3 research outputs found

    Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

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    Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementary metal oxide semiconductor (CMOS)-based electronic interconnects are not expected to keep up with the envisioned future board-to-board and chip-to-chip (within multi-chip-modules) interconnect requirements because of bandwidth-density and power-consumption limitations. However, low-power and high-speed optics-based interconnects are emerging as alternatives for DC and HPC communications; they offer unique opportunities for continued energy-efficiency and bandwidth-density improvements, although cost is a challenge at the shortest length scales. Plasmonics-based interconnects on the other hand, due to their extremely small size, offer another interesting solution for further scaling operational speed and energy efficiency. At the device-level, CMOS compatibility is also an important issue, since ultimately photonics or plasmonics will have to be co-integrated with electronics. In this paper, we survey the available literature and compare the aforementioned interconnect technologies, with respect to their suitability for high-speed and energy-efficient on-chip and offchip communications. This paper refers to relatively short links with potential applications in the following interconnect distance hierarchy: local group of racks, board to board, module to module, chip to chip, and on chip connections. We compare different interconnect device modules, including low-energy output devices (such as lasers, modulators, and LEDs), photodetectors, passive devices (i.e., waveguides and couplers) and electrical circuitry (such as laserdiode drivers, modulator drivers, transimpedance, and limiting amplifiers). We show that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term. We also present that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future

    `THz Torch' technology: secure thermal infrared wireless communications using engineered blackbody radiation

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    The thermal (emitted) infrared frequency bands, from 20 to 40 THz and 60 to 100 THz, are best known for applications in thermography. This underused and unregulated part of the spectral range offers opportunities for the development of secure communications. The `THz Torch' concept, operating between the THz and mid-infrared ranges, was recently introduced. This technology fundamentally exploits engineered blackbody radiation, by partitioning thermally-generated spectral power into pre-defined frequency channels; the energy in each channel is then independently pulsed modulated to create a robust form of short-range secure communications in the far/mid-infrared. In the thesis, the development of `THz Torch' wireless communications systems will first be introduced. State-of-the-art THz technologies, infrared sources and detectors, as well as near-infrared and visible light communications technologies, will be reviewed in Chapter 2. Basic single-channel architecture of the `THz Torch' technology will be presented in Chapter 3. Fundamental limits for the first single-channel proof-of-concept demonstrator will be discussed, and possible engineering solutions will be proposed and verified experimentally. With such improvements, to date, octave bandwidth (25 to 50 THz) single-channel wireless links have been demonstrated with >2 kbit/s data rate and >10 cm transmission distance. To further increase the overall end-to-end data rate and/or the level of security, multiplexing schemes for `THz Torch' technologies are proposed in Chapter 4. Both frequency division multiplexing (FDM) and frequency-hopping spread-spectrum (FHSS) working demonstrators, operating between 10 and 100 THz spectral range, will be implemented. With such 4-channel multiplexing schemes, measured bit error rates (BERs) of <10−6 have been achieved over a transmission distance of 2.5 cm. Moreover, the integrity of such 4-channel multiplexing system is evaluated by introducing four jamming, interception and channel crosstalk experiments. Chapter 5 gives a detailed power link budget analysis for the 4-channel multiplexing system. The design, simulation and measurement of scalable THz metal mesh filters, which have potential applications for multi-channel `THz Torch' technology, will be presented in Chapter 6. The conclusions and further work are summarised in the last chapter. It is expected that this thermodynamics-based approach represents a new paradigm in the sense that 19th century physics can be exploited with 20th century multiplexing concepts for low cost 21st century ubiquitous security and defence applications in the thermal infrared range.Open Acces

    Topical Workshop on Electronics for Particle Physics

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    The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities
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