Intermittent fault diagnosis and health monitoring for electronic interconnects

Literature survey and correspondence with industrial sector shows that No-Fault-Found (NFF) is a major concern in through life engineering services, especially for defence, aerospace, and other transport industry. There are various occurrences and root causes that result in NFF events but intermittent interconnections are the most frustrating. This is because it disappears while testing, and missed out by diagnostic equipment. This thesis describes the challenging and most important area of intermittent fault detection and health monitoring that focuses towards NFF situation in electronics interconnections. After introduction, this thesis starts with literature survey and describes financial impact on aerospace and other transport industry. It highlights NFF technologies and discuss different facts and their impact on NFF. Then It goes into experimental study that how repeatedly intermittent fault could be replicated. It describes a novel fault replicator that can generate repeatedly IFs for further experimental study on diagnosis techniques/algorithms. The novel IF replicator provide for single and multipoint intermittent connection. The experimental work focuses on mechanically induced intermittent conditions in connectors. This work illustrates a test regime that can be used to repeatedly reproduce intermittency in electronic connectors whilst subjected to vibration ... [cont.]

Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines CorporationJoint Services Electronics Program Contract DAAL03-89-C-0001U.S. Air Force - Office of Scientific Research Contract AFOSR 86-0164BDuPont CorporationNational Science Foundation Grant MIP 88-14612U.S. Navy - Office of Naval Research Contract N00014-87-K-0825American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

Phase Locked Loop Test Methodology

Phase locked loops are incorporated into almost every large-scale mixed signal and digital system on chip (SOC). Various types of PLL architectures exist including fully analogue, fully digital, semi-digital, and software based. Currently the most commonly used PLL architecture for SOC environments and chipset applications is the Charge-Pump (CP) semi-digital type. This architecture is commonly used for clock synthesis applications, such as the supply of a high frequency on-chip clock, which is derived from a low frequency board level clock. In addition, CP-PLL architectures are now frequently used for demanding RF (Radio Frequency) synthesis, and data synchronization applications. On chip system blocks that rely on correct PLL operation may include third party IP cores, ADCs, DACs and user defined logic (UDL). Basically, any on-chip function that requires a stable clock will be reliant on correct PLL operation. As a direct consequence it is essential that the PLL function is reliably verified during both the design and debug phase and through production testing. This chapter focuses on test approaches related to embedded CP-PLLs used for the purpose of clock generation for SOC. However, methods discussed will generally apply to CP-PLLs used for other applications

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification