PeF: Poisson's Equation Based Large-Scale Fixed-Outline Floorplanning

Floorplanning is the first stage of VLSI physical design. An effective floorplanning engine definitely has positive impact on chip design speed, quality and performance. In this paper, we present a novel mathematical model to characterize non-overlapping of modules, and propose a flat fixed-outline floorplanning algorithm based on the VLSI global placement approach using Poisson's equation. The algorithm consists of global floorplanning and legalization phases. In global floorplanning, we redefine the potential energy of each module based on the novel mathematical model for characterizing non-overlapping of modules and an analytical solution of Poisson's equation. In this scheme, the widths of soft modules appear as variables in the energy function and can be optimized. Moreover, we design a fast approximate computation scheme for partial derivatives of the potential energy. In legalization, based on the defined horizontal and vertical constraint graphs, we eliminate overlaps between modules remained after global floorplanning, by modifying relative positions of modules. Experiments on the MCNC, GSRC, HB+ and ami49\_x benchmarks show that, our algorithm improves the average wirelength by at least 2\% and 5\% on small and large scale benchmarks with certain whitespace, respectively, compared to state-of-the-art floorplanners

Scalability and interconnection issues in floorplan design and floorplan representations.

Yuen Wing-seung.Thesis (M.Phil.)--Chinese University of Hong Kong, 2001.Includes bibliographical references (leaves [116]-[122]).Abstracts in English and Chinese.Abstract --- p.iAcknowledgments --- p.iiiList of Figures --- p.viiiList of Tables --- p.xiiChapter 1 --- Introduction --- p.1Chapter 1.1 --- Motivations and Aims --- p.1Chapter 1.2 --- Contributions --- p.3Chapter 1.3 --- Dissertation Overview --- p.4Chapter 2 --- Physical Design and Floorplanning in VLSI Circuits --- p.6Chapter 2.1 --- VLSI Design Flow --- p.6Chapter 2.2 --- Floorplan Design --- p.8Chapter 2.2.1 --- Problem Formulation --- p.9Chapter 2.2.2 --- Types of Floorplan --- p.10Chapter 3 --- Floorplanning Representations --- p.12Chapter 3.1 --- Polish Expression(PE) [WL86] --- p.12Chapter 3.2 --- Bounded-Sliceline-Grid(BSG) [NFMK96] --- p.14Chapter 3.3 --- Sequence Pair(SP) [MFNK95] --- p.17Chapter 3.4 --- O-tree(OT) [GCY99] --- p.19Chapter 3.5 --- B*-tree(BT) [CCWW00] --- p.21Chapter 3.6 --- Corner Block List(CBL) [HHC+00] --- p.22Chapter 4 --- Optimization Technique in Floorplan Design --- p.27Chapter 4.1 --- General Optimization Methods --- p.27Chapter 4.1.1 --- Simulated Annealing --- p.27Chapter 4.1.2 --- Genetic Algorithm --- p.29Chapter 4.1.3 --- Integer Programming Method --- p.31Chapter 4.2 --- Shape Optimization --- p.33Chapter 4.2.1 --- Shape Curve --- p.33Chapter 4.2.2 --- Lagrangian Relaxation --- p.34Chapter 5 --- Literature Review on Interconnect