Mechatronic Systems

Mechatronics, the synergistic blend of mechanics, electronics, and computer science, has evolved over the past twenty five years, leading to a novel stage of engineering design. By integrating the best design practices with the most advanced technologies, mechatronics aims at realizing high-quality products, guaranteeing at the same time a substantial reduction of time and costs of manufacturing. Mechatronic systems are manifold and range from machine components, motion generators, and power producing machines to more complex devices, such as robotic systems and transportation vehicles. With its twenty chapters, which collect contributions from many researchers worldwide, this book provides an excellent survey of recent work in the field of mechatronics with applications in various fields, like robotics, medical and assistive technology, human-machine interaction, unmanned vehicles, manufacturing, and education. We would like to thank all the authors who have invested a great deal of time to write such interesting chapters, which we are sure will be valuable to the readers. Chapters 1 to 6 deal with applications of mechatronics for the development of robotic systems. Medical and assistive technologies and human-machine interaction systems are the topic of chapters 7 to 13.Chapters 14 and 15 concern mechatronic systems for autonomous vehicles. Chapters 16-19 deal with mechatronics in manufacturing contexts. Chapter 20 concludes the book, describing a method for the installation of mechatronics education in schools

Technical Design Report for PANDA Electromagnetic Calorimeter (EMC)

This document presents the technical layout and the envisaged performance of the Electromagnetic Calorimeter (EMC) for the PANDA target spectrometer. The EMC has been designed to meet the physics goals of the PANDA experiment. The performance figures are based on extensive prototype tests and radiation hardness studies. The document shows that the EMC is ready for construction up to the front-end electronics interface

Particle detection experiment for Applications Technology Satellite 1 /ATS-1/ Final report

Applications technology satellite particle detection experiment for measuring energy spectra of earth magnetic fiel

Spatial stochastic processes for yield and reliability management with applications to nano electronics

This study uses the spatial features of defects on the wafers to examine the detection and control of process variation in semiconductor fabrication. It applies spatial stochastic process to semiconductor yield modeling and the extrinsic reliabil- ity estimation model. New yield models of integrated circuits based on the spatial point process are established. The defect density which varies according to location on the wafer is modeled by the spatial nonhomogeneous Poisson process. And, in order to capture the variations in defect patterns between wafers, a random coeff- cient model and model-based clustering are applied. Model-based clustering is also applied to the fabrication process control for detecting these defect clusters that are generated by assignable causes. An extrinsic reliability model using defect data and a statistical defect growth model are developed based on the new yield model

Manufacturing Metrology

Metrology is the science of measurement, which can be divided into three overlapping activities: (1) the definition of units of measurement, (2) the realization of units of measurement, and (3) the traceability of measurement units. Manufacturing metrology originally implicates the measurement of components and inputs for a manufacturing process to assure they are within specification requirements. It can also be extended to indicate the performance measurement of manufacturing equipment. This Special Issue covers papers revealing novel measurement methodologies and instrumentations for manufacturing metrology from the conventional industry to the frontier of the advanced hi-tech industry. Twenty-five papers are included in this Special Issue. These published papers can be categorized into four main groups, as follows: Length measurement: covering new designs, from micro/nanogap measurement with laser triangulation sensors and laser interferometers to very-long-distance, newly developed mode-locked femtosecond lasers. Surface profile and form measurements: covering technologies with new confocal sensors and imagine sensors: in situ and on-machine measurements. Angle measurements: these include a new 2D precision level design, a review of angle measurement with mode-locked femtosecond lasers, and multi-axis machine tool squareness measurement. Other laboratory systems: these include a water cooling temperature control system and a computer-aided inspection framework for CMM performance evaluation

Low-power CMOS digital-pixel Imagers for high-speed uncooled PbSe IR applications

This PhD dissertation describes the research and development of a new low-cost medium wavelength infrared MWIR monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapour phase deposition (VPD) PbSe-based medium wavelength IR (MWIR) detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. The work supports on the hypothesis that, by the use of the preceding design techniques, current standard inexpensive CMOS technologies fulfill all operational requirements of the VPD PbSe detector in terms of connectivity, reliability, functionality and scalability to integrate the device. The resulting monolithic PbSe-CMOS camera must consume very low power, operate at kHz frequencies, exhibit good uniformity and fit the CMOS read-out active pixels in the compact pitch of the focal plane, all while addressing the particular characteristics of the MWIR detector: high dark-to-signal ratios, large input parasitic capacitance values and remarkable mismatching in PbSe integration. In order to achieve these demands, this thesis proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation. The main aim is to potentiate the integration of PbSe-based infra-red (IR)-image sensing technologies so as to widen its use, not only in distinct scenarios, but also at different stages of PbSe-CMOS integration maturity. For this purpose, we posit to investigate a comprehensive set of functional blocks distributed in two parallel approaches: • Frame-based “Smart” MWIR imaging based on new DPS circuit topologies with gain and offset FPN correction capabilities. This research line exploits the detector pitch to offer fully-digital programmability at pixel level and complete functionality with input parasitic capacitance compensation and internal frame memory. • Frame-free “Compact”-pitch MWIR vision based on a novel DPS lossless analog integrator and configurable temporal difference, combined with asynchronous communication protocols inside the focal plane. This strategy is conceived to allow extensive pitch compaction and readout speed increase by the suppression of in-pixel digital filtering, and the use of dynamic bandwidth allocation in each pixel of the FPA. In order make the electrical validation of first prototypes independent of the expensive PbSe deposition processes at wafer level, investigation is extended as well to the development of affordable sensor emulation strategies and integrated test platforms specifically oriented to image read-out integrated circuits. DPS cells, imagers and test chips have been fabricated and characterized in standard 0.15μm 1P6M, 0.35μm 2P4M and 2.5μm 2P1M CMOS technologies, all as part of research projects with industrial partnership. The research has led to the first high-speed uncooled frame-based IR quantum imager monolithically fabricated in a standard VLSI CMOS technology, and has given rise to the Tachyon series [1], a new line of commercial IR cameras used in real-time industrial, environmental and transportation control systems. The frame-free architectures investigated in this work represent a firm step forward to push further pixel pitch and system bandwidth up to the limits imposed by the evolving PbSe detector in future generations of the device.La present tesi doctoral descriu la recerca i el desenvolupament d'una nova tecnologia monolítica d'imatgeria infraroja de longitud d'ona mitja (MWIR), no refrigerada i de baix cost, per a usos industrials d'alta velocitat. El treball pren el relleu dels últims avenços assolits pel soci industrial NIT S.L. en el camp dels detectors MWIR de PbSe depositats en fase vapor (VPD), afegint-hi coneixement fonamental en la investigació de noves tècniques de disseny de circuits VLSI analògics i mixtes pel desenvolupament del dispositiu integrat de lectura unit al detector pixelat. Es parteix de la hipòtesi que, mitjançant l'ús de les esmentades tècniques de disseny, les tecnologies CMOS estàndard satisfan tots els requeriments operacionals del detector VPD PbSe respecte a connectivitat, fiabilitat, funcionalitat i escalabilitat per integrar de forma econòmica el dispositiu. La càmera PbSe-CMOS resultant ha de consumir molt baixa potència, operar a freqüències de kHz, exhibir bona uniformitat, i encabir els píxels actius CMOS de lectura en el pitch compacte del pla focal de la imatge, tot atenent a les particulars característiques del detector: altes relacions de corrent d'obscuritat a senyal, elevats valors de capacitat paràsita a l'entrada i dispersions importants en el procés de fabricació. Amb la finalitat de complir amb els requisits previs, es proposen arquitectures de sensors de visió de molt baix acoblament interpíxel basades en l'ús d'una matriu de pla focal (FPA) de píxels actius exclusivament digitals. Cada píxel sensor digital (DPS) està equipat amb mòduls de comunicació d'alta velocitat, autopolarització, cancel·lació de l'offset, conversió analògica-digital (ADC) i correcció del soroll de patró fixe (FPN). El consum en cada cel·la es minimitza fent un ús exhaustiu del MOSFET operant en subllindar. L'objectiu últim és potenciar la integració de les tecnologies de sensat d'imatge infraroja (IR) basades en PbSe per expandir-ne el seu ús, no només a diferents escenaris, sinó també en diferents estadis de maduresa de la integració PbSe-CMOS. En aquest sentit, es proposa investigar un conjunt complet de blocs funcionals distribuïts en dos enfocs paral·lels: - Dispositius d'imatgeria MWIR "Smart" basats en frames utilitzant noves topologies de circuit DPS amb correcció de l'FPN en guany i offset. Aquesta línia de recerca exprimeix el pitch del detector per oferir una programabilitat completament digital a nivell de píxel i plena funcionalitat amb compensació de la capacitat paràsita d'entrada i memòria interna de fotograma. - Dispositius de visió MWIR "Compact"-pitch "frame-free" en base a un novedós esquema d'integració analògica en el DPS i diferenciació temporal configurable, combinats amb protocols de comunicació asíncrons dins del pla focal. Aquesta estratègia es concep per permetre una alta compactació del pitch i un increment de la velocitat de lectura, mitjançant la supressió del filtrat digital intern i l'assignació dinàmica de l'ample de banda a cada píxel de l'FPA. Per tal d'independitzar la validació elèctrica dels primers prototips respecte a costosos processos de deposició del PbSe sensor a nivell d'oblia, la recerca s'amplia també al desenvolupament de noves estratègies d'emulació del detector d'IR i plataformes de test integrades especialment orientades a circuits integrats de lectura d'imatge. Cel·les DPS, dispositius d'imatge i xips de test s'han fabricat i caracteritzat, respectivament, en tecnologies CMOS estàndard 0.15 micres 1P6M, 0.35 micres 2P4M i 2.5 micres 2P1M, tots dins el marc de projectes de recerca amb socis industrials. Aquest treball ha conduït a la fabricació del primer dispositiu quàntic d'imatgeria IR d'alta velocitat, no refrigerat, basat en frames, i monolíticament fabricat en tecnologia VLSI CMOS estàndard, i ha donat lloc a Tachyon, una nova línia de càmeres IR comercials emprades en sistemes de control industrial, mediambiental i de transport en temps real.Postprint (published version

Development Pattern Recognition Model for Classification of Circuit Probe Wafer Maps on Semiconductors

[[abstract]]Circuit probe test is an end of line testing that the individual die has been measured at wafer level in modern semiconductor manufacturing. The test results are visualized as a spatial distribution of the failures on the wafer which can provide some valuable information for the production of failures. In order to reduce time consumption by human operation, a great accuracy of automatic classification system is clear needed for engineering analysis. In this paper, we demonstrate how a robust feature extraction procedure using by classical Hough transform (HT) and circular Hough transform (CHT) can be adapted to detect lines and rounds spatial patterns on circuit probe wafer map. In addition, we also used several technique to detect others spatial patterns. These features which are effectively eliminate the influence of noise to perform pattern classification. The presented methodology is validated with real fabrication data and several data mining classification algorithms are presented to evaluate the advantage of this methodology

TAO Conceptual Design Report: A Precision Measurement of the Reactor Antineutrino Spectrum with Sub-percent Energy Resolution

The Taishan Antineutrino Observatory (TAO, also known as JUNO-TAO) is a satellite experiment of the Jiangmen Underground Neutrino Observatory (JUNO). A ton-level liquid scintillator detector will be placed at about 30 m from a core of the Taishan Nuclear Power Plant. The reactor antineutrino spectrum will be measured with sub-percent energy resolution, to provide a reference spectrum for future reactor neutrino experiments, and to provide a benchmark measurement to test nuclear databases. A spherical acrylic vessel containing 2.8 ton gadolinium-doped liquid scintillator will be viewed by 10 m^2 Silicon Photomultipliers (SiPMs) of >50% photon detection efficiency with almost full coverage. The photoelectron yield is about 4500 per MeV, an order higher than any existing large-scale liquid scintillator detectors. The detector operates at -50 degree C to lower the dark noise of SiPMs to an acceptable level. The detector will measure about 2000 reactor antineutrinos per day, and is designed to be well shielded from cosmogenic backgrounds and ambient radioactivities to have about 10% background-to-signal ratio. The experiment is expected to start operation in 2022

Development of prototype components for the Silicon Tracking System of the CBM experiment at FAIR

Das CBM-Experiment an der zukuenftigen Beschleunigeranlage FAIR wird die Eigenschaften von Kernmaterie unter extremen Bedingungen untersuchen. Das experimentelle Programm unterscheidet sich von den Schwerionen-Experimenten an RHIC (BNL) und LHC (CERN), die Kernmaterie bei hohen Temperaturen erzeugen. Im Gegensatz dazu kann die Untersuchung des QCD-Phasendiagramms, im Bereich der hoechsten Nettobaryonendichten und moderaten Temperaturen, die nur schwach untersucht wurden, mit hoher Praezision durchgefuehrt werden. Hierzu werden Kollisionen der verschiedenen Schwerionenstrahlen, bei Energien von 10-45GeV/Nukleon, mit nuklearem Target gemessen. Das physikalische Programm des CBM Experimentes umfasst die Messung sowohl der seltenen Sonden als auch der Mengenobservablen, die aus verschiedenen Zeitphasen des Zusammenstosses der Kerne stammen. Insbesondere kann der Zerfall von Teilchen mit Charm-Quarks durch Rekonstruktion des Zerfallsvertex, versetzt von dem primaeren Wechselwirkungspunkt um mehrere hundert Mikrometer, registriert werden. Hierzu ist praezises Tracking bei voller Ereignisrekonstruktion, mit bis zu 600 Spuren der geladenen Teilchen pro Ereignis innerhalb der Akzeptanz, noetig. Andere seltene Sonden erfordern den Betrieb bei einer Wechselwirkung von bis zu 10 MHz. Das Detektor-System, dass Tracking durchfuehrt, muss eine hohe Ortsaufloesung, auf der Ebene von 10 um leisten, mit hohen Arbeitsgeschwindigkeiten zu betreiben sein und ebenso ein strahlungstolerantes Design mit geringem Materialbudget besitzen. Das Silicon Tracking System (STS) wurde entwickelt um die Spuren geladener Teilchen in einem Magnetfeld zu rekonstruieren. Das System besteht aus acht Tracking Stationen, die sich in der Oeffnung eines Dipolmagneten mit 1T Feld befinden. Bei Spuren mit Impulsen ueber 1 GeV, betraegt die Impulsaufloesung bei einem solchen System etwa 1%. Um diese Aufgabe erfuellen zu koennen, ist eine sorgfaeltige Optimierung des Detektordesigns erforderlich. Insbesondere muss ein minimales Materialbudget erreicht werden. Die Herstellung eines Detektor-Moduls erfordert Aktivitaeten mit Bezug auf die Modul-Komponenten und deren Integration. Ein Detektor-Modul ist eine grundlegende funktionelle Einheit, die einen Sensor, ein Analogmikrokabel und Front-End-Elektronik umfasst, montiert auf einer Traegerstruktur. Das Ziel der Arbeit ist es, die Qualitaetssicherungstests der Prototyp-Modulkomponenten, zur Bestaetigung des Detektor-Modul-Konzeptes durchzufuehren, und um seinen Betrieb mit radioaktiven Quellen und Teilchenstrahlen zu demonstrieren. Die doppelseitigen Silizium-Mikrostreifendetektoren wurden als Sensortechnik fuer den STS, aufgrund der Kombination einer guten Ortsaufloesung, einer zweidimensionalen Koordinatenmessung mit geringem Materialbudget (0.3%X0), der hohen Auslesegeschwindigkeit und ausreichender Strahlungstoleranz gewaehlt. Mehrere Generationen von doppelseitigen Silizium-Mikrostreifendetektoren wurden zur Erkundung strahlenharter Konstruktionsmerkmale und des Konzepts, eines grossflaechigen Sensors und dessen Kompatibilitaet mit der Leiter-Struktur des Detektor-Moduls, hergestellt. Insbesondere wurden Sensoren mit doppelter Metallschicht auf beiden Seiten und aktivem Bereich von 62x62 mm2 produziert. Die elektrische Charakterisierung der Sensoren wurde durchgefuehrt, um die gesamte Bedienbarkeit sowie die Extrahierung der Geraeteparameter feststellen zu koennen. Strom und Kapazitaets-Spannungs-Charakteristiken sowie Interstreifenparameter wurden gemessen. Das Auslesen der Sensoren wurde mithilfe einer selbstgetriggerten Front-End-Elektronik getaetigt. Ein Front-End-Board wurde auf der Grundlage eines n-XYTER-Auslesechips mit datengesteuerter Architektur entwickelt, der geeignet ist bei Auslesegeschwindigkeit von 32MHz betrieben zu werden. Die Front-End-Platine enthaelt einen externen Analog-zu-Digital-Wandler (ADC). Die Kalibrierung des ADC wurde unter Verwendung von sowohl Roentgenquelle als auch eines Impulsgenerators vorgenommen. Die Schwellenkalibrierung und Untersuchung der Temperaturabhaengigkeit der Chip-Parameter wurden durchgefuehrt. Die ultraleichten Halterungsstrukturen wurden aus Kohlefaser entwickelt, diese haben die Steifigkeit, die Detektor-Module halten, und die minimale Coulomb-Streuung der Teilchenspuren einbeziehen zu koennen. Es wurden Analogmikrokabel mit Aluminiumleiterbahnen auf einem Polyimidsubstrat produziert - eine Kombination von guter elektrischer Verbindung und geringem Materialbudget. Die Mikrokabelstruktur umfasst mehrere Lagen optimiert fuer die niedrige Kapazitaet der Leiterbahnen und den damit verbundenen geraeuscharmen Betrieb. Es wurden Analog-Mikrokabel mit Aluminiumleiterbahnen auf einem Polyimidsubstrat produziert, also eine Kombination von guter elektrischer Verbindung und geringem Materialbudget. Die Mikrokabelstruktur umfasst mehrere Lagen optimiert fuer die niedrige Kapazitaet und den damit verbundenen geraeuscharmen Betrieb. Es wurde ein Demonstrator-Tracking-Teleskop gebaut und in mehreren Strahltests, einschliesslich 2.5 GeV Protonenstrahl an COSY (Juelich), betrieben. Drei Tracking-Stationen wurden mit Hodoskopen ergaenzt. Die Datenanalyse ergab Informationen ueber Analog- und Zeitverhalten sowie Strahlenprofil. So wurden Tracking- und Alignmentinformationen erhalten. Mit speziell entwickelten Monitoring-Tools wurde die Strahlstabilitaet bewertet. Als Ergebnis der Studien, wurde die Leistung der Modulkomponenten bewertet und die Anforderungen zum Detektormodul formuliert. Die genaue Definition des endgueltigen Detektormoduldesigns jedoch, war ausserhalb des Geltungsbereichs dieser Arbeit.The CBM experiment at future accelerator facility FAIR will investigate the properties of nuclear matter under extreme conditions. The experimental programm is different from the heavy-ion experiments at RHIC (BNL) and LHC (CERN) that create nuclear matter at high temperatures. In contrast, the study of the QCD phase diagram in the region of the highest net baryon densities and moderate temperatures that is weakly explored will be performed with high precision. For this, collisions of different heavy-ion beams at the energies of 10–45GeV/nucleon with nuclear target will be measured. The physics programme of the CBM experiment includes measurement of both rare probes and bulk observables that originate from various phases of a nucleus-nucleus collision. In particular, decay of particles with charm quarks can be registered by reconstructing the decay vertex detached from the primary interaction point by several hundreds of micrometers (e.g., decay length c Tau = 123 µm for D0 meson). For this, precise tracking and full event reconstruction with up to 600 charged particle tracks per event within acceptance are required. Other rare probes require operation at interaction rate of up to 10MHz. The detector system that performs tracking has to provide high position resolution on the order of 10 µm, operate at high rates and have radiation tolerant design with low material budget. The Silicon Tracking System (STS) is being designed for charged-particle tracking in a magnetic field. The system consists of eight tracking station located in the aperture of a dipole magnet with 1T field. For tracks with momentum above 1GeV, momentum resolution of such a system is expected to be about 1%. In order to fulfill this task, thorough optimization of the detector design is required. In particular, minimal material budget has to be achieved. Production of a detector module requires research and development activities with respect to the module components and their integration. A detector module is a basic functional unit that includes a sensor, an analogue microcable and frontend electronics mounted on a support structure. The objective of the thesis is to perform quality assurance tests of the prototype module components in order to validate the concept of the detector module and to demonstrate its operation using radioactive sources and particle beams. Double-sided silicon microstrip detectors have been chosen as sensor technology for the STS because of the combination of a good spatial resolution, two-dimensional coordinate measurement achieved within low material budget (0.3%X0), high readout speed and sufficient radiation tolerance. Several generations of double-sided silicon microstrip sensors have been manufactured in order to explore the radiation hard design features and the concept of a large-area sensor compatible with ladder-type structure of the detector module. In particular, sensors with double metal layer on both sides and active area of 62×62mm2 have been produced. Electrical characterization of the sensors has been performed in order to establish the overall operability as well as to extract the device parameters. Current-voltage, capacitance-voltage characteristics and interstrip parameters have been measured. Readout of the sensors has been done using self-triggering front-end electronics. A front-end board has been developed based on the n-XYTER readout chip with data driven architecture and capable of operating at 32MHz readout rate. The front-end board included an external analog-to-digital converter (ADC). Calibration of the ADC has been performed using both 241Am X-ray source and external pulse generator. Threshold calibration and investigation of temperature dependence of chip parameters has been carried out. Low-mass support structures have been developed using carbon fibre that has the rigidity to hold the detector modules and introduce minimal Coulomb scattering of the particle tracks. Analogue microcables have been produced with aluminium traces on a polyimide substrate, thus combining good electrical connection with low material budget. Microcable structure includes several layers optimized for low trace capacitance and thus low-noise performance. A demonstrator tracking telescope has been constructed and operated in several beam tests including 2.5GeV proton beam at COSY synchrotron (Jülich). Three tracking stations have been complemented with several beam hodoscopes. Analysis of the beam data has yielded information on analogue and timing response, beam profile. Tracking and alignment information has been obtained. Beam stability has been evaluated using specially developed monitoring tools. As a result of conducted studies, performance of the module components have been evaluated and requirements to the detector module have been formulated. Practical suggestions have been made with respect to the structure of the detector module, whereas precise definition of the final detector module design was outside of the scope of this thesis

Planck 2013 results X. Energetic particle effects: characterization, removal, and simulation

This paper presents the detection, interpretation and removal of the signal resulting from interactions of high energy particles with the Planck High Frequency Instrument (HFI). These interactions fall into two categories, heating the 0.1 K bolometer plate and glitches in each detector time stream. Glitch shapes are not simple single pole exponential decays and fall into a three families. The glitch shape for each family has been characterized empirically in flight data and removed from the detector time streams. The spectrum of the count rate/unit energy is computed for each family and a correspondence to where on the detector the particle hit is made. Most of the detected glitches are from galactic protons incident on the Si die frame supporting the micromachined bolometric detectors. At HFI, the particle flux is ~ 5 per square cm and per second and is dominated by protons incident on the spacecraft with an energy >39 MeV, leading to a rate of typically one event per second and per detector. Different categories of glitches have different signature in timestreams. Two of the glitch types have a low amplitude component that decays over nearly 1 second. This component produces an excess noise if not properly removed from the time ordered data. We have used a glitch detection and subtraction method based on the joint fit of population templates. The application of this novel glitch removal method removes excess noise from glitches. Using realistic simulations, we find this method does not introduce signal bias.Comment: 23 pages; v2: author list complete