Variability-tolerant memristor-based ratioed logic in crossbar array

The final publication is available at ACM via http://dx.doi.org/10.1145/3232195.3232213The advent of the first TiO2-based memristor in 2008 revived the scientific interest both from academia and industry for this de- vice technology, with several emerging applications including that of logic circuits. Several memristive logic families have been pro- posed, each with different attributes, in the current quest for energy- efficient computing systems of the future. However, limited en- durance of memristor devices and variations (both cycle-to-cycle and device-to-device) are important parameters to be considered in the evaluation of such logic families. In this work we build upon an accurate physics-based model of a bipolar metal-oxide resistive RAM device (supporting parasitics of the device structure and va- riability of switching voltages and resistance states) and use it to show how performance of memristor-based logic circuits can de degraded owing to both variability and state-drift impact. Based on previous work on CMOS-like memristive logic circuits, we propose a memristive ratioed logic scheme, which is crossbar-compatible, i.e. suitable for in-/near-memory computing, and tolerant to device variability, while also it does not affect the device endurance since computations do not involve switching the memristor states. As a figure of merit, we compare such new logic scheme with MAGIC, focusing on the universal NOR logic gate.Peer ReviewedPostprint (author's final draft

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM.Postprint (published version

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM

Circuit topology and synthesis flow co-design for the development of computational ReRAM

© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Emerging memory technologies will play a decisive role in the quest for more energy-efficient computing systems. Computational ReRAM structures based on resistive switching devices (memristors) have been explored for in-memory computations using the resistance of ReRAM cells for storage and for logic I/O representation. Such approach presents three major challenges: the support for a memristor-oriented logic style, the ad-hoc design of memory array driving circuitry for memory and logic operations, and the development of dedicated synthesis tools to instruct the multi-level operations required for the execution of an arbitrary logic function in memory. This work contributes towards the development of an automated design flow for ReRAM-based computational memories, highlighting some important HW-SW co-design considerations. We briefly present a case study concerning a synthesis flow for a nonstateful logic style and the co-design of the underlying 1T1R crossbar array driving circuit. The prototype of the synthesis flow is based on the ABC tool and the Z3 solver. It executes fast owing to the level-by-level mapping of logic gates. Moreover, it delivers a mapping that minimizes the logic function latency through parallel logic operations, while also using the less possible ReRAM cells.Supported by Synopsys, Chile, by the Chilean grants FONDECYT Regular 1221747 and ANID-Basal FB0008, and by the Spanish MCIN/AEI/10.13039/501100011033 grant PID2019-103869RB-C33Peer ReviewedPostprint (author's final draft

Automated Synthesis of Unconventional Computing Systems

Despite decades of advancements, modern computing systems which are based on the von Neumann architecture still carry its shortcomings. Moore\u27s law, which had substantially masked the effects of the inherent memory-processor bottleneck of the von Neumann architecture, has slowed down due to transistor dimensions nearing atomic sizes. On the other hand, modern computational requirements, driven by machine learning, pattern recognition, artificial intelligence, data mining, and IoT, are growing at the fastest pace ever. By their inherent nature, these applications are particularly affected by communication-bottlenecks, because processing them requires a large number of simple operations involving data retrieval and storage. The need to address the problems associated with conventional computing systems at the fundamental level has given rise to several unconventional computing paradigms. In this dissertation, we have made advancements for automated syntheses of two types of unconventional computing paradigms: in-memory computing and stochastic computing. In-memory computing circumvents the problem of limited communication bandwidth by unifying processing and storage at the same physical locations. The advent of nanoelectronic devices in the last decade has made in-memory computing an energy-, area-, and cost-effective alternative to conventional computing. We have used Binary Decision Diagrams (BDDs) for in-memory computing on memristor crossbars. Specifically, we have used Free-BDDs, a special class of binary decision diagrams, for synthesizing crossbars for flow-based in-memory computing. Stochastic computing is a re-emerging discipline with several times smaller area/power requirements as compared to conventional computing systems. It is especially suited for fault-tolerant applications like image processing, artificial intelligence, pattern recognition, etc. We have proposed a decision procedures-based iterative algorithm to synthesize Linear Finite State Machines (LFSM) for stochastically computing non-linear functions such as polynomials, exponentials, and hyperbolic functions

Leveraging RRAM to Design Efficient Digital Circuits and Systems for Beyond Von Neumann in-Memory Computing

Due to the physical separation of their processing elements and storage units, contemporary digital computers are confronted with the thorny memory-wall problem. The strategy of in-memory computing has been considered as a promising solution to overcome the von Neumann bottleneck and design high-performance, energy-efficient computing systems. Moreover, in the post Moore era, post-CMOS technologies have received intense interests for possible future digital logic applications beyond the CMOS scaling limits. Motivated by these perspectives from system level to device level, this thesis proposes two effective processing-in-memory schemes to construct the non-von Neumann systems based on nonvolatile resistive random-access memory (RRAM). In the first scheme, we present functionally complete stateful logic gates based on a CMOS-compatible 2-transistor-2-RRAM (2T2R) structure. In this structure, the programmable logic functionality is determined by the amplitude of operation voltages, rather than its circuit topology. A reconfigurable 3T2R chain with programmable interconnects is used to implement complex combinational logic circuits. The design has a highly regular and symmetric circuit structure, making it easy for design, integration, and fabrication, while the operations are flexible yet clean. Easily integrated as 3-dimensional (3-D) stacked arrays, two proposed memory architectures not only serve as regular 3-D memory arrays but also perform in-memory-computing within the same layer and between the stacked layers. The second scheme leverages hybrid logic in the same hardware to design efficient digital circuits and systems with low computational complexity. Multiple-bit ripple-carry adder (RCA), pipelined RCA, and prefix tree adder are shown as example circuits, using the same regular chain structure, to validate the design efficiency. The design principles, computational complexity, and performance are discussed and compared to the CMOS technology and other state-of-the-art post-CMOS implementations. The overall evaluation shows superior performance in speed and area. The result of the study could build a technology cell library that can be potentially used as input to a technology-mapping algorithm. The proposed hybrid-logic methodology presents prospect of hardware acceleration and future beyond-von Neumann in-memory computing architectures

Variability-tolerant memristor-based ratioed logic in crossbar array

The final publication is available at ACM via http://dx.doi.org/10.1145/3232195.3232213The advent of the first TiO2-based memristor in 2008 revived the scientific interest both from academia and industry for this de- vice technology, with several emerging applications including that of logic circuits. Several memristive logic families have been pro- posed, each with different attributes, in the current quest for energy- efficient computing systems of the future. However, limited en- durance of memristor devices and variations (both cycle-to-cycle and device-to-device) are important parameters to be considered in the evaluation of such logic families. In this work we build upon an accurate physics-based model of a bipolar metal-oxide resistive RAM device (supporting parasitics of the device structure and va- riability of switching voltages and resistance states) and use it to show how performance of memristor-based logic circuits can de degraded owing to both variability and state-drift impact. Based on previous work on CMOS-like memristive logic circuits, we propose a memristive ratioed logic scheme, which is crossbar-compatible, i.e. suitable for in-/near-memory computing, and tolerant to device variability, while also it does not affect the device endurance since computations do not involve switching the memristor states. As a figure of merit, we compare such new logic scheme with MAGIC, focusing on the universal NOR logic gate.Peer Reviewe