A framework for fine-grain synthesis optimization of operational amplifiers

This thesis presents a cell-level framework for Operational Amplifiers Synthesis (OASYN) coupling both circuit design and layout. For circuit design, the tool applies a corner-driven optimization, accounting for on-chip performance variations. By exploring the process, voltage, and temperature variations space, the tool extracts design worst case solution. The tool undergoes sensitivity analysis along with Pareto-optimality to achieve required specifications. For layout phase, OASYN generates a DRC proved automated layout based on a sized circuit-level description. Morata et al. (1996) introduced an elegant representation of block placement called sequence pair for general floorplans (SP). Like TCG and BSG, but unlike O-tree, B*tree, and CBL, SP is P-admissible. Unlike SP, TCG supports incremental update during operation and keeps the information of the boundary modules as well as their relative positions in the representation. Block placement algorithms that are based on SP use heuristic optimization algorithms, e.g., simulated annealing where generation of large number of sequence pairs are required. Therefore a fast algorithm is needed to generate sequence pairs after each solution perturbation. The thesis presents a new simple and efficient O(n) runtime algorithm for fast realization of incremental update for cost evaluation. The algorithm integrates sequence pair and transitive closure graph advantages into TCG-S* a superior topology update scheme which facilitates the search for optimum desired floorplan. Experiments show that TCG-S* is better than existing works in terms of area utilization and convergence speed. Routing-aware placement is implemented in OASYN, handling symmetry constraints, e.g., interdigitization, common centroid, along with congestion elimination and the enhancement of placement routability

The Future of the Operating Room: Surgical Preplanning and Navigation using High Accuracy Ultra-Wideband Positioning and Advanced Bone Measurement

This dissertation embodies the diversity and creativity of my research, of which much has been peer-reviewed, published in archival quality journals, and presented nationally and internationally. Portions of the work described herein have been published in the fields of image processing, forensic anthropology, physical anthropology, biomedical engineering, clinical orthopedics, and microwave engineering. The problem studied is primarily that of developing the tools and technologies for a next-generation surgical navigation system. The discussion focuses on the underlying technologies of a novel microwave positioning subsystem and a bone analysis subsystem. The methodologies behind each of these technologies are presented in the context of the overall system with the salient results helping to elucidate the difficult facets of the problem. The microwave positioning system is currently the highest accuracy wireless ultra-wideband positioning system that can be found in the literature. The challenges in producing a system with these capabilities are many, and the research and development in solving these problems should further the art of high accuracy pulse-based positioning

Analysis and Mitigation of Remote Side-Channel and Fault Attacks on the Electrical Level

In der fortlaufenden Miniaturisierung von integrierten Schaltungen werden physikalische Grenzen erreicht, wobei beispielsweise Einzelatomtransistoren eine mögliche untere Grenze für Strukturgrößen darstellen. Zudem ist die Herstellung der neuesten Generationen von Mikrochips heutzutage finanziell nur noch von großen, multinationalen Unternehmen zu stemmen. Aufgrund dieser Entwicklung ist Miniaturisierung nicht länger die treibende Kraft um die Leistung von elektronischen Komponenten weiter zu erhöhen. Stattdessen werden klassische Computerarchitekturen mit generischen Prozessoren weiterentwickelt zu heterogenen Systemen mit hoher Parallelität und speziellen Beschleunigern. Allerdings wird in diesen heterogenen Systemen auch der Schutz von privaten Daten gegen Angreifer zunehmend schwieriger. Neue Arten von Hardware-Komponenten, neue Arten von Anwendungen und eine allgemein erhöhte Komplexität sind einige der Faktoren, die die Sicherheit in solchen Systemen zur Herausforderung machen. Kryptografische Algorithmen sind oftmals nur unter bestimmten Annahmen über den Angreifer wirklich sicher. Es wird zum Beispiel oft angenommen, dass der Angreifer nur auf Eingaben und Ausgaben eines Moduls zugreifen kann, während interne Signale und Zwischenwerte verborgen sind. In echten Implementierungen zeigen jedoch Angriffe über Seitenkanäle und Faults die Grenzen dieses sogenannten Black-Box-Modells auf. Während bei Seitenkanalangriffen der Angreifer datenabhängige Messgrößen wie Stromverbrauch oder elektromagnetische Strahlung ausnutzt, wird bei Fault Angriffen aktiv in die Berechnungen eingegriffen, und die falschen Ausgabewerte zum Finden der geheimen Daten verwendet. Diese Art von Angriffen auf Implementierungen wurde ursprünglich nur im Kontext eines lokalen Angreifers mit Zugriff auf das Zielgerät behandelt. Jedoch haben bereits Angriffe, die auf der Messung der Zeit für bestimmte Speicherzugriffe basieren, gezeigt, dass die Bedrohung auch durch Angreifer mit Fernzugriff besteht. In dieser Arbeit wird die Bedrohung durch Seitenkanal- und Fault-Angriffe über Fernzugriff behandelt, welche eng mit der Entwicklung zu mehr heterogenen Systemen verknüpft sind. Ein Beispiel für neuartige Hardware im heterogenen Rechnen sind Field-Programmable Gate Arrays (FPGAs), mit welchen sich fast beliebige Schaltungen in programmierbarer Logik realisieren lassen. Diese Logik-Chips werden bereits jetzt als Beschleuniger sowohl in der Cloud als auch in Endgeräten eingesetzt. Allerdings wurde gezeigt, wie die Flexibilität dieser Beschleuniger zur Implementierung von Sensoren zur Abschätzung der Versorgungsspannung ausgenutzt werden kann. Zudem können durch eine spezielle Art der Aktivierung von großen Mengen an Logik Berechnungen in anderen Schaltungen für Fault Angriffe gestört werden. Diese Bedrohung wird hier beispielsweise durch die Erweiterung bestehender Angriffe weiter analysiert und es werden Strategien zur Absicherung dagegen entwickelt

