology and XY routing. The proposed algorithm is the first to co-optimize the number of access points, access-point locations, pin distribution to access points, and assignment of cores to access points for optimal test resource utilization of such NOCs. Testtime minimization is modeled as an NOC partitioning problem and solved with dynamic programming in polynomial time. Both the proposed methods yield high-quality results and are scalable to large SOCs with many cores. We present results on synthetic grid topology NOC-based SOCs constructed using cores from the ITC’02 benchmark, and demonstrate the scalability of our approach for two SOCs of the future, one with nearly 1,000 cores and the other with 1,600 cores. Test scheduling under power constraints is also incorporated in the optimization framework

CRAFT: A library for easier application-level Checkpoint/Restart and Automatic Fault Tolerance

In order to efficiently use the future generations of supercomputers, fault tolerance and power consumption are two of the prime challenges anticipated by the High Performance Computing (HPC) community. Checkpoint/Restart (CR) has been and still is the most widely used technique to deal with hard failures. Application-level CR is the most effective CR technique in terms of overhead efficiency but it takes a lot of implementation effort. This work presents the implementation of our C++ based library CRAFT (Checkpoint-Restart and Automatic Fault Tolerance), which serves two purposes. First, it provides an extendable library that significantly eases the implementation of application-level checkpointing. The most basic and frequently used checkpoint data types are already part of CRAFT and can be directly used out of the box. The library can be easily extended to add more data types. As means of overhead reduction, the library offers a build-in asynchronous checkpointing mechanism and also supports the Scalable Checkpoint/Restart (SCR) library for node level checkpointing. Second, CRAFT provides an easier interface for User-Level Failure Mitigation (ULFM) based dynamic process recovery, which significantly reduces the complexity and effort of failure detection and communication recovery mechanism. By utilizing both functionalities together, applications can write application-level checkpoints and recover dynamically from process failures with very limited programming effort. This work presents the design and use of our library in detail. The associated overheads are thoroughly analyzed using several benchmarks

An IoT Endpoint System-on-Chip for Secure and Energy-Efficient Near-Sensor Analytics

Near-sensor data analytics is a promising direction for IoT endpoints, as it minimizes energy spent on communication and reduces network load - but it also poses security concerns, as valuable data is stored or sent over the network at various stages of the analytics pipeline. Using encryption to protect sensitive data at the boundary of the on-chip analytics engine is a way to address data security issues. To cope with the combined workload of analytics and encryption in a tight power envelope, we propose Fulmine, a System-on-Chip based on a tightly-coupled multi-core cluster augmented with specialized blocks for compute-intensive data processing and encryption functions, supporting software programmability for regular computing tasks. The Fulmine SoC, fabricated in 65nm technology, consumes less than 20mW on average at 0.8V achieving an efficiency of up to 70pJ/B in encryption, 50pJ/px in convolution, or up to 25MIPS/mW in software. As a strong argument for real-life flexible application of our platform, we show experimental results for three secure analytics use cases: secure autonomous aerial surveillance with a state-of-the-art deep CNN consuming 3.16pJ per equivalent RISC op; local CNN-based face detection with secured remote recognition in 5.74pJ/op; and seizure detection with encrypted data collection from EEG within 12.7pJ/op.Comment: 15 pages, 12 figures, accepted for publication to the IEEE Transactions on Circuits and Systems - I: Regular Paper

Reusing IEEE 1687-Compatible Instruments and Sub-Networks over a System Bus

Accessing embedded test and monitoring circuitry (the so-called embedded instruments) in in-field products can reduce maintenance and diagnostics costs. Performing such access can be facilitated when done over an internal system bus, due to that it might be faster and less cumbersome to reach a system processor (on an in-field product) over a network interface, compared with the effort and speed of gaining access to a test interface on the same product. Enabling such access might require that, at the component level, the embedded instruments in a system-on-chip (SoC) become accessible both from a chip interface and from an on-chip processor over a system bus. Although this reuse of embedded instruments can be achieved by already existing standards, such as IEEE 1687, the system bus might become a scalability bottleneck when the number of instruments that are to be reused increases. In this paper, we propose two solutions that address the scalability in this type of reuse while maintaining compatibility with IEEE 1687 tools. We also discuss the trade-offs associated with each approach and present timing analyses that by considering system parameters such as clock rates determine how the correct operation can be guaranteed. To validate the proposed solutions, we have implemented them on an FPGA using AXI as system bus, and have used standard IEEE 1687 tools to access the instruments. We present some details of the implementation to highlight practical issues such as clock domain crossing, as well as how the presented timing analyses can be used to adjust design parameters

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements