6,772 research outputs found
Digital implementation of the cellular sensor-computers
Two different kinds of cellular sensor-processor architectures are used nowadays in various
applications. The first is the traditional sensor-processor architecture, where the sensor and the
processor arrays are mapped into each other. The second is the foveal architecture, in which a
small active fovea is navigating in a large sensor array. This second architecture is introduced
and compared here. Both of these architectures can be implemented with analog and digital
processor arrays. The efficiency of the different implementation types, depending on the used
CMOS technology, is analyzed. It turned out, that the finer the technology is, the better to use
digital implementation rather than analog
CMOS-3D smart imager architectures for feature detection
This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circuitry in this tier operates in mixed-signal domain. It embeds in-pixel correlated double sampling, a switched-capacitor network for Gaussian pyramid generation, analog memories and a comparator for in-pixel analog-to-digital conversion. This tier can be further split into two for improved resolution; one containing the sensors and another containing a capacitor per sensor plus the mixed-signal processing circuitry. Regarding the bottom tier, it embeds digital circuitry entitled for the calculation of Harris, Hessian, and difference-of-Gaussian detectors. The overall system can hence be configured by the user to detect interest points by using the algorithm out of these three better suited to practical applications. The paper describes the different kind of algorithms featured and the circuitry employed at top and bottom tiers. The Gaussian pyramid is implemented with a switched-capacitor network in less than 50 ÎŒs, outperforming more conventional solutions.Xunta de Galicia 10PXIB206037PRMinisterio de Ciencia e InnovaciĂłn TEC2009-12686, IPT-2011-1625-430000Office of Naval Research N00014111031
CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends
CMOS Image Sensors (CIS) are key for imaging technol-ogies. These chips are conceived for capturing opticalscenes focused on their surface, and for delivering elec-trical images, commonly in digital format. CISs may incor-porate intelligence; however, their smartness basicallyconcerns calibration, error correction and other similartasks. The term CVISs (CMOS VIsion Sensors) definesother class of sensor front-ends which are aimed at per-forming vision tasks right at the focal plane. They havebeen running under names such as computational imagesensors, vision sensors and silicon retinas, among others. CVIS and CISs are similar regarding physical imple-mentation. However, while inputs of both CIS and CVISare images captured by photo-sensors placed at thefocal-plane, CVISs primary outputs may not be imagesbut either image features or even decisions based on thespatial-temporal analysis of the scenes. We may hencestate that CVISs are more âintelligentâ than CISs as theyfocus on information instead of on raw data. Actually,CVIS architectures capable of extracting and interpretingthe information contained in images, and prompting reac-tion commands thereof, have been explored for years inacademia, and industrial applications are recently ramp-ing up.One of the challenges of CVISs architects is incorporat-ing computer vision concepts into the design flow. Theendeavor is ambitious because imaging and computervision communities are rather disjoint groups talking dif-ferent languages. The Cellular Nonlinear Network Univer-sal Machine (CNNUM) paradigm, proposed by Profs.Chua and Roska, defined an adequate framework forsuch conciliation as it is particularly well suited for hard-ware-software co-design [1]-[4]. This paper overviewsCVISs chips that were conceived and prototyped at IMSEVision Lab over the past twenty years. Some of them fitthe CNNUM paradigm while others are tangential to it. Allthem employ per-pixel mixed-signal processing circuitryto achieve sensor-processing concurrency in the quest offast operation with reduced energy budget.Junta de AndalucĂa TIC 2012-2338Ministerio de EconomĂa y Competitividad TEC 2015-66878-C3-1-R y TEC 2015-66878-C3-3-
Configurable 3D-integrated focal-plane sensor-processor array architecture
A mixed-signal Cellular Visual Microprocessor architecture with digital processors is
described. An ASIC implementation is also demonstrated. The architecture is composed of a
regular sensor readout circuit array, prepared for 3D face-to-face type integration, and one or
several cascaded array of mainly identical (SIMD) processing elements. The individual array
elements derived from the same general HDL description and could be of different in size, aspect
ratio, and computing resources
Neuro-memristive Circuits for Edge Computing: A review
The volume, veracity, variability, and velocity of data produced from the
ever-increasing network of sensors connected to Internet pose challenges for
power management, scalability, and sustainability of cloud computing
infrastructure. Increasing the data processing capability of edge computing
devices at lower power requirements can reduce several overheads for cloud
computing solutions. This paper provides the review of neuromorphic
CMOS-memristive architectures that can be integrated into edge computing
devices. We discuss why the neuromorphic architectures are useful for edge
devices and show the advantages, drawbacks and open problems in the field of
neuro-memristive circuits for edge computing
A versatile sensor interface for programmable vision systems-on-chip
This paper describes an optical sensor interface designed for a programmable mixed-signal vision chip. This chip has been designed and manufactured in a standard 0.35ÎŒm n-well CMOS technology with one poly layer and five metal layers. It contains a digital shell for control and data interchange, and a central array of 128 Ă 128 identical cells, each cell corresponding to a pixel. Die size is 11.885 Ă 12.230mm2 and cell size is 75.7ÎŒm Ă 73.3ÎŒm. Each cell contains 198 transistors dedicated to functions like processing, storage, and sensing. The system is oriented to real-time, single-chip image acquisition and processing. Since each pixel performs the basic functions of sensing, processing and storage, data transferences are fully parallel (image-wide). The programmability of the processing functions enables the realization of complex image processing functions based on the sequential application of simpler operations. This paper provides a general overview of the system architecture and functionality, with special emphasis on the optical interface.European Commission IST-1999-19007Office of Naval Research (USA) N00014021088
A mixed-signal early vision chip with embedded image and programming memories and digital I/O
From a system level perspective, this paper presents a 128 Ă 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35ÎŒm standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (⌠7bit) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330GOPs (Giga Operations per second), and uses the power supply (180GOP/Joule) and the silicon area (3.8 GOPS/mm2) efficiently, as it is able to maintain VGA processing throughputs of 100Frames/s with about 15 basic image processing tasks on each frame
ACE16K: The Third Generation of Mixed-Signal SIMD-CNN ACE Chips Toward VSoCs
Today, with 0.18-ÎŒm technologies mature and stable enough for mixed-signal design with a large variety of CMOS compatible optical sensors available and with 0.09-ÎŒm technologies knocking at the door of designers, we can face the design of integrated systems, instead of just integrated circuits. In fact, significant progress has been made in the last few years toward the realization of vision systems on chips (VSoCs). Such VSoCs are eventually targeted to integrate within a semiconductor substrate the functions of optical sensing, image processing in space and time, high-level processing, and the control of actuators. The consecutive generations of ACE chips define a roadmap toward flexible VSoCs. These chips consist of arrays of mixed-signal processing elements (PEs) which operate in accordance with single instruction multiple data (SIMD) computing architectures and exhibit the functional features of CNN Universal Machines. They have been conceived to cover the early stages of the visual processing path in a fully-parallel manner, and hence more efficiently than DSP-based systems. Across the different generations, different improvements and modifications have been made looking to converge with the newest discoveries of neurobiologists regarding the behavior of natural retinas. This paper presents considerations pertaining to the design of a member of the third generation of ACE chips, namely to the so-called ACE16k chip. This chip, designed in a 0.35-ÎŒm standard CMOS technology, contains about 3.75 million transistors and exhibits peak computing figures of 330 GOPS, 3.6 GOPS/mm2 and 82.5 GOPS/W. Each PE in the array contains a reconfigurable computing kernel capable of calculating linear convolutions on 3Ă3 neighborhoods in less than 1.5 ÎŒs, imagewise Boolean combinations in less than 200 ns, imagewise arithmetic operations in about 5 ÎŒs, and CNN-like temporal evolutions with a time constant of about 0.5 ÎŒs. Unfortunately, the many ideas underlying the design of this chip cannot be covered in a single paper; hence, this paper is focused on, first, placing the ACE16k in the ACE chip roadmap and, then, discussing the most significant modifications of ACE16K versus its predecessors in the family.LOCUST IST2001â38 097VISTA TIC2003â09 817 - C02â01Office of Naval Research N000 140 210 88
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