Analog design for manufacturability: lithography-aware analog layout retargeting

As transistor sizes shrink over time in the advanced nanometer technologies, lithography effects have become a dominant contributor of integrated circuit (IC) yield degradation. Random manufacturing variations, such as photolithographic defect or spot defect, may cause fatal functional failures, while systematic process variations, such as dose fluctuation and defocus, can result in wafer pattern distortions and in turn ruin circuit performance. This dissertation is focused on yield optimization at the circuit design stage or so-called design for manufacturability (DFM) with respect to analog ICs, which has not yet been sufficiently addressed by traditional DFM solutions. On top of a graph-based analog layout retargeting framework, in this dissertation the photolithographic defects and lithography process variations are alleviated by geometrical layout manipulation operations including wire widening, wire shifting, process variation band (PV-band) shifting, and optical proximity correction (OPC). The ultimate objective of this research is to develop efficient algorithms and methodologies in order to achieve lithography-robust analog IC layout design without circuit performance degradation

Design of a Sternal Fixation Device and Bicortical Bone Model

Failure to properly close the sternum after a sternotomy can lead to complications. Current sternal fixation devices, including screw and plate systems, reduce the risk of complications but are unable to provide a flush fit with the sternum and prevent screw loosening. The first goal of this study was to optimize a screw and plate system that addresses this issue. The system utilizes a lag-lock mechanism that permits locking of the screw after the plate is flush fit with the bone. The second goal was to design and characterize a sternal model to mimic the mechanical properties of bone. It was characterized using axial and lateral pullout tests and compared to a standard bone model. In testing, the custom model performed similar to how bone is expected to, making it a better sternal model

AERO & VISTA: Demonstrating HF Radio Interferometry with Vector Sensors

AERO (Auroral Emission Radio Observer) and VISTA (Vector Interferometry Space Technology using AERO) are recently selected NASA HTIDeS CubeSat missions for terrestrial auroral science and radio interferometric technology demonstration. The AERO and VISTA CubeSats both host vector sensing antenna systems providing advanced electromagnetic capabilities. Together, they will provide the first in-space demonstration of interferometric imaging, beamforming, and nulling using electromagnetic vector sensors at low frequencies (100 kHz –15 MHz). A key goal of the joint missions’ technology demonstration is to validate theoretical sensor performance modeling indicating that interferometric arrays composed of vector sensors will be able to maintain sensitivity even in the presence of terrestrial interference. If validated in flight, this capability would relax the requirement that space-based low frequency interferometers be placed far from the Earth (e.g. lunar orbit), and the closer communications range will significantly increase the data volume returned from space-based radio telescope systems. The two-spacecraft AERO+VISTA mission will address the auroral science goals of AERO (Erickson et al. 2018, SSC18) while adding three additional technology demonstration goals enabled by the second CubeSat, VISTA

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Digital Image Access & Retrieval

The 33th Annual Clinic on Library Applications of Data Processing, held at the University of Illinois at Urbana-Champaign in March of 1996, addressed the theme of "Digital Image Access & Retrieval." The papers from this conference cover a wide range of topics concerning digital imaging technology for visual resource collections. Papers covered three general areas: (1) systems, planning, and implementation; (2) automatic and semi-automatic indexing; and (3) preservation with the bulk of the conference focusing on indexing and retrieval.published or submitted for publicatio