Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin

A 10-bit Charge-Redistribution ADC Consuming 1.9 μW at 1 MS/s

This paper presents a 10 bit successive approximation ADC in 65 nm CMOS that benefits from technology scaling. It meets extremely low power requirements by using a charge-redistribution DAC that uses step-wise charging, a dynamic two-stage comparator and a delay-line-based controller. The ADC requires no external reference current and uses only one external supply voltage of 1.0 V to 1.3 V. Its supply current is proportional to the sample rate (only dynamic power consumption). The ADC uses a chip area of approximately 115--225 μm2. At a sample rate of 1 MS/s and a supply voltage of 1.0 V, the 10 bit ADC consumes 1.9 μW and achieves an energy efficiency of 4.4 fJ/conversion-step

ACE16K: A 128×128 focal plane analog processor with digital I/O

This paper presents a new generation 128×128 focal-plane analog programmable array processor (FPAPAP), from a system level perspective, which has been manufactured in a 0.35 μm standard digital 1P-5M CMOS technology. The chip has been designed to achieve the high-speed and moderate-accuracy (8b) requirements of most real time early-vision processing applications. It is easily embedded in conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four millions transistors, 90% of them working in analog mode, and exhibits a relatively low power consumption-<4 W, i.e. less than 1 μW per transistor. Computing vs. power peak values are in the order of 1 TeraOPS/W, while maintained VGA processing throughputs of 100 frames/s are possible with about 10-20 basic image processing tasks on each frame

Capacitance-to-Digital Converter for Ultra-Low-Power Wireless Sensor Nodes

Power consumption is one of the main design constraints in today’s integrated circuits. For systems like wearable electronics, UAVs, IOT systems powered by batteries which are charged using the energy harvested from various sources like RF, Thermal, Solar and Vibration, ultra-low power consumption is paramount. In these systems, Transducers which convert physical parameters into electrical parameters and the analog-to-digital converters (ADCs) are key components as the interface between the analog world and the digital domain. This thesis addresses the design challenges, strategies, as well as circuit techniques of ultra-low-power signal Front End used in several low power electronic systems in general and pressure measurement systems in particular. In this thesis, Capacitance to Digital Converter based pressure measurement system has been implemented. Here we present a general-purpose, wide-range CDC that combines a correlated double sampling (CDS) approach with a differential asynchronous SAR ADC. Since the sensor capacitor is sampled only twice per conversion, energy per conversion is low. Furthermore, since the CDS separates the sensor capacitor from the CDAC, a full differential input voltage range is preserved. The CDC has a 2.5-to-75.5pF conversion range. Monotonic SAR ADC was designed in 180nm CMOS with 1-V power supply and a 1-kS/s sampling rate with switching energy of about 100nW

130nm CMOS SAR-ADC with Low Complexity Digital Control Logic

This paper reports on an original approach to design the digital control logic of a Successive Approximation Register Analog to Digital Converter, where no sequencers or code registers are used. It turns out a low complexity digital circuitry, which is applied to the design of a 130nm CMOS 8-bit SAR ADC. The simulations demonstrate that the proposed digital control logic correctly works leading to an Analog to Digital Converter exhibiting performances well aligned with the literature in terms of linearity, dissipated power, and energy spent per bit generation

Digital Offset Calibration of an OPAMP Towards Improving Static Parameters of 90 nm CMOS DAC

In this paper, an on-chip self-calibrated 8-bit R-2R digital-to-analog converter (DAC) based on digitally compensated input offset of the operational amplifier (OPAMP) is presented. To improve the overall DAC performance, a digital offset cancellation method was used to compensate deviations in the input offset voltage of the OPAMP caused by process variations. The whole DAC as well as offset compensation circuitry were designed in a standard 90 nm CMOS process. The achieved results show that after the self-calibration process, the improvement of 48% in the value of DAC offset error is achieved

A mixed-signal early vision chip with embedded image and programming memories and digital I/O

From a system level perspective, this paper presents a 128 × 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35μm standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (∼ 7bit) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330GOPs (Giga Operations per second), and uses the power supply (180GOP/Joule) and the silicon area (3.8 GOPS/mm2) efficiently, as it is able to maintain VGA processing throughputs of 100Frames/s with about 15 basic image processing tasks on each frame