Energy and Reliability in Future NOC Interconnected CMPS

In this dissertation, I explore energy and reliability in future NoC (Network-on-Chip) interconnected CMPs (chip multiprocessors) as they have become a first-order constraint in future CMP design. In the first part, we target the root cause of network energy consumption through techniques that reduce link and router-level switching activity. We specifically focus on memory subsystem traffic, as it comprises the bulk of NoC load in a CMP. By transmitting only the flits that contain words that we predicted would be useful using a novel spatial locality predictor, our scheme seeks to reduce network activity. We aim to further lower NoC energy consumption through microarchitectural mechanisms that inhibit datapath switching activity caused by unused words in individual flits. Using simulation-based performance studies and detailed energy models based on synthesized router designs and different link wire types, we show that (a) the pre- diction mechanism achieves very high accuracy, with an average rate of false-unused prediction of just 2.5%; (b) the combined NoC energy savings enabled by the predictor and microarchitectural support are 36% on average and up to 57% in the best case; and (c) there is no system performance penalty as a result of this technique. In the second part, we present a method for dynamic voltage/frequency scaling of networks-on-chip and last level caches in CMP designs, where the shared resources form a single voltage/frequency domain. We develop a new technique for monitoring and control and validate it by running PARSEC benchmarks through full system simulations. These techniques reduce energy-delay product by 46% compared to a state-of-the-art prior work. In the third part, we develop critical path models for HCI- and NBTI-induced wear assuming stress caused under realistic workload conditions, and apply them onto the interconnect microarchitecture. A key finding from this modeling is that, counter to prevailing wisdom, wearout in the CMP on-chip interconnect is correlated with a lack of load observed in the NoC routers, rather than high load. We then develop a novel wearout-decelerating scheme in which routers under low load have their wearout-sensitive components exercised without significantly impacting the router’s cycle time, pipeline depth, and area or power consumption. We subsequently show that the proposed design yields a 13.8∼65× increase in CMP lifetime

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

On Fault Resilient Network-on-Chip for Many Core Systems

Rapid scaling of transistor gate sizes has increased the density of on-chip integration and paved the way for heterogeneous many-core systems-on-chip, significantly improving the speed of on-chip processing. The design of the interconnection network of these complex systems is a challenging one and the network-on-chip (NoC) is now the accepted scalable and bandwidth efficient interconnect for multi-processor systems on-chip (MPSoCs). However, the performance enhancements of technology scaling come at the cost of reliability as on-chip components particularly the network-on-chip become increasingly prone to faults. In this thesis, we focus on approaches to deal with the errors caused by such faults. The results of these approaches are obtained not only via time-consuming cycle-accurate simulations but also by analytical approaches, allowing for faster and accurate evaluations, especially for larger networks. Redundancy is the general approach to deal with faults, the mode of which varies according to the type of fault. For the NoC, there exists a classification of faults into transient, intermittent and permanent faults. Transient faults appear randomly for a few cycles and may be caused by the radiation of particles. Intermittent faults are similar to transient faults, however, differing in the fact that they occur repeatedly at the same location, eventually leading to a permanent fault. Permanent faults by definition are caused by wires and transistors being permanently short or open. Generally, spatial redundancy or the use of redundant components is used for dealing with permanent faults. Temporal redundancy deals with failures by re-execution or by retransmission of data while information redundancy adds redundant information to the data packets allowing for error detection and correction. Temporal and information redundancy methods are useful when dealing with transient and intermittent faults. In this dissertation, we begin with permanent faults in NoC in the form of faulty links and routers. Our approach for spatial redundancy adds redundant links in the diagonal direction to the standard rectangular mesh topology resulting in the hexagonal and octagonal NoCs. In addition to redundant links, adaptive routing must be used to bypass faulty components. We develop novel fault-tolerant deadlock-free adaptive routing algorithms for these topologies based on the turn model without the use of virtual channels. Our results show that the hexagonal and octagonal NoCs can tolerate all 2-router and 3-router faults, respectively, while the mesh has been shown to tolerate all 1-router faults. To simplify the restricted-turn selection process for achieving deadlock freedom, we devised an approach based on the channel dependency matrix instead of the state-of-the-art Duato's method of observing the channel dependency graph for cycles. The approach is general and can be used for the turn selection process for any regular topology. We further use algebraic manipulations of the channel dependency matrix to analytically assess the fault resilience of the adaptive routing algorithms when affected by permanent faults. We present and validate this method for the 2D mesh and hexagonal NoC topologies achieving very high accuracy with a maximum error of 1%. The approach is very general and allows for faster evaluations as compared to the generally used cycle-accurate simulations. In comparison, existing works usually assume a limited number of faults to be able to analytically assess the network reliability. We apply the approach to evaluate the fault resilience of larger NoCs demonstrating the usefulness of the approach especially compared to cycle-accurate simulations. Finally, we concentrate on temporal and information redundancy techniques to deal with transient and intermittent faults in the router resulting in the dropping and hence loss of packets. Temporal redundancy is applied in the form of ARQ and retransmission of lost packets. Information redundancy is applied by the generation and transmission of redundant linear combinations of packets known as random linear network coding. We develop an analytic model for flexible evaluation of these approaches to determine the network performance parameters such as residual error rates and increased network load. The analytic model allows to evaluate larger NoCs and different topologies and to investigate the advantage of network coding compared to uncoded transmissions. We further extend the work with a small insight to the problem of secure communication over the NoC. Assuming large heterogeneous MPSoCs with components from third parties, the communication is subject to active attacks in the form of packet modification and drops in the NoC routers. Devising approaches to resolve these issues, we again formulate analytic models for their flexible and accurate evaluations, with a maximum estimation error of 7%

