Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Fault-tolerant vertical link design for effective 3D stacking

[EN] Recently, 3D stacking has been proposed to alleviate the memory bandwidth limitation arising in chip multiprocessors (CMPs). As the number of integrated cores in the chip increases the access to external memory becomes the bottleneck, thus demanding larger memory amounts inside the chip. The most accepted solution to implement vertical links between stacked dies is by using Through Silicon Vias (TSVs). However, TSVs are exposed to misalignment and random defects compromising the yield of the manufactured 3D chip. A common solution to this problem is by over-provisioning, thus impacting on area and cost. In this paper, we propose a fault-tolerant vertical link design. With its adoption, fault-tolerant vertical links can be implemented in a 3D chip design at low cost without the need of adding redundant TSVs (no over-provision). Preliminary results are very promising as the fault-tolerant vertical link design increases switch area only by 6.69% while the achieved interconnect yield tends to 100%.This work was supported by the Spanish MEC and MICINN, as well as European Comission FEDER funds, under Grants CSD2006-00046 and TIN2009-14475-C04. It was also partly supported by the project NaNoC (project label 248972) which is funded by the European Commission within the Research Programme FP7.Hernández Luz, C.; Roca Pérez, A.; Flich Cardo, J.; Silla Jiménez, F.; Duato Marín, JF. (2011). Fault-tolerant vertical link design for effective 3D stacking. IEEE Computer Architecture Letters. 10(2):41-44. https://doi.org/10.1109/L-CA.2011.17S414410

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

FAXY: Fault Aware Routing Algorithm Based on XY Algorithm for Network on Chip

The performance of Network-on-Chip (NoC) largely depends on the underlying routing techniques. In this paper we present and evaluate a Fault aware routing algorithm scheme called FAXY based on XY routing algorithm. The simulation results show the effectiveness of FAXY by comparing it with XY routing schemes under different traffic patterns. Simulation results depict that the proposed routing algorithm is able to route packet even in the case of faulty links or switches in the NoC. Moreover, simulation results demonstrate the advantage of FAXY routing algorithm in terms of average packet latency, packet loss rate compared with XY routing algorithm in the presence of permanent faults. For the proposed algorithm, it can get much less average packet latency (10%) and lead to less than average 15% packet loss rate

Reconfigurable High Performance Secured NoC Design Using Hierarchical Agent-based Monitoring System

With the rapid increase in demand for high performance computing, there is also a significant growth of data communication that leads to leverage the significance of network on chip. This paper proposes a reconfigurable fault tolerant on chip architecture with hierarchical agent based monitoring system for enhancing the performance of network based multiprocessor system on chip against faulty links and nodes. These distributed agents provide healthy status and congestion information of the network. This status information is used for further packet routing in the network with the help of XY routing algorithm. The functionality of Agent is enhanced not only to work as information provider but also to take decision for packet to either pass or stop to the processing element by setting the firewall in order to provide security. Proposed design provides a better performance and area optimization by avoiding deadlock and live lock as compared to existing approaches over network design

Fault-Tolerant Application-Specific Topology based NoC and its Prototype on an FPGA

Application-Specific Networks-on-Chips (ASNoCs) are suitable communication platforms for meeting current application requirements. Interconnection links are the primary components involved in communication between the cores of an ASNoC design. The integration density in ASNoC increases with continuous scaling down of the transistor size. Excessive integration density in ASNoC can result in the formation of thermal hotspots, which can cause a system to fail permanently. As a result, fault-tolerant techniques are required to address the permanent faults in interconnection links of an ASNoC design. By taking into account link faults in the topology, this paper introduces a fault-tolerant application-specific topology-based NoC design and its prototype on an FPGA. To place spare links in the ASNoC topology, a meta-heuristic algorithm based on Particle Swarm Optimization (PSO) is proposed. By taking link faults into account in ASNoC design, we also propose an application mapping heuristic and a table-based fault-tolerant routing algorithm. Experiments are carried out for a specific link and any link fault in fault-tolerant topologies generated by our approach and approaches reported in the literature. For the experimentation, we used the multi-media applications Picture-in-Picture (PiP), Moving Pictures Expert Group (MPEG) - 4, MP3Encoder, and Video Object Plane Decoder (VOPD). Experiments are run on software and hardware platforms. The static performance metric communication cost and the dynamic performance metrics network latency, throughput, and router power consumption are examined using software platform. In the hardware platform, the Field Programmable Gate Array (FPGA) is used to validate proposed fault-tolerant topologies and analyze performance metrics such as application runtime, resource utilization, and power consumption. The results are compared with the existing approaches, specifically Ring topology and its modified versions on both software and hardware platforms. The experimental results obtained from software and hardware platforms for a specific link and any link fault show significant improvements in performance metrics using our approach when compared with the related works in the literature.publishedVersio

Aging-Aware Routing Algorithms for Network-on-Chips

Network-on-Chip (NoC) architectures have emerged as a better replacement of the traditional bus-based communication in the many-core era. However, continuous technology scaling has made aging mechanisms, such as Negative Bias Temperature Instability (NBTI) and electromigration, primary concerns in NoC design. In this work, a novel system-level aging model is proposed to model the effects of aging in NoCs, caused due to (a) asymmetric communication patterns between the network nodes, and (b) runtime traffic variations due to routing policies. This work observes a critical need of a holistic aging analysis, which when combined with power-performance optimization, poses a multi-objective design challenge. To solve this problem, two different aging-aware routing algorithms are proposed: (a) congestion-oblivious Mixed Integer Linear Programming (MILP)-based routing algorithm, and (b) congestion-aware adaptive routing algorithm and router micro-architecture. After extensive experimental evaluations, proposed routing algorithms reduce aging-induced power-performance overheads while also improving the system robustness

Design and implementation of secured agent based NoC using shortest path routing algorithm

Network on chip (NoC) is a scalable interconnection architecture for every increasing communication demand between many processing cores in system on chip design. Reliability aspects are becoming an important issue in fault tolerant architecture. Hence there is a demand for fault tolerant Agent architecture with suitable routing algorithm which plays a vital role in order to enhance the NoC performance. The proposed fault tolerant Agent based NoC method is used to enhance the reliability and performance of the Multiprocessor System on Chip (MPSoC) design against faulty links and nodes. These agents are placed in hierarchical manner to collect, process, classify and distribute different fault information related to the faulty links and nodes of the network. This fault information is used for further packet routing in the network with the help of shortest path routing algorithm. In addition to this the agent will provide the security for the node by setting firewall, which then decides whether the packet has to be processed or not. This intern provides high performance, low latency NoC by avoiding deadlock and live lock with low area overhead

SpiNNaker: Fault tolerance in a power- and area- constrained large-scale neuromimetic architecture

AbstractSpiNNaker is a biologically-inspired massively-parallel computer designed to model up to a billion spiking neurons in real-time. A full-fledged implementation of a SpiNNaker system will comprise more than 105 integrated circuits (half of which are SDRAMs and half multi-core systems-on-chip). Given this scale, it is unavoidable that some components fail and, in consequence, fault-tolerance is a foundation of the system design. Although the target application can tolerate a certain, low level of failures, important efforts have been devoted to incorporate different techniques for fault tolerance. This paper is devoted to discussing how hardware and software mechanisms collaborate to make SpiNNaker operate properly even in the very likely scenario of component failures and how it can tolerate system-degradation levels well above those expected