Modelling and Test Generation for Crosstalk Faults in DSM Chips

In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the components to be operating at high clock speeds. With the shrinking feature size and ever increasing clock frequencies, the DSM technology has led to a well-known problem of Signal Integrity (SI) more especially in the connecting layout design. The increasing aspect ratios of metal wires and also the ratio of coupling capacitance over substrate capacitance result in electrical coupling of interconnects which leads to crosstalk problems. In this thesis, first the work carried out to model the crosstalk behaviour between aggressor and victim by considering the distributed RLGC parameters of interconnect and the coupling capacitance and mutual conductance between the two nets is presented. The proposed model also considers the RC linear models of the CMOS drivers and receivers. The behaviour of crosstalk in case of under etching problem has been studied and modelled by distributing and approximating the defect behaviour throughout the nets. Next, the proposed model has also been extended to model the behaviour of crosstalk in case of one victim is influenced by several aggressors by considering all aggressors have similar effect (worst-case) on victim. In all the above cases simulation experiments were also carried out and compared with well-known circuit simulation tool PSPICE. It has been proved that the generated crosstalk model is faster and the results generated are within 10% of error margin compared to latter simulation tool. Because of the accuracy and speed of the proposed model, the model is very useful for both SoC designers and test engineers to analyse the crosstalk behaviour. Each manufactured device needs to be tested thoroughly to ensure the functionality before its delivery. The test pattern generation for crosstalk faults is also necessary to test the corresponding crosstalk faults. In this thesis, the well-known PODEM algorithm for stuck-at faults is extended to generate the test patterns for crosstalk faults between single aggressor and single victim. To apply modified PODEM for crosstalk faults, the transition behaviour has been divided into two logic parts as before transition and after transition. After finding individually required test patterns for before transition and after transition, the generated logic vectors are appended to create transition test patterns for crosstalk faults. The developed algorithm is also applied for a few ISCAS 85 benchmark circuits and the fault coverage is found excellent in most circuits. With the incorporation of proposed algorithm into the ATPG tools, the efficiency of testing will be improved by generating the test patterns for crosstalk faults besides for the conventional stuck-at faults. In generating test patterns for crosstalk faults on single victim due to multiple aggressors, the modified PODEM algorithm is found to be more time consuming. The search capability of Genetic Algorithms in finding the required combination of several input factors for any optimized problem fascinated to apply GA for generating test patterns as generating the test pattern is also similar to finding the required vector out of several input transitions. Initially the GA is applied for generating test patterns for stuck-at faults and compared the results with PODEM algorithm. As the fault coverage is almost similar to the deterministic algorithm PODEM, the GA developed for stuck-at faults is extended to find test patterns for crosstalk faults between single aggressor and single victim. The elitist GA is also applied for a few ISCAS 85 benchmark circuits. Later the algorithm is extended to generate test patterns for worst-case crosstalk faults. It has been proved that elitist GA developed in this thesis is also very useful in generating test patterns for crosstalk faults especially for multiple aggressor and single victim crosstalk faults

Estimation and detection of transmission line characteristics in the copper access network

The copper access-network operators face the challenge of developing and maintaining cost-effective digital subscriber line (DSL) services that are competitive to other broadband access technologies. The way forward is dictated by the demand of ever increasing data rates on the twisted-pair copper lines. To meet this demand, a relocation of the DSL transceivers in cabinets closer to the customers are often necessary combined with a joint expansion of the accompanying optical-fiber backhaul network. The equipment of the next generation copper network are therefore becoming more scattered and geographically distributed, which increases the requirements of automated line qualification with fault detection and localization. This scenario is addressed in the first five papers of this dissertation where the focus is on estimation and detection of transmission line characteristics in the copper access network. The developed methods apply model-based optimization with an emphasis on using low-order modeling and a priori information of the given problem. More specifically, in Paper I a low-order and causal cable model is derived based on the Hilbert transform. This model is successfully applied in three contributions of this dissertation. In Paper II, a class of low-complexity unbiased estimators for the frequency-dependent characteristic impedance is presented that uses one-port measurements only. The so obtained characteristic impedance paves the way for enhanced time domain reflectometry (a.k.a. TDR) on twisted-pair lines. In Paper III, the problem of estimating a nonhomogeneous and dispersive transmission line is investigated and a space-frequency optimization approach is developed for the DSL application. The accompanying analysis shows which parameters are of interest to estimate and further suggests the introduction of the concept capacitive length that overcomes the necessity of a priori knowledge of the physical line length. In Paper IV, two methods are developed for detection and localization of load coils present in so-called loaded lines. In Paper V, line topology identification is addressed with varying degree of a priori information. In doing so, a model-based optimization approach is employed that utilizes multi-objective evolutionary computation based on one/two-port measurements. A complement to transceiver relocation that potentially enhances the total data throughput in the copper access network is dynamic spectrum management (DSM). This promising multi-user transmission technique aims at maximizing the transmission rates, and/or minimizing the power consumption, by mitigating or cancelling the dominating crosstalk interference between twisted-pair lines in the same cable binder. Hence the spectral utilization is improved by optimizing the transmit signals in order to minimize the crosstalk interference. However, such techniques rely on accurate information of the (usually) unknown crosstalk channels. This issue is the main focus of Paper VI and VII of this dissertation in which Paper VI deals with estimation of the crosstalk channels between twisted-pair lines. More specifically, an unbiased estimator for the square-magnitude of the crosstalk channels is derived from which a practical procedure is developed that can be implemented with standardized DSL modems already installed in the copper access network. In Paper VII the impact such a non-ideal estimator has on the performance of DSM is analyzed and simulated. Finally, in Paper VIII a novel echo cancellation algorithm for DMT-based DSL modems is presented

