MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

Ultra Wide Band Band Pass filter embedding a MLF low cost package with wire bound attach process

International audienc

Development of sensors and non-destructive techniques to determine the performance of coatings in construction

The primary objective of this work was to examine and develop techniques for monitoring the degradation of Organically Coated Steel (OCS) in-situ. This included the detection of changes associated with the weathering to both the organic coating and metallic substrate. Initially, a review of current promising techniques was carried out however many were found to be unsuitable for this application and the adaptation of current techniques and the development of new techniques was considered. A brief concept investigation, based on initial testing and considerations, was used to determine a number of sensing techniques to examine. These included embedded, Resonant Frequency Identification (RFID), Magnetic Flux Leakage (MFL) and dielectric sensing. Each of these techniques were assessed for the application, prototyped, and tested against a range of samples to determine the accuracy and sensitivity of degradation detection provided. A range of poorly and highly durable coated samples were used in conjunction with accelerated weathering testing for this aim. Track based electronic printed sensors were presented as both a cut edge corrosion tracking and coating capacitance measurement method. While suffering somewhat from electrical paint compatibility issues both concepts showed merit in initial trials however the capacitive sensor ultimately proved insufficiently responsive to coating changes. The embedded, progressive failure-based, cut edge corrosion sensor was produced and tested in modern coating systems with moderate success. Novel applications of RFID and MLF techniques were considered and proved capable of detecting large changes in substrate condition due to significant corrosion. However, there was a lack of sufficient sensitivity when considering early-stage corrosion of durable modern OCS products. Finally, it was shown that a chipless antenna could be designed and optimised for novelly monitoring the changes to the dielectric properties of a paint layer due to degradation. However, ultimately this test, due to equipment requirements, lent itself more to lab testing than in-situ. Due to some of these limitations a different approach was considered in which the environmental factors influencing degradation were examined with the aim of relating these to performance across a building. It was observed that a combination of high humidity and the build-up of aggressive natural deposits contributed to high degradation rates in sheltered regions, such as building eaves, where microclimates were created. The build-up of deposits and their effect was presented as a key degradation accelerant during in-use service. A unique numerical simulation approach was developed to predict the natural washing, via rain impact and characteristics of the building analysed. This approach showed promise for determining areas unlikely to be naturally washed, and therefore subjected to a degradation accelerating, build-up of deposits. Given these understandings coated wetness sensors were considered as a realistic live-monitoring device capable of determining deposit build up and ultimately OCS lifetime

Proceedings of the 10th International Chemical and Biological Engineering Conference - CHEMPOR 2008

This volume contains full papers presented at the 10th International Chemical and Biological Engineering Conference - CHEMPOR 2008, held in Braga, Portugal, between September 4th and 6th, 2008.FC

Combining SOA and BPM Technologies for Cross-System Process Automation

This paper summarizes the results of an industry case study that introduced a cross-system business process automation solution based on a combination of SOA and BPM standard technologies (i.e., BPMN, BPEL, WSDL). Besides discussing major weaknesses of the existing, custom-built, solution and comparing them against experiences with the developed prototype, the paper presents a course of action for transforming the current solution into the proposed solution. This includes a general approach, consisting of four distinct steps, as well as specific action items that are to be performed for every step. The discussion also covers language and tool support and challenges arising from the transformation

Manipulador aéreo con brazos antropomórficos de articulaciones flexibles

[Resumen] Este artículo presenta el primer robot manipulador aéreo con dos brazos antropomórficos diseñado para aplicarse en tareas de inspección y mantenimiento en entornos industriales de difícil acceso para operarios humanos. El robot consiste en una plataforma aérea multirrotor equipada con dos brazos antropomórficos ultraligeros, así como el sistema de control integrado de la plataforma y los brazos. Una de las principales características del manipulador es la flexibilidad mecánica proporcionada en todas las articulaciones, lo que aumenta la seguridad en las interacciones físicas con el entorno y la protección del propio robot. Para ello se ha introducido un compacto y simple mecanismo de transmisión por muelle entre el eje del servo y el enlace de salida. La estructura en aluminio de los brazos ha sido cuidadosamente diseñada de forma que los actuadores estén aislados frente a cargas radiales y axiales que los puedan dañar. El manipulador desarrollado ha sido validado a través de experimentos en base fija y en pruebas de vuelo en exteriores.Ministerio de Economía y Competitividad; DPI2014-5983-C2-1-