On testing VLSI chips for the big Viterbi decoder

A general technique that can be used in testing very large scale integrated (VLSI) chips for the Big Viterbi Decoder (BVD) system is described. The test technique is divided into functional testing and fault-coverage testing. The purpose of functional testing is to verify that the design works functionally. Functional test vectors are converted from outputs of software simulations which simulate the BVD functionally. Fault-coverage testing is used to detect and, in some cases, to locate faulty components caused by bad fabrication. This type of testing is useful in screening out bad chips. Finally, design for testability, which is included in the BVD VLSI chip design, is described in considerable detail. Both the observability and controllability of a VLSI chip are greatly enhanced by including the design for the testability feature

VLSI Testing and Test Power

This paper first reviews the basics of VLSI testing, focusing on test generation and design for testability. Then it discusses the impact of test power in scan testing, and highlights the need for low-power VLSI testing.2011 International Green Computing Conference and Workshops (IGCC 2011), July 25-28, 2011, Orlando, FL, US

Programmable latching probe microstructures for wafer testing applications

The objective of this thesis is to design a programmable wafer testing array on a single chip based on micro electromechanical systems (MEMS) and VLSI. The wafer-scale integration in this thesis is a programmable array of test probes that are used for engineering test of VLSI and ULSI silicon integrated circuits at the wafer level. This consists of two subsystems (1) the VLSI address circuits used for addressing and controlling the MEMS on the chip and (2) the latching probe MEMS microstructure array that actuates into position for testing VLSI wafers. Each of the subsystems have been designed, analyzed and simulated separately. These structures were then integrated into a demonstration 4x4 array forming a programmable probe card. A 3-micrometer critical dimension is used for both the VLSI CMOS and the MEMS physical design layouts. The fabrication technique for the MEMS microstructure is detailed. A standard 12-mask CMOS technology is used for the fabrication of the address circuits

Wiring Viterbi decoders (splitting deBruijn graphs)

A new Viterbi decoder, capable of decoding convolutional codes with constraint lengths up to 15, is under development for the Deep Space Network (DSN). A key feature of this decoder is a two-level partitioning of the Viterbi state diagram into identical subgraphs. The larger subgraphs correspond to circuit boards, while the smaller subgraphs correspond to Very Large Scale Integration (VLSI) chips. The full decoder is built from identical boards, which in turn are built from identical chips. The resulting system is modular and hierarchical. The decoder is easy to implement, test, and repair because it uses a single VLSI chip design and a single board design. The partitioning is completely general in the sense that an appropriate number of boards or chips may be wired together to implement a Viterbi decoder of any size greater than or equal to the size of the module

Trends and challenges in VLSI technology scaling towards 100 nm

Summary form only given. Moore's Law drives VLSI technology to continuous increases in transistor densities and higher clock frequencies. This tutorial will review the trends in VLSI technology scaling in the last few years and discuss the challenges facing process and circuit engineers in the 100nm generation and beyond. The first focus area is the process technology, including transistor scaling trends and research activities for the 100nm technology node and beyond. The transistor leakage and interconnect RC delays will continue to increase. The tutorial will review new circuit design techniques for emerging process technologies, including dual Vt transistors and silicon-on-insulator. It will also cover circuit and layout techniques to reduce clock distribution skew and jitter, model and reduce transistor leakage and improve the electrical performance of flip-chip packages. Finally, the tutorial will review the test challenges for the 100nm technology node due to increased clock frequency and power consumption (both active and passive) and present several potential solution

PowerPlanningDL: Reliability-Aware Framework for On-Chip Power Grid Design using Deep Learning

With the increase in the complexity of chip designs, VLSI physical design has become a time-consuming task, which is an iterative design process. Power planning is that part of the floorplanning in VLSI physical design where power grid networks are designed in order to provide adequate power to all the underlying functional blocks. Power planning also requires multiple iterative steps to create the power grid network while satisfying the allowed worst-case IR drop and Electromigration (EM) margin. For the first time, this paper introduces Deep learning (DL)-based framework to approximately predict the initial design of the power grid network, considering different reliability constraints. The proposed framework reduces many iterative design steps and speeds up the total design cycle. Neural Network-based multi-target regression technique is used to create the DL model. Feature extraction is done, and the training dataset is generated from the floorplans of some of the power grid designs extracted from the IBM processor. The DL model is trained using the generated dataset. The proposed DL-based framework is validated using a new set of power grid specifications (obtained by perturbing the designs used in the training phase). The results show that the predicted power grid design is closer to the original design with minimal prediction error (~2%). The proposed DL-based approach also improves the design cycle time with a speedup of ~6X for standard power grid benchmarks.Comment: Published in proceedings of IEEE/ACM Design, Automation and Test in Europe Conference (DATE) 2020, 6 page

A Sequential Circuit-Based IP Watermarking Algorithm for Multiple Scan Chains in Design-for-Test

In Very Large Scale Integrated Circuits (VLSI) design, the existing Design-for-Test(DFT) based watermarking techniques usually insert watermark through reordering scan cells, which causes large resource overhead, low security and coverage rate of watermark detection. A novel scheme was proposed to watermark multiple scan chains in DFT for solving the problems. The proposed scheme adopts DFT scan test model of VLSI design, and uses a Linear Feedback Shift Register (LFSR) for pseudo random test vector generation. All of the test vectors are shifted in scan input for the construction of multiple scan chains with minimum correlation. Specific registers in multiple scan chains will be changed by the watermark circuit for watermarking the design. The watermark can be effectively detected without interference with normal function of the circuit, even after the chip is packaged. The experimental results on several ISCAS benchmarks show that the proposed scheme has lower resource overhead, probability of coincidence and higher coverage rate of watermark detection by comparing with the existing methods

Test aspects of the JPL Viterbi decoder

The generation of test vectors and design-for-test aspects of the Jet Propulsion Laboratory (JPL) Very Large Scale Integration (VLSI) Viterbi decoder chip is discussed. Each processor integrated circuit (IC) contains over 20,000 gates. To achieve a high degree of testability, a scan architecture is employed. The logic has been partitioned so that very few test vectors are required to test the entire chip. In addition, since several blocks of logic are replicated numerous times on this chip, test vectors need only be generated for each block, rather than for the entire circuit. These unique blocks of logic have been identified and test sets generated for them. The approach employed for testing was to use pseudo-exhaustive test vectors whenever feasible. That is, each cone of logid is tested exhaustively. Using this approach, no detailed logic design or fault model is required. All faults which modify the function of a block of combinational logic are detected, such as all irredundant single and multiple stuck-at faults