3,799 research outputs found
CMOS design of chaotic oscillators using state variables: a monolithic Chua's circuit
This paper presents design considerations for monolithic implementation of piecewise-linear (PWL) dynamic systems in CMOS technology. Starting from a review of available CMOS circuit primitives and their respective merits and drawbacks, the paper proposes a synthesis approach for PWL dynamic systems, based on state-variable methods, and identifies the associated analog operators. The GmC approach, combining quasi-linear VCCS's, PWL VCCS's, and capacitors is then explored regarding the implementation of these operators. CMOS basic building blocks for the realization of the quasi-linear VCCS's and PWL VCCS's are presented and applied to design a Chua's circuit IC. The influence of GmC parasitics on the performance of dynamic PWL systems is illustrated through this example. Measured chaotic attractors from a Chua's circuit prototype are given. The prototype has been fabricated in a 2.4- mu m double-poly n-well CMOS technology, and occupies 0.35 mm/sup 2/, with a power consumption of 1.6 mW for a +or-2.5-V symmetric supply. Measurements show bifurcation toward a double-scroll Chua's attractor by changing a bias current
Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems
In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads
Accurate Settling-Time Modeling and Design Procedures for Two-Stage Miller-Compensated Amplifiers for Switched-Capacitor Circuits
We present modeling techniques for accurate estimation of settling errors in switched-capacitor (SC) circuits built with Miller-compensated operational transconductance amplifiers (OTAs). One distinctive feature of the proposal is the computation of the impact of signal levels (on both the model parameters and the model structure) as they change during transient evolution. This is achieved by using an event-driven behavioral approach that combines small- and large-signal behavioral descriptions and keeps track of the amplifier state after each clock phase. Also, SC circuits are modeled under closed-loop conditions to guarantee that the results remain close to those obtained by electrical simulation of the actual circuits. Based on these models, which can be regarded as intermediate between the more established small-signal approach and full-fledged simulations, design procedures for dimensioning SC building blocks are presented whose targets are system-level specifications (such as ENOB and SNDR) instead of OTA specifications. The proposed techniques allow to complete top-down model-based designs with 0.3-b accuracy.Ministerio de Educación y Ciencia TEC2006-03022Junta de Andalucía TIC-0281
Distributed active transformer - a new power-combining andimpedance-transformation technique
In this paper, we compare the performance of the newly introduced distributed active transformer (DAT) structure to that of conventional on-chip impedance-transformations methods. Their fundamental power-efficiency limitations in the design of high-power fully integrated amplifiers in standard silicon process technologies are analyzed. The DAT is demonstrated to be an efficient impedance-transformation and power-combining method, which combines several low-voltage push-pull amplifiers in series by magnetic coupling. To demonstrate the validity of the new concept, a 2.4-GHz 1.9-W 2-V fully integrated power-amplifier achieving a power-added efficiency of 41% with 50-Ω input and output matching has been fabricated using 0.35-μm CMOS transistor
Fully integrated CMOS power amplifier design using the distributed active-transformer architecture
A novel on-chip impedance matching and power-combining method, the distributed active transformer is presented. It combines several low-voltage push-pull amplifiers efficiently with their outputs in series to produce a larger output power while maintaining a 50-Ω match. It also uses virtual ac grounds and magnetic couplings extensively to eliminate the need for any off-chip component, such as tuned bonding wires or external inductors. Furthermore, it desensitizes the operation of the amplifier to the inductance of bonding wires making the design more reproducible. To demonstrate the feasibility of this concept, a 2.4-GHz 2-W 2-V truly fully integrated power amplifier with 50-Ω input and output matching has been fabricated using 0.35-μm CMOS transistors. It achieves a power added efficiency (PAE) of 41 % at this power level. It can also produce 450 mW using a 1-V supply. Harmonic suppression is 64 dBc or better. This new topology makes possible a truly fully integrated watt-level gigahertz range low-voltage CMOS power amplifier for the first time
A CMOS class-AB transconductance amplifier for switched-capacitor applications
A CMOS operational transconductance amplifier (OTA) using a fully differential single-stage core OTA as the input stage and a differential to single current converter as the output stage, each biased at a separate current level, is presented. A large gain-bandwidth product (2.7 MHz) and a high slew-rate (5 V/μs) can be obtained by applying a large bias current to the core OTA. Due to the class-AB operation of the output stage, a high output impedance can be obtained by applying a small bias current to the output stage, resulting in a high DC-gain (61.6 dB). When the performance of this class-AB OTA is compared with that of basic single-stage OTAs it is found that the output impedance of the class-AB OTA is increased without limiting the bandwidth or slew-rat
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