Driven Floorplanning --- p.37Chapter 5.1 --- Placement Constraint in Floorplan Design --- p.37Chapter 5.1.1 --- Boundary Constraints --- p.37Chapter 5.1.2 --- Pre-placed Constraints --- p.39Chapter 5.1.3 --- Range Constraints --- p.41Chapter 5.1.4 --- Symmetry Constraints --- p.42Chapter 5.2 --- Timing Analysis Method --- p.43Chapter 5.3 --- Buffer Block Planning and Congestion Control --- p.45Chapter 5.3.1 --- Buffer Block Planning --- p.45Chapter 5.3.2 --- Congestion Control --- p.50Chapter 6 --- Clustering Constraint in Floorplan Design --- p.53Chapter 6.1 --- Problem Definition --- p.53Chapter 6.2 --- Overview --- p.54Chapter 6.3 --- Locating Neighboring Modules --- p.56Chapter 6.4 --- Constraint Satisfaction --- p.62Chapter 6.5 --- Multi-clustering Extension --- p.64Chapter 6.6 --- Cost Function --- p.64Chapter 6.7 --- Experimental Results --- p.65Chapter 7 --- Interconnect Driven Multilevel Floorplanning Approach --- p.69Chapter 7.1 --- Multilevel Partitioning --- p.69Chapter 7.1.1 --- Coarsening Phase --- p.70Chapter 7.1.2 --- Refinement Phase --- p.70Chapter 7.2 --- Overview of Multilevel Floorplanner --- p.72Chapter 7.3 --- Clustering Phase --- p.73Chapter 7.3.1 --- Clustering Methods --- p.73Chapter 7.3.2 --- Area Ratio Constraints --- p.75Chapter 7.3.3 --- Clustering Velocity --- p.76Chapter 7.4 --- Refinement Phase --- p.77Chapter 7.4.1 --- Temperature Control --- p.79Chapter 7.4.2 --- Cost Function --- p.80Chapter 7.4.3 --- Handling Shape Flexibility --- p.80Chapter 7.5 --- Experimental Results --- p.81Chapter 7.5.1 --- Data Set Generation --- p.82Chapter 7.5.2 --- Temperature Control --- p.82Chapter 7.5.3 --- Packing Results --- p.83Chapter 8 --- Study of Non-slicing Floorplan Representations --- p.89Chapter 8.1 --- Analysis of Different Floorplan Representations --- p.89Chapter 8.1.1 --- Complexity --- p.90Chapter 8.1.2 --- Types of Floorplans --- p.92Chapter 8.2 --- T-junction Orientation Property --- p.97Chapter 8.3 --- Twin Binary Tree Representation for Mosaic Floorplan --- p.103Chapter 8.3.1 --- Previous work --- p.103Chapter 8.3.2 --- Twin Binary Tree Construction --- p.105Chapter 8.3.3 --- Floorplan Construction --- p.109Chapter 9 --- Conclusion --- p.114Chapter 9.1 --- Summary --- p.114Bibliography --- p.116Chapter A --- Clustering Constraint Data Set --- p.123Chapter A.1 --- ami33 --- p.123Chapter A.1.1 --- One cluster --- p.123Chapter A.1.2 --- Multi-cluster --- p.123Chapter A.2 --- ami49 --- p.124Chapter A.2.1 --- One cluster --- p.124Chapter A.2.2 --- Multi-cluster --- p.124Chapter A.3 --- playout --- p.124Chapter A.3.1 --- One cluster --- p.124Chapter A.3.2 --- Multi-cluster --- p.125Chapter B --- Multilevel Data Set --- p.126Chapter B.l --- data_100 --- p.126Chapter B.2 --- data_200 --- p.127Chapter B.3 --- data_300 --- p.129Chapter B.4 --- data_400 --- p.131Chapter B.5 --- data_500 --- p.13

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

Bus-driven floorplanning.

Law Hoi Ying.Thesis (M.Phil.)--Chinese University of Hong Kong, 2005.Includes bibliographical references (leaves 101-106).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- VLSI Design Cycle --- p.2Chapter 1.2 --- Physical Design Cycle --- p.6Chapter 1.3 --- Floorplanning --- p.10Chapter 1.3.1 --- Floorplanning Objectives --- p.11Chapter 1.3.2 --- Common Approaches --- p.12Chapter 1.3.3 --- Interconnect-Driven Floorplanning --- p.14Chapter 1.4 --- Motivations and Contributions --- p.15Chapter 1.5 --- Organization of the Thesis --- p.17Chapter 2 --- Literature Review on 2D Floorplan Representations --- p.18Chapter 2.1 --- Types of Floorplans --- p.18Chapter 2.2 --- Floorplan Representations --- p.20Chapter 2.2.1 --- Slicing Floorplan --- p.21Chapter 2.2.2 --- Non-slicing Floorplan --- p.22Chapter 2.2.3 --- Mosaic Floorplan --- p.30Chapter 2.3 --- Summary --- p.35Chapter 3 --- Literature Review on 3D Floorplan Representations --- p.37Chapter 3.1 --- Introduction --- p.37Chapter 3.2 --- Problem Formulation --- p.38Chapter 3.3 --- Previous Work --- p.38Chapter 3.4 --- Summary --- p.42Chapter 4 --- Literature Review on Bus-Driven Floorplanning --- p.44Chapter 4.1 --- Problem Formulation --- p.44Chapter 4.2 --- Previous Work --- p.45Chapter 4.2.1 --- Abutment Constraint --- p.45Chapter 4.2.2 --- Alignment Constraint --- p.49Chapter 4.2.3 --- Bus-Driven Floorplanning --- p.52Chapter 4.3 --- Summary --- p.53Chapter 5 --- Multi-Bend Bus-Driven Floorplanning --- p.55Chapter 5.1 --- Introduction --- p.55Chapter 5.2 --- Problem Formulation --- p.56Chapter 5.3 --- Methodology --- p.57Chapter 5.3.1 --- Shape Validation --- p.58Chapter 5.3.2 --- Bus Ordering --- p.65Chapter 5.3.3 --- Floorplan Realization --- p.72Chapter 5.3.4 --- Simulated Annealing --- p.73Chapter 5.3.5 --- Soft Block Adjustment --- p.75Chapter 5.4 --- Experimental Results --- p.75Chapter 5.5 --- Summary --- p.77Chapter 6 --- Bus-Driven Floorplanning for 3D Chips --- p.80Chapter 6.1 --- Introduction --- p.80Chapter 6.2 --- Problem Formulation --- p.81Chapter 6.3 --- The Representation --- p.82Chapter 6.3.1 --- Overview --- p.82Chapter 6.3.2 --- Review of TCG --- p.83Chapter 6.3.3 --- Layered Transitive Closure Graph (LTCG) --- p.84Chapter 6.3.4 --- Aligning Blocks --- p.85Chapter 6.3.5 --- Solution Perturbation --- p.87Chapter 6.4 --- Simulated Annealing --- p.92Chapter 6.5 --- Soft Block Adjustment --- p.92Chapter 6.6 --- Experimental Results --- p.93Chapter 6.7 --- Summary --- p.94Chapter 6.8 --- Acknowledgement --- p.95Chapter 7 --- Conclusion --- p.99Bibliography --- p.10

Floorplan-guided placement for large-scale mixed-size designs

In the nanometer scale era, placement has become an extremely challenging stage in modern Very-Large-Scale Integration (VLSI) designs. Millions of objects need to be placed legally within a chip region, while both the interconnection and object distribution have to be optimized simultaneously. Due to the extensive use of Intellectual Property (IP) and embedded memory blocks, a design usually contains tens or even hundreds of big macros. A design with big movable macros and numerous standard cells is known as mixed-size design. Due to the big size difference between big macros and standard cells, the placement of mixed-size designs is much more difficult than the standard-cell placement. This work presents an efficient and high-quality placement tool to handle modern large-scale mixed-size designs. This tool is developed based on a new placement algorithm flow. The main idea is to use the fixed-outline floorplanning algorithm to guide the state-of-the-art analytical placer. This new flow consists of four steps: 1) The objects in the original netlist are clustered into blocks; 2) Floorplanning is performed on the blocks; 3) The blocks are shifted within the chip region to further optimize the wirelength; 4) With big macro locations fixed, incremental placement is applied to place the remaining objects. Several key techniques are proposed to be used in the first two steps. These techniques are mainly focused on the following two aspects: 1) Hypergraph clustering algorithm that can cut down the original problem size without loss of placement Quality of Results (QoR); 2) Fixed-outline floorplanning algorithm that can provide a good guidance to the analytical placer at the global level. The effectiveness of each key technique is demonstrated by promising experimental results compared with the state-of-the-art algorithms. Moreover, using the industrial mixed-size designs, the new placement tool shows better performance than other existing approaches