Tangle: Route-oriented dynamic voltage minimization for variation-afflicted, energy-efficient on-chip networks

On-chip networks are especially vulnerable to within-die pa-rameter variations. Since they connect distant parts of the chip, they need to be designed to work under the most unfavorable parameter values in the chip. This results in energy-inefficient designs. To improve the energy efficiency of on-chip networks, this paper presents a novel approach that relies on monitoring the errors of messages as they traverse the network. Based on the observed errors of messages, the system dynamically decreases or increases the voltage (Vdd) of groups of network routers. With this approach, called Tangle, the differentVdd val-ues applied to different groups of network routers progressively converge to their lowest, variation-aware, error-free values — always keeping the network frequency unchanged. This saves substantial network energy. In a simulated 64-router network with 4 Vdd domains, Tangle reduces the network energy con-sumption by an average of 22 % with negligible performance impact. In a future network design with one Vdd domain per router, Tangle lowers the network Vdd by an average of 21%, reducing the network energy consumption by an average of 28 % with negligible performance impact. 1

Dynamic Lifetime Reliability and Energy Management for Network-on-Chip based Chip Multiprocessors

In this dissertation, we study dynamic reliability management (DRM) and dynamic energy management (DEM) techniques for network-on-chip (NoC) based chip multiprocessors (CMPs). In the first part, the proposed DRM algorithm takes both the computational and the communication components of the CMP into consideration and combines thread migration and dynamic voltage and frequency scaling (DVFS) as the two primary techniques to change the CMP operation. The goal is to increase the lifetime reliability of the overall system to the desired target with minimal performance degradation. The simulation results on a variety of benchmarks on 16 and 64 core NoC based CMP architectures demonstrate that lifetime reliability can be improved by 100% for an average performance penalty of 7.7% and 8.7% for the two CMP architectures. In the second part of this dissertation, we first propose novel algorithms that employ Kalman filtering and long short term memory (LSTM) for workload prediction. These predictions are then used as the basis on which voltage/frequency (V/F) pairs are selected for each core by an effective dynamic voltage and frequency scaling algorithm whose objective is to reduce energy consumption but without degrading performance beyond the user set threshold. Secondly, we investigate the use of deep neural network (DNN) models for energy optimization under performance constraints in CMPs. The proposed algorithm is implemented in three phases. The first phase collects the training data by employing Kalman filtering for workload prediction and an efficient heuristic algorithm based on DVFS. The second phase represents the training process of the DNN model and in the last phase, the DNN model is used to directly identify V/F pairs that can achieve lower energy consumption without performance degradation beyond the acceptable threshold set by the user. Simulation results on 16 and 64 core NoC based architectures demonstrate that the proposed approach can achieve up to 55% energy reduction for 10% performance degradation constraints. Simulation experiments compare the proposed algorithm against existing approaches based on reinforcement learning and Kalman filtering and show that the proposed DNN technique provides average improvements in energy-delay-product (EDP) of 6.3% and 6% for the 16 core architecture and of 7.4% and 5.5% for the 64 core architecture

Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability

The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria

Cross-layer fault tolerance in networks-on-chip

The design of Networks-on-Chip follows the Open Systems Interconnection (OSI) reference model. The OSI model defines strictly separated network abstraction layers and specifies their functionality. Each layer has layer-specific information about the network that can be exclusively accessed by the methods of the layer. Adhering to the strict layer boundaries, however, leads to methods of the individual layers working in isolation from each other. This lack of interaction between methods is disadvantageous for fault diagnosis and fault tolerance in Networks-on-Chip as it results in solutions that have a high effort in terms of the time and implementation costs required to deal with faults. For Networks-on-Chip cross-layer design is considered as a promising method to remedy these shortcomings. It removes the strict layer boundaries by the exchange of information between layers. This interaction enables methods of different layers to cooperate, and thus, deal with faults more efficiently. Furthermore, providing lower layer information to the software allows hardware methods to be implemented as software tasks resulting in a reduction of the hardware complexity. The goal of this dissertation is the investigation of cross-layer design for fault diagnosis and fault tolerance in Networks-on-Chip. For fault diagnosis a scheme is proposed that allows the interaction of protocol-based diagnosis of the transport layer with functional diagnosis of the network layer and structural diagnosis of the physical layer by exchanging diagnostic information. The techniques use this information for optimizing their own diagnosis process. For protocol-based diagnosis on the transport layer, a diagnosis protocol is proposed that is able to locate faulty links, switches, and crossbar connections. For this purpose, the technique utilizes available information of lower layers. As proof of concept for the proposed interaction scheme, the diagnosis protocol is combined with a functional and a structural diagnosis approach and the performance and diagnosis quality of the resulting combinations is investigated. The results show that the combinations of the diagnosis protocol with one of the lower layer techniques have a considerably reduced fault localization latency compared to the functional and the structural standalone techniques. This reduction, however, comes at the expense of a reduced diagnosis quality. In terms of fault tolerance, the focus of this dissertation is on the design and implementation of cross-layer approaches utilizing software methods to provide fault tolerance for network layer routings. Two approaches for different routings are presented. The requirements to provide information of lower layers to the software using the available Network-on-Chip resources and interfaces for data communication are discussed. The concepts of two mechanisms of the data link layer are presented for converting status information into communicable units and for preventing communication resources from being blocked. In the first approach, software-based packet rerouting is proposed. By incorporating information from different layers, this approach provides fault tolerance for deterministic network layer routings. As specialization of software-based rerouting, dimension-order XY rerouting is presented. In the second approach, a reconfigurable routing for Networks-on-Chip with logical hierarchy is proposed in which cross-layer interaction is used to enable hierarchical units to manage themselves autonomously and to reconfigure the routing. Both approaches are evaluated regarding their performance as well as their implementation costs. In a final study, the cross-layer diagnosis technique and cross-layer fault tolerance approaches are combined. The information obtained by the diagnosis technique is used by the fault tolerance approaches for packet rerouting or for routing reconfiguration. The combinations are evaluated regarding their impact on Networks-on-Chip performance. The results show that the crosslayer information exchange with software has a considerable impact on performance when the amount of information becomes too large. In case of crosslayer diagnosis, however, the impact on Networks-on-Chip performance is significantly lower compared to functional and structural diagnosis

Decompose and Conquer: Addressing Evasive Errors in Systems on Chip

Modern computer chips comprise many components, including microprocessor cores, memory modules, on-chip networks, and accelerators. Such system-on-chip (SoC) designs are deployed in a variety of computing devices: from internet-of-things, to smartphones, to personal computers, to data centers. In this dissertation, we discuss evasive errors in SoC designs and how these errors can be addressed efficiently. In particular, we focus on two types of errors: design bugs and permanent faults. Design bugs originate from the limited amount of time allowed for design verification and validation. Thus, they are often found in functional features that are rarely activated. Complete functional verification, which can eliminate design bugs, is extremely time-consuming, thus impractical in modern complex SoC designs. Permanent faults are caused by failures of fragile transistors in nano-scale semiconductor manufacturing processes. Indeed, weak transistors may wear out unexpectedly within the lifespan of the design. Hardware structures that reduce the occurrence of permanent faults incur significant silicon area or performance overheads, thus they are infeasible for most cost-sensitive SoC designs. To tackle and overcome these evasive errors efficiently, we propose to leverage the principle of decomposition to lower the complexity of the software analysis or the hardware structures involved. To this end, we present several decomposition techniques, specific to major SoC components. We first focus on microprocessor cores, by presenting a lightweight bug-masking analysis that decomposes a program into individual instructions to identify if a design bug would be masked by the program's execution. We then move to memory subsystems: there, we offer an efficient memory consistency testing framework to detect buggy memory-ordering behaviors, which decomposes the memory-ordering graph into small components based on incremental differences. We also propose a microarchitectural patching solution for memory subsystem bugs, which augments each core node with a small distributed programmable logic, instead of including a global patching module. In the context of on-chip networks, we propose two routing reconfiguration algorithms that bypass faulty network resources. The first computes short-term routes in a distributed fashion, localized to the fault region. The second decomposes application-aware routing computation into simple routing rules so to quickly find deadlock-free, application-optimized routes in a fault-ridden network. Finally, we consider general accelerator modules in SoC designs. When a system includes many accelerators, there are a variety of interactions among them that must be verified to catch buggy interactions. To this end, we decompose such inter-module communication into basic interaction elements, which can be reassembled into new, interesting tests. Overall, we show that the decomposition of complex software algorithms and hardware structures can significantly reduce overheads: up to three orders of magnitude in the bug-masking analysis and the application-aware routing, approximately 50 times in the routing reconfiguration latency, and 5 times on average in the memory-ordering graph checking. These overhead reductions come with losses in error coverage: 23% undetected bug-masking incidents, 39% non-patchable memory bugs, and occasionally we overlook rare patterns of multiple faults. In this dissertation, we discuss the ideas and their trade-offs, and present future research directions.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147637/1/doowon_1.pd

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems