4,032 research outputs found
Pipelined analog-to-digital conversion using current-mode reference shifting
Dissertação para obtenção do grau de Mestre em
Engenharia Electrotécnica e de ComputadoresPipeline Analog-to-digital converters (ADCs) are the most popular architecture for high-speed medium-to-high resolution applications. A fundamental, but often unreferenced building block of pipeline ADCs are the reference voltage circuits. They are required to maintain a stable reference with low output impedance to drive large internal switched capacitor loads quickly. Achieving this usually leads to a scheme that consumes a large portion of the overall power and area. A review of the literature shows that the required stable reference can be achieved with either on-chip buffering or with large off-chip decoupling capacitors. On-chip buffering is ideal for system integration but requires a high speed buffer with high power dissipation. The use of a reference with off-chip decoupling results in significant power savings but increases the pads of chip, the count of external components and the overall system cost. Moreover the amount of ringing on the internal reference voltage caused by the series inductance of the package makes this solution not viable for high speed ADCs.
To address this challenge, a pipeline ADC employing a multiplying digital-to-analog converter (MDAC) with current-mode reference shifting is presented. Consequently, no reference voltages and, therefore, no voltage buffers are necessary. The bias currents are generated on-chip by a reference current generator that dissipates low power.
The proposed ADC is designed in a 65 nm CMOS technology and operates at sampling rates ranging from 10 to 80 MS/s. At 40 MS/s the ADC dissipates 10.8 mW from a 1.2 V power supply and achieves an SNDR of 57.2 dB and a THD of -68 dB, corresponding to an ENOB of 9.2 bit. The corresponding figure of merit is 460 fJ/step
On-Chip Noise Sensor for Integrated Circuit Susceptibility Investigations
page number: 12International audienceWith the growing concerns about electromagnetic compatibility of integrated circuits, the need for accurate prediction tools and models to reduce risks of non-compliance becomes critical for circuit designers. However, on-chip characterization of noise is still necessary for model validation and design optimization. Although different on-chip measurement solutions have been proposed for emission issue characterization, no on-chip measurement methods have been proposed to address the susceptibility issues. This paper presents an on-chip noise sensor dedicated to the study of circuit susceptibility to electromagnetic interferences. A demonstration of the sensor measurement performances and benefits is proposed through a study of the susceptibility of a digital core to conducted interferences. Sensor measurements ensure a better characterization of actual coupling of interferences within the circuit and a diagnosis of failure origins
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Efficient, High power Precision RF and mmWave Digital Transmitter Architectures
Digital transmitters offer several advantages over conventional analog transmitters such as reconfigurability, elimination of scaling-unfriendly, power hungry and bulky analog blocks and portability across technology. The rapid advancement of technology in CMOS processes also enables integration of complex digital signal processing circuitry on the same die as the digital transmitter to compensate for their non-idealities. The use of this digital assistance can, for instance, enable the use of highly efficient but nonlinear switching-class power amplifiers by compensating for their severe nonlinearity through digital predistortion. While this shift to digitally intensive transmitter architectures is propelled by the benefits stated above, several pressing challenges arise that vary in their nature depending on the frequency of operation - from RF to mmWave.
Millimeter wave CMOS power amplifiers have traditionally been limited in output power due to the low breakdown voltage of scaled CMOS technologies and poor quality of on-chip passives. Moreover, high data-rates and efficient spectrum utilization demand highly linear power amplifiers with high efficiency under back-off. However, linearity and high efficiency are traditionally at odds with each other in conventional power amplifier design. In this dissertation, digital assistance is used to relax this trade-off and enable the use of state-of-the-art switching class power amplifiers. A novel digital transmitter architecture which simultaneously employs aggressive device-stacking and large-scale power combining for watt-class output power, dynamic load modulation for linearization, and improved efficiency under back-off by supply-switching and load modulation is presented.
At RF frequencies, while the problem of watt-class power amplification has been long solved, more pressing challenges arise from the crowded spectrum in this regime. A major drawback of digital transmitters is the absence of a reconstruction filter after digital-to-analog conversion which causes the baseband quantization noise to get upconverted to RF and amplified at the output of the transmitter. In high power transmitters, this upconverted noise can be so strong as to prevent their use in FDD systems due to receiver desensitization or impose stringent coexistence challenges. In this dissertation, new quantization noise suppression techniques are presented which, for the first time, contribute toward making watt-class fully-integrated digital RF transmitters a viable alternative for FDD and coexistence scenarios. Specifically, the techniques involve embedding a mixed-domain multi-tap FIR filter within highly-efficient watt-class switching power amplifiers to suppress quantization noise, enhancing the bandwidth of noise suppression, enabling tunable location of suppression and overcoming the limitations of purely digital-domain filtering techniques for quantization noise
Load Sensor in An Elastomer Suspension Element
Knowledge of the loading applied to railcar suspension elements is necessary for improved rail safety, efficiency, and for monitoring bearing health. An economical, reliable system for keeping track of both dynamic and static loads on a rail car bearing offers potential for many improvements in rail service. The difficulties of implementing such a system are considerable because the sensor must be in the bearing load path and is thus subject to all the stressors of that environment including high impact, high load, high temperature, and corrosion. This thesis describes an attempt to incorporate a load measurement system in a polyurethane suspension element. It reviews existing technology and describes several experiments using strain gauges, Micro-Electro-Mechanical pressure sensors, and piezo electric materials as load measurement devices
Southwest Research Institute assistance to NASA in biomedical areas of the technology utilization program
The activities are reported of the NASA Biomedical Applications Team at Southwest Research Institute between 25 August, 1972 and 15 November, 1973. The program background and methodology are discussed along with the technology applications, and biomedical community impacts
Novel Current-Mode Sensor Interfacing and Radio Blocks for Cell Culture Monitoring
Since 2004 Imperial College has been developing the world’s first application-specific
instrumentation aiming at the on-line, in-situ, physiochemical monitoring of adult stem
cell cultures. That effort is internationally known as the ‘Intelligent Stem Cell Culture
Systems’ (ISCCS) project. The ISCCS platform is formed by the functional integration
of biosensors, interfacing electronics and bioreactors. Contrary to the PCB-level
ISCCS platform the work presented in this thesis relates to the realization of a miniaturized
cell culture monitoring platform. Specifically, this thesis details the synthesis and
fabrication of pivotal VLSI circuit blocks suitable for the construction of a miniaturized
microelectronic cell monitoring platform. The thesis is composed of two main parts.