High-Speed Delta-Sigma Data Converters for Next-Generation Wireless Communication

In recent years, Continuous-time Delta-Sigma(CT-ΔΣ) analog-to-digital converters (ADCs) have been extensively investigated for their use in wireless receivers to achieve conversion bandwidths greater than 15 MHz and higher resolution of 10 to 14 bits. This dissertation investigates the current state-of-the-art high-speed single-bit and multi-bit Continuous-time Delta-Sigma modulator (CT-ΔΣM) designs and their limitations due to circuit non-idealities in achieving the performance required for next-generation wireless standards. Also, we presented complete architectural and circuit details of a high-speed single-bit and multi-bit CT-ΔΣM operating at a sampling rate of 1.25 GSps and 640 MSps respectively (the highest reported sampling rate in a 0.13 μm CMOS technology node) with measurement results. Further, we propose novel hybrid ΔΣ architecture with two-step quantizer to alleviate the bandwidth and resolution bottlenecks associated with the contemporary CT-ΔΣM topologies. To facilitate the design with the proposed architecture, a robust systematic design method is introduced to determine the loop-filter coefficients by taking into account the non-ideal integrator response, such as the finite opamp gain and the presence of multiple parasitic poles and zeros. Further, comprehensive system-level simulation is presented to analyze the effect of two-step quantizer non-idealities such as the offset and gain error in the sub-ADCs, and the current mismatch between the MSB and LSB elements in the feedback DAC. The proposed novel architecture is demonstrated by designing a high-speed wideband 4th order CT-ΔΣ modulator prototype, employing a two-step quantizer with 5-bits resolution. The proposed modulator takes advantage of the combination of a high-resolution two-step quantization technique and an excess-loop delay (ELD) compensation of more than one clock cycle to achieve lower-power consumption (28 mW), higher dynamic range (\u3e69 dB) with a wide conversion bandwidth (20 MHz), even at a lower sampling rate of 400 MHz. The proposed modulator achieves a Figure of Merit (FoM) of 340 fJ/level

Advanced modelling and design considerations for interconnects in ultra- low power digital system

PhD ThesisAs Very Large Scale Integration (VLSI) is progressing in very Deep submicron (DSM) regime without decreasing chip area, the importance of global interconnects increases but at the cost of performance and power consumption for advanced System-on- Chip (SoC)s. However, the growing complexity of interconnects behaviour presents a challenge for their adequate modelling, whereby conventional circuit theoretic approaches cannot provide sufficient accuracy. During the last decades, fractional differential calculus has been successfully applied to modelling certain classes of dynamical systems while keeping complexity of the models under acceptable bounds. For example, fractional calculus can help capturing inherent physical effects in electrical networks in a compact form, without following conventional assumptions about linearization of non-linear interconnect components. This thesis tackles the problem of interconnect modelling in its generality to simulate a wide range of interconnection configurations, its capacity to emulate irregular circuit elements and its simplicity in the form of responsible approximation. This includes modelling and analysing interconnections considering their irregular components to add more flexibility and freedom for design. The aim is to achieve the simplest adaptable model with the highest possible accuracy. Thus, the proposed model can be used for fast computer simulation of interconnection behaviour. In addition, this thesis proposes a low power circuit for driving a global interconnect at voltages close to the noise level. As a result, the proposed circuit demonstrates a promising solution to address the energy and performance issues related to scaling effects on interconnects along with soft errors that can be caused by neutron particles. The major contributions of this thesis are twofold. Firstly, in order to address Ultra-Low Power (ULP) design limitations, a novel driver scheme has been configured. This scheme uses a bootstrap circuitry which boosts the driver’s ability to drive a long interconnect with an important feedback feature in it. Hence, this approach achieves two objectives: improving performance and mitigating power consumption. Those achievements are essential in designing ULP circuits along with occupying a smaller footprint and being immune to noise, observed in this design as well. These have been verified by comparing the proposed design to the previous and traditional circuits using a simulation tool. Additionally, the boosting based approach has been shown beneficial in mitigating the effects of single event upset (SEU)s, which are known to affect DSM circuits working under low voltages. Secondly, the CMOS circuit driving a distributed RLC load has been brought in its analysis into the fractional order domain. This model will make the on-chip interconnect structure easy to adjust by including the effect of fractional orders on the interconnect timing, which has not been considered before. A second-order model for the transfer functions of the proposed general structure is derived, keeping the complexity associated with second-order models for this class of circuits at a minimum. The approach here attaches an important trait of robustness to the circuit design procedure; namely, by simply adjusting the fractional order we can avoid modifying the circuit components. This can also be used to optimise the estimation of the system’s delay for a broad range of frequencies, particularly at the beginning of the design flow, when computational speed is of paramount importance.Iraqi Ministry of Higher Education and Scientific Researc

HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Fiabilisation de Convertisseurs Analogique-Num´erique a Modulation Sigma-Delta

Due to the continuously scaling down of CMOS technology, system-on-chips (SoCs) reliability becomes important in sub-90 nm CMOS node. Integrated circuits and systems applied to aerospace, avionic, vehicle transport and biomedicine are highly sensitive to reliability problems such as ageing mechanisms and parametric process variations. Novel SoCs with new materials and architectures of high complexity further aggravate reliability as a critical aspect of process integration. For instance, random and systematic defects as well as parametric process variations have a large influence on quality and yield of the manufactured ICs, right after production. During ICs usage time, time-dependent ageing mechanisms such as negative bias temperature instability (NBTI) and hot carrier injection (HCI) can significantly degrade ICs performance.La fiabilit´e des ICs est d´efinie ainsi : la capacit´e d’un circuit ou un syst`eme int´egr´e `amaintenir ses param`etres durant une p´eriode donn´ee sous des conditions d´efinies. Les rapportsITRS 2011 consid`ere la fiabilit´e comme un aspect critique du processus d’int´egration.Par cons´equent, il faut faire appel des m´ethodologies innovatrices prenant en comptela fiabilit´e afin d’assurer la fonctionnalit´e du SoCs et la fiabilit´e dans les technologiesCMOS `a l’´echelle nanom´etrique. Cela nous permettra de d´evelopper des m´ethodologiesind´ependantes du design et de la technologie CMOS, en revanche, sp´ecialis´ees en fiabilit´e

Fiabilisation de convertisseurs analogique-numérique à modulation Sigma-Delta

This thesis concentrates on reliability-aware methodology development, reliability analysis based on simulation as well as failure prediction of CMOS 65nm analog and mixed signal (AMS) ICs. Sigma-Delta modulators are concerned as the object of reliability study at system level. A hierarchical statistical approach for reliability is proposed to analysis the performance of Sigma-Delta modulators under ageing effects and process variations. Statistical methods are combined into this analysis flow.Ce travail de thèse a porté sur des problèmes de fiabilité de circuits intégrés en technologie CMOS 65 nm, en particulier sur la conception en vue de la fiabilité, la simulation et l'amélioration de la fiabilité. Les mécanismes dominants de vieillissement HCI et NBTI ainsi que la variation du processus ont été étudiés et évalués quantitativement au niveau du circuit et au niveau du système. Ces méthodes ont été appliquées aux modulateurs Sigma-Delta afin de déterminer la fiabilité de ce type de composant qui est très utilisé

A 3.125 Gb/s 5-TAP CMOS Transversal Equalizer

Recently, there is growing interest in high speed circuits for broadband communication, especially in wired networks. As the data rate increases beyond 1 GB/s conventional materials used as communication channels such as PCB traces, coaxial cables, and unshielded twisted pair (UTP) cables, etc. attenuate and distort the transmitted signal causing bit errors in the receiver end. Bit errors make the communication less reliable and in many cases even impossible. The goal of this work was to analyze, and design an channel equalizer capable of restoring the received signal back to the original transmitted signal. The equalizer was designed in a standard CMOS 0.18 µm process and it is capable of compensating up to 20 dB’s of attenuation at 1.5625 GHz for 15 and 20 meters of RG-58 A/U coaxial cables. The equalizer is able to remove 0.5 UI ( 160 ps ) of peak-to-peak jitter and output a signal with 0.1 UI ( 32 ps ) for 15 meters of cable at 3.125 Gb/s. The equalizer draws 18 mA from a 1.8 V power supply which is lower than publications [1, 2] for CMOS transversal equalizers

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

MIMO Systems

In recent years, it was realized that the MIMO communication systems seems to be inevitable in accelerated evolution of high data rates applications due to their potential to dramatically increase the spectral efficiency and simultaneously sending individual information to the corresponding users in wireless systems. This book, intends to provide highlights of the current research topics in the field of MIMO system, to offer a snapshot of the recent advances and major issues faced today by the researchers in the MIMO related areas. The book is written by specialists working in universities and research centers all over the world to cover the fundamental principles and main advanced topics on high data rates wireless communications systems over MIMO channels. Moreover, the book has the advantage of providing a collection of applications that are completely independent and self-contained; thus, the interested reader can choose any chapter and skip to another without losing continuity