Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach

The Boston University Photonics Center annual report 2016-2017

This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2016-2017 academic year. The report provides quantitative and descriptive information regarding photonics programs in education, interdisciplinary research, business innovation, and technology development. The Boston University Photonics Center (BUPC) is an interdisciplinary hub for education, research, scholarship, innovation, and technology development associated with practical uses of light.This has undoubtedly been the Photonics Center’s best year since I became Director 10 years ago. In the following pages, you will see highlights of the Center’s activities in the past year, including more than 100 notable scholarly publications in the leading journals in our field, and the attraction of more than 22 million dollars in new research grants/contracts. Last year I had the honor to lead an international search for the first recipient of the Moustakas Endowed Professorship in Optics and Photonics, in collaboration with ECE Department Chair Clem Karl. This professorship honors the Center’s most impactful scholar and one of the Center’s founding visionaries, Professor Theodore Moustakas. We are delighted to haveawarded this professorship to Professor Ji-Xin Cheng, who joined our faculty this year.The past year also marked the launch of Boston University’s Neurophotonics Center, which will be allied closely with the Photonics Center. Leading that Center will be a distinguished new faculty member, Professor David Boas. David and I are together leading a new Neurophotonics NSF Research Traineeship Program that will provide $3M to promote graduate traineeships in this emerging new field. We had a busy summer hosting NSF Sites for Research Experiences for Undergraduates, Research Experiences for Teachers, and the BU Student Satellite Program. As a community, we emphasized the theme of “Optics of Cancer Imaging” at our annual symposium, hosted by Darren Roblyer. We entered a five-year second phase of NSF funding in our Industry/University Collaborative Research Center on Biophotonic Sensors and Systems, which has become the centerpiece of our translational biophotonics program. That I/UCRC continues to focus on advancing the health care and medical device industries

Design, Assembly, and Fabrication of Two-Dimensional Nanomaterials into Functional Biomimetic Device Systems

Diverse functioning biosystems in nature have inspired us and offered unique opportunities in developing novel concepts as well as new class of materials and devices. The design of bioinspired functional materials with tailored properties for actuation, sensing, electronics, and communication has enabled synthetic devices to mimic natural behavior. Among which, artificial muscle and electronic skin that enable to sense and respond to various environmental stimuli in a human-like way have been widely recognized as a significant step toward robotics applications. Polymer materials have previously been dominant in fabricating such functional biomimetic devices owing to their soft nature. However, lacking multifunctionality, handling difficulty, and other setbacks have limited their practical applications. Recently, versatile and high-performance two-dimensional (2D) materials such as graphene and its derivatives have been studied and proven as promising alternatives in this area. In this chapter, we highlight the recent efforts on fabrication and assembly of 2D nanomaterials into functional biomimetic systems. We discuss the structure-function relationships for the development of 2D materials–based biomimetic devices, their tailoring property features, and their variety of applications. We start with a brief introduction of artificial functional biomimetic materials and devices, then summarize some key 2D materials–based systems, including their fabrication, properties, advantages and demonstrations, and finally present concluding remarks and outlook

Body-Borne Computers as Extensions of Self

The opportunities for wearable technologies go well beyond always-available information displays or health sensing devices. The concept of the cyborg introduced by Clynes and Kline, along with works in various fields of research and the arts, offers a vision of what technology integrated with the body can offer. This paper identifies different categories of research aimed at augmenting humans. The paper specifically focuses on three areas of augmentation of the human body and its sensorimotor capabilities: physical morphology, skin display, and somatosensory extension. We discuss how such digital extensions relate to the malleable nature of our self-image. We argue that body-borne devices are no longer simply functional apparatus, but offer a direct interplay with the mind. Finally, we also showcase some of our own projects in this area and shed light on future challenges

ICS Materials

This present book covers a series of outstanding reputation researchers’ contributions on the topic of ICS Materials: a new class of emerging materials with properties and qualities concerning interactivity, connectivity and intelligence. In the general framework of ICS Materials’ domain, each chapter deals with a specific aspect following the characteristic perspective of each researcher. As result, methods, tools, guidelines emerged that are relevant and applicable to several contexts such as product, interaction design, materials science and many more

Wearable high-performance pressure sensors based on three-dimensional electrospun conductive nanofibers

Polymer-based pressure sensors play a key role in realizing lightweight and inexpensive wearable devices for healthcare and environmental monitoring systems. Here, conductive core/shell polymer nanofibers composed of poly (vinylidene fluoride-co-hexafluoropropene) (PVDF-HFP)/poly(3,4-ethylenedioxythiophene) (PEDOT) are fabricated using three-dimensional (3D) electrospinning and vapor deposition polymerization methods, and the resulting sponge-like 3D membranes are used to create piezoresistive-type pressure sensors. Interestingly, the PEDOT shell consists of well-dispersed spherical bumps, leading to the formation of a hierarchical conductive surface that enhances the sensitivity to external pressure. The sponge-like 3D mats exhibit a much higher pressure sensitivity than the conventional electrospun 2D mats due to their enhanced porosity and pressure-tunable contact area. Furthermore, large-area, wireless, 16 x 10 multiarray pressure sensors for the spatiotemporal mapping of multiple pressure points and wearable bands for monitoring blood pressure have been fabricated from these 3D mats. To the best of our knowledge, this is the first report of the fabrication of electrospun 3D membranes with nanoscopically engineered fibers that can detect changes in external pressure with high sensitivity. The developed method opens a new route to the mass production of polymer-based pressure sensors with high mechanical durability, which creates additional possibilities for the development of human-machine interfaces.11Ysciescopu

A historical review of the development of electronic textiles

Textiles have been at the heart of human technological progress for thousands of years, with textile developments closely tied to key inventions that have shaped societies. The relatively recent invention of electronic textiles is set to push boundaries again and has already opened up the potential for garments relevant to defense, sports, medicine, and health monitoring. The aim of this review is to provide an overview of the key innovative pathways in the development of electronic textiles to date using sources available in the public domain regarding electronic textiles (E-textiles); this includes academic literature, commercialized products, and published patents. The literature shows that electronics can be integrated into textiles, where integration is achieved by either attaching the electronics onto the surface of a textile, electronics are added at the textile manufacturing stage, or electronics are incorporated at the yarn stage. Methods of integration can have an influence on the textiles properties such as the drapability of the textile

The 2021 flexible and printed electronics roadmap

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies