Design of LCOS microdisplay backplanes for projection applications

De evolutie van licht emitterende diodes (LED) heeft ervoor gezorgd dat het op dit moment interessant wordt om deze componenten als lichtbron te gebruiken in projectiesystemen. LED’s hebben belangrijke voordelen vergeleken met klassieke booglampen. Ze zijn compact, ze hebben een veel grotere levensduur en ogenblikkelijke schakeltijden, ze werken op lage spanningen, etc. LED’s zijn smalbandig en kunnen een groterekleurenbereik realiseren. Ze hebben momenteel echter een beperkte helderheid. Naast de lichtbron is het type van de lichtklep ook bepalend voor de kwaliteit van een projectiesysteem. Er bestaan verschillende lichtkleptechnologieën waaronder die van de reflectieve LCOS-panelen. Deze lichtkleppen kunnen zeer hoge resoluties hebben en wordenvaak gebruikt in kwalitatieve, professionele projectiesystemen. LED’s zijn echter totaal verschillend van booglampen. Ze hebben een andere vorm, package, stralingspatroon, aansturing, fysische en thermische eigenschappen, etc. Hoewel er een twintigtal optische architecturen bekend zijn voor reflectieve beeldschermen (met een booglamp als lichtbron), zijn ze niet geschikt voor LED-projectoren en moeten nieuwe optische architecturen en een elektronische aansturing ontwikkeld worden. In dit doctoraat werd er hieromtrent onderzoek gedaan. Er werd uiteindelijk een driekleurenprojector (R, G, B) met een efficiënt LED-belichtingssysteem gebouwd met twee LCOS-lichtkleppen. Deze LEDprojector heeft superieure eigenschappen (zeer lange levensduur, beeldkwaliteit, etc.) en een matige lichtopbrengst

Asynchronous 3D (Async3D): Design Methodology and Analysis of 3D Asynchronous Circuits

This dissertation focuses on the application of 3D integrated circuit (IC) technology on asynchronous logic paradigms, mainly NULL Convention Logic (NCL) and Multi-Threshold NCL (MTNCL). It presents the Async3D tool flow and library for NCL and MTNCL 3D ICs. It also analyzes NCL and MTNCL circuits in 3D IC. Several FIR filter designs were implement in NCL, MTNCL, and synchronous architecture to compare synchronous and asynchronous circuits in 2D and 3D ICs. The designs were normalized based on performance and several metrics were measured for comparison. Area, interconnect length, power consumption, and power density were compared among NCL, MTNCL, and synchronous designs. The NCL and MTNCL designs showed improvements in all metrics when moving from 2D to 3D. The 3D NCL and MTNCL designs also showed a balanced power distribution in post-layout analysis. This could alleviate the hotspot problem prevalently found in most 3D ICs. NCL and MTNCL have the potential to synergize well with 3D IC technology

Developing Trustworthy Hardware with Security-Driven Design and Verification

Over the past several decades, computing hardware has evolved to become smaller, yet more performant and energy-efficient. Unfortunately these advancements have come at a cost of increased complexity, both physically and functionally. Physically, the nanometer-scale transistors used to construct Integrated Circuits (ICs), have become astronomically expensive to fabricate. Functionally, ICs have become increasingly dense and feature rich to optimize application-specific tasks. To cope with these trends, IC designers outsource both fabrication and portions of Register-Transfer Level (RTL) design. Outsourcing, combined with the increased complexity of modern ICs, presents a security risk: we must trust our ICs have been designed and fabricated to specification, i.e., they do not contain any hardware Trojans. Working in a bottom-up fashion, I initially study the threat of outsourcing fabrication. While prior work demonstrates fabrication-time attacks (modifications) on IC layouts, it is unclear what makes a layout vulnerable to attack. To answer this, in my IC Attack Surface (ICAS) work, I develop a framework that quantifies the security of IC layouts. Using ICAS, I show that modern ICs leave a plethora of both placement and routing resources available for attackers to exploit. Next, to plug these gaps, I construct the first routing-centric defense (T-TER) against fabrication-time Trojans. T-TER wraps security-critical interconnects in IC layouts with tamper-evident guard wires to prevent foundry-side attackers from modifying a design. After hardening layouts against fabrication-time attacks, outsourced designs become the most critical threat. To address this, I develop a dynamic verification technique (Bomberman) to vet untrusted third-party RTL hardware for Ticking Timebomb Trojans (TTTs). By targeting a specific type of Trojan behavior, Bomberman does not suffer from false negatives (missed TTTs), and therefore systematically reduces the overall design-time attack surface. Lastly, to generalize the Bomberman approach to automatically discover other behaviorally-defined classes of malicious logic, I adapt coverage-guided software fuzzers to the RTL verification domain. Leveraging software fuzzers for RTL verification enables IC design engineers to optimize test coverage of third-party designs without intimate implementation knowledge. Overall, this dissertation aims to make security a first-class design objective, alongside power, performance, and area, throughout the hardware development process.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/169761/1/trippel_1.pd

ポータビリティを意識したCMOSミックスドシグナルVLSI回路設計手法に関する研究

本研究は、半導体上に集積されたアナログ・ディジタル・メモリ回路から構成されるミクストシグナルシステムを別の製造プロセスへ移行することをポーティングとして定義し、効率的なポーティングを行うための設計方式と自動回路合成アルゴリズムを提案し、いくつかの典型的な回路に対する設計事例を示し、提案手法の妥当性を立証している。北九州市立大

Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations

Verifying the absence of maliciously inserted Trojans in ICs is a crucial task – especially for security-enabled products. Depending on the concrete threat model, different techniques can be applied for this purpose. Assuming that the original IC layout is benign and free of backdoors, the primary security threats are usually identified as the outsourced manufacturing and transportation. To ensure the absence of Trojans in commissioned chips, one straightforward solution is to compare the received semiconductor devices to the design files that were initially submitted to the foundry. Clearly, conducting such a comparison requires advanced laboratory equipment and qualified experts. Nevertheless, the fundamental techniques to detect Trojans which require evident changes to the silicon layout are nowadays well-understood. Despite this, there is a glaring lack of public case studies describing the process in its entirety while making the underlying datasets publicly available. In this work, we aim to improve upon this state of the art by presenting a public and open hardware Trojan detection case study based on four different digital ICs using a Red Team vs. Blue Team approach. Hereby, the Red Team creates small changes acting as surrogates for inserted Trojans in the layouts of 90 nm, 65 nm, 40 nm, and 28 nm ICs. The quest of the Blue Team is to detect all differences between digital layout and manufactured device by means of a GDSII–vs–SEM-image comparison. Can the Blue Team perform this task efficiently? Our results spark optimism for the Trojan seekers and answer common questions about the efficiency of such techniques for relevant IC sizes. Further, they allow to draw conclusions about the impact of technology scaling on the detection performance

Lithography parametric yield estimation model to predict layout pattern distortions with a reduced set of lithography simulations

A lithography parametric yield estimation model is presented to evaluate the lithography distortion in a printed layout due to lithography hotspots. The aim of the proposed yield model is to provide a new metric that enables the possibility to objectively compare the lithography quality of different layout design implementations. Moreover, we propose a pattern construct classifier to reduce the set of lithography simulations necessary to estimate the litho degradation. The application of the yield model is demonstrated for different layout configurations showing that a certain degree of layout regularity improves the parametric yield and increases the number of good dies per wafer. (C) 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)Peer ReviewedPostprint (author’s final draft