3,154 research outputs found
On-Chip Transparent Wire Pipelining (invited paper)
Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects
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Back-annotation for interactive data path synthesis
In order to take into account physical design effects, a designer needs a feedback mechanism during interactive data path synthesis. In this paper, we propose a hypergraph model and a back-annotation algorithm which provide a feedback mechanism for back-annotation from physical designs to behavioral descriptions. Given a control data flow graph and its structural design, this back-annotation technique cannot only evaluate the design quality but can also feedback the delay to each edge and node in the graph. Therefore, a designer can identify the critical paths and improve the design. The hypergraph model and the back-annotation algorithm allow us to bridge the gap between the behavioral description and the physical design
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Automatic synthesis of analog layout : a survey
A review of recent research in the automatic synthesis of physical geometry for analog integrated circuits is presented. On introduction, an explanation of the difficulties involved in analog layout as opposed to digital layout is covered. Review of the literature then follows. Emphasis is placed on the exposition of general methods for addressing problems specific to analog layout, with the details of specific systems only being given when they surve to illustrate these methods well. The conclusion discusses problems remaining and offers a prediction as to how technology will evolve to solve them. It is argued that although progress has been and will continue to be made in the automation of analog IC layout, due to fundamental differences in the nature of analog IC design as opposed to digital design, it should not be expected that the level of automation of the former will reach that of the latter any time soon
Circuit design and analysis for on-FPGA communication systems
On-chip communication system has emerged as a prominently important subject in Very-Large-
Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects.
Interconnects often dictates the system performance, and, therefore, research for new
methodologies and system architectures that deliver high-performance communication services
across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable
Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication.
Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable
fabrics, switches and the specific routing architecture also introduce additional latency
and bandwidth degradation further hindering intra-chip communication performance.
Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs.
Communication with programmable interconnect received little attention and is inadequately understood.
This thesis is among the first to research on-chip communication systems that are built on
top of programmable fabrics and proposes methodologies to maximize the interconnect throughput
performance. There are three major contributions in this thesis: (i) an analysis of on-chip
interconnect fringing, which degrades the bandwidth of communication channels due to routing
congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly
improves the interconnect throughput by exploiting the fundamental electrical characteristics
of the reconfigurable interconnect structures. This new scheme can potentially mitigate
the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide
adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime
optimization for route planning and dynamic routing which, effectively utilizes the in-silicon
bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new
methodologies and concepts are proposed to enhance the on-FPGA communication throughput
performance that is of vital importance in new technology processes
Using Physical Compilation to Implement a System on Chip Platform
The goal of this thesis was to setup a complete design flow involving physical synthesis. The design chosen for this purpose was a system-on-chip (SoC) platform developed at the University of Tennessee. It involves a Leon Processor with a minimal cache configuration, an AMBA on-chip bus and an Advanced Encryption Standard module which performs decryption.
As transistor size has entered the deep submicron level, iterations involved in the design cycle have increased due to the domination of interconnect delays over cell delays. Traditionally, interconnect delay has been estimated through the use of wire-load models. However, since there is no physical placement information, the delay estimation may be ineffective and result in increased iterations. Hence, placement-based synthesis has recently been introduced to provide better interconnect delay estimation. The tool used in this thesis to implement the system-on-chip design using physical synthesis is Synopsys Physical Compiler. The flow has been setup through the use of the Galaxy Reference Flow scripts obtained from Synopsys.
As part of the thesis, an analysis of the differences between a physically synthesized design and a logically synthesized one in terms of area and delay is presented
Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits
The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the design of multi-granularity 3D ICs, and to investigate the impact of through-silicon vias (TSVs) on the quality of 3D ICs. This dissertation supports these objectives by addressing six research topics. The first pertains to analytical models that predict the interconnects of multi-granularity 3D ICs, and the second focuses on the development of analytical models of the capacitive coupling of TSVs. The third and the fourth topics present design methodologies and algorithms for the design of gate- and block-level 3D ICs, and the fifth topic pertains to the impact of TSVs on the quality of 3D ICs. The final topic addresses topography variation in 3D ICs.
The first section of this dissertation presents TSV-aware interconnect prediction models for multi-granularity 3D ICs. As previous interconnect prediction models for 3D ICs did not take TSV area into account, they were not capable of predicting many important characteristics of 3D ICs related to TSVs. This section will present several previous interconnect prediction models that have been improved so that the area occupied by TSVs is taken into account. The new models show numerous important predictions such as the existence of the number of TSVs minimizing wirelength.
The second section presents fast estimation of capacitive coupling of TSVs and wires. Since TSV-to-TSV and TSV-to-wire coupling capacitance is dependent on their relative locations, fast estimation of the coupling capacitance of a TSV is essential for the timing optimization of 3D ICs. Simulation results show that the analytical models presented in this section are sufficiently accurate for use at various design steps that require the computation of TSV capacitance.
The third and fourth sections present design methodologies and algorithms for gate- and block-level 3D ICs. One of the biggest differences in the design of 2D and 3D ICs is that the latter requires TSV insertion. Since no widely-accepted design methodology designates when, where, and how TSVs are inserted, this work develops and presents several design methodologies for gate- and block-level 3D ICs and physical design algorithms supporting them. Simulation results based on GDSII-level layouts validate the design methodologies and present evidence of their effectiveness.
The fifth section explores the impact of TSVs on the quality of 3D ICs. As TSVs become smaller, devices are shrinking, too. Since the relative size of TSVs and devices is more critical to the quality of 3D ICs than the absolute size of TSVs and devices, TSVs and devices should be taken into account in the study of the impact of TSVs on the quality of 3D ICs. In this section, current and future TSVs and devices are combined to produce 3D IC layouts and the impact of TSVs on the quality of 3D ICs is investigated.
The final section investigates topography variation in 3D ICs. Since landing pads fabricated in the bottommost metal layer are attached to TSVs, they are larger than TSVs, so they could result in serious topography variation. Therefore, topography variation, especially in the bottommost metal layer, is investigated and two layout optimization techniques are applied to a global placement algorithm that minimizes the topography variation of the bottommost metal layer of 3D ICs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Mukhopadhyay, Saiba
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
To reduce the product development time and achieve first-pass silicon success, fast and accurate estimation of very-large-scale integration (VLSI) interconnect, packaging and 3DI (3D integrated circuits) thermal profiles has become important. Present commercial thermal analysis tools are incapable of handling very complex structures and have integration difficulties with existing design flows. Many analytical thermal models, which could provide fast estimates, are either too specific or oversimplified. This paper highlights a methodology, which exploits electrical resistance solvers for thermal simulation, to allow acquisition of thermal profiles of complex structures with good accuracy and reasonable computation cost. Moreover, a novel accurate closed-form thermal model is developed. The model allows an isotropic or anisotropic equivalent medium to replace the noncritical back-end-of-line (BEOL) regions so that the simulation complexity is dramatically reduced. Using these techniques, this paper introduces the thermal modeling of practical complex VLSI structures to facilitate thermal guideline generation. It also demonstrates the benefits of the proposed anisotropic equivalent medium approximation for real VLSI structures in terms of the accuracy and computational cost. © 2006 IEEE.published_or_final_versio
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