The first part details the design and operation of a two-stage current-input currentoutput
topology suitable for three-electrode amperometric sensor measurements. The
first stage is a CMOS-dual rail-class AB-current conveyor providing a low impedancevirtual
ground node for a current input. The second stage is a novel hyperbolic-sinebased
externally-linear internally-non-linear current amplification stage. This stage
bases its operation upon the compressive sinh−1 conversion of the interfaced current
to an intermediate auxiliary voltage and the subsequent sinh expansion of the same
voltage. The proposed novel topology has been simulated for current-gain values ranging
from 10 to 1000 using the parameters of the commercially available 0.8μm AMS
CMOS process. Measured results from a chip fabricated in the same technology are also
reported. The proposed interfacing/amplification architecture consumes 0.88-95μW. The second part describes the design and practical evaluation of a 13.56MHz frequency
shift keying (FSK) short-range (5cm) telemetry link suitable for the monitoring of incubated
cultures. Prior to the design of the full FSK radio system, a pair of 13.56MHz
antennae are characterized experimentally. The experimental S-parameter-value determination
of the 13.56MHz wireless link is incorporated into the Cadence Design
Framework allowing a high fidelity simulation of the reported FSK radio. The transmitter
of the proposed system is a novel multi-tapped seven-stage ring-oscillator-based
VCO whereas the core of the receiver is an appropriately modified phase locked loop
(PLL). Simulated and measured results from a 0.8μm CMOS technology chip are reported
Design Techniques for High Speed Low Voltage and Low Power Non-Calibrated Pipeline Analog to Digital Converters
The profound digitization of modern microelectronic modules made Analog-to-
Digital converters (ADC) key components in many systems. With resolutions up to
14bits and sampling rates in the 100s of MHz, the pipeline ADC is a prime candidate for
a wide range of applications such as instrumentation, communications and consumer
electronics. However, while past work focused on enhancing the performance of the
pipeline ADC from an architectural standpoint, little has been done to individually
address its fundamental building blocks. This work aims to achieve the latter by
proposing design techniques to improve the performance of these blocks with minimal
power consumption in low voltage environments, such that collectively high
performance is achieved in the pipeline ADC.
Towards this goal, a Recycling Folded Cascode (RFC) amplifier is proposed as
an enhancement to the general performance of the conventional folded cascode. Tested
in Taiwan Semiconductor Manufacturing Company (TSMC) 0.18?m Complementary
Metal Oxide Semiconductor (CMOS) technology, the RFC provides twice the
bandwidth, 8-10dB additional gain, more than twice the slew rate and improved noise performance over the conventional folded cascode-all at no additional power or silicon
area. The direct auto-zeroing offset cancellation scheme is optimized for low voltage
environments using a dual level common mode feedback (CMFB) circuit, and amplifier
differential offsets up to 50mV are effectively cancelled. Together with the RFC, the
dual level CMFB was used to implement a sample and hold amplifier driving a singleended
load of 1.4pF and using only 2.6mA; at 200MS/s better than 9bit linearity is
achieved. Finally a power conscious technique is proposed to reduce the kickback noise
of dynamic comparators without resorting to the use of pre-amplifiers. When all
techniques are collectively used to implement a 1Vpp 10bit 160MS/s pipeline ADC in
Semiconductor Manufacturing International Corporation (SMIC) 0.18[mu]m CMOS, 9.2
effective number of bits (ENOB) is achieved with a near Nyquist-rate full scale signal.
The ADC uses an area of 1.1mm2 and consumes 42mW in its analog core. Compared to
recent state-of-the-art implementations in the 100-200MS/s range, the presented pipeline
ADC uses the least power per conversion rated at 0.45pJ/conversion-step
Integrated Circuits for Medical Ultrasound Applications: Imaging and Beyond
Medical ultrasound has become a crucial part of modern society and continues to play a vital role in the diagnosis and treatment of illnesses. Over the past decades, the develop- ment of medical ultrasound has seen extraordinary progress as a result of the tremendous research advances in microelectronics, transducer technology and signal processing algorithms. How- ever, medical ultrasound still faces many challenges including power-efficient driving of transducers, low-noise recording of ultrasound echoes, effective beamforming in a non-linear, high- attenuation medium (human tissues) and reduced overall form factor. This paper provides a comprehensive review of the design of integrated circuits for medical ultrasound applications. The most important and ubiquitous modules in a medical ultrasound system are addressed, i) transducer driving circuit, ii) low- noise amplifier, iii) beamforming circuit and iv) analog-digital converter. Within each ultrasound module, some representative research highlights are described followed by a comparison of the state-of-the-art. This paper concludes with a discussion and recommendations for future research directions
Design and development of a multi-layer memory system Final report, 28 Jan. 1966 - 27 Jan. 1967
Design and development of multilayer memory syste
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