A Survey of Techniques For Improving Energy Efficiency in Embedded Computing Systems

Recent technological advances have greatly improved the performance and features of embedded systems. With the number of just mobile devices now reaching nearly equal to the population of earth, embedded systems have truly become ubiquitous. These trends, however, have also made the task of managing their power consumption extremely challenging. In recent years, several techniques have been proposed to address this issue. In this paper, we survey the techniques for managing power consumption of embedded systems. We discuss the need of power management and provide a classification of the techniques on several important parameters to highlight their similarities and differences. This paper is intended to help the researchers and application-developers in gaining insights into the working of power management techniques and designing even more efficient high-performance embedded systems of tomorrow

CROSS-LAYER CUSTOMIZATION FOR LOW POWER AND HIGH PERFORMANCE EMBEDDED MULTI-CORE PROCESSORS

Due to physical limitations and design difficulties, computer processor architecture has shifted to multi-core and even many-core based approaches in recent years. Such architectures provide potentials for sustainable performance scaling into future peta-scale/exa-scale computing platforms, at affordable power budget, design complexity, and verification efforts. To date, multi-core processor products have been replacing uni-core processors in almost every market segment, including embedded systems, general-purpose desktops and laptops, and super computers. However, many issues still remain with multi-core processor architectures that need to be addressed before their potentials could be fully realized. People in both academia and industry research community are still seeking proper ways to make efficient and effective use of these processors. The issues involve hardware architecture trade-offs, the system software service, the run-time management, and user application design, which demand more research effort into this field. Due to the architectural specialties with multi-core based computers, a Cross-Layer Customization framework is proposed in this work, which combines application specific information and system platform features, along with necessary operating system service support, to achieve exceptional power and performance efficiency for targeted multi-core platforms. Several topics are covered with specific optimization goals, including snoop cache coherence protocol, inter-core communication for producer-consumer applications, synchronization mechanisms, and off-chip memory bandwidth limitations. Analysis of benchmark program execution with conventional mechanisms is made to reveal the overheads in terms of power and performance. Specific customizations are proposed to eliminate such overheads with support from hardware, system software, compiler, and user applications. Experiments show significant improvement on system performance and power efficiency

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

05141 Abstracts Collection -- Power-aware Computing Systems

From 03.04.05 to 08.04.05, the Dagstuhl Seminar 05141 ``Power-aware Computing Systems\u27\u27 was held in the International Conference and Research Center (IBFI), Schloss Dagstuhl. During the seminar, several participants presented their current research, and ongoing work and discussed open problems. Abstracts of the presentations given during the seminar as well as abstracts of seminar results and ideas are collected in this paper. The first section describes the seminar topics and goals. Links to extended abstracts or full papers are provided, if available

A Detailed Analysis of Contemporary ARM and x86 Architectures

RISC vs. CISC wars raged in the 1980s when chip area and processor design complexity were the primary constraints and desktops and servers exclusively dominated the computing landscape. Today, energy and power are the primary design constraints and the computing landscape is significantly different: growth in tablets and smartphones running ARM (a RISC ISA) is surpassing that of desktops and laptops running x86 (a CISC ISA). Further, the traditionally low-power ARM ISA is entering the high-performance server market, while the traditionally high-performance x86 ISA is entering the mobile low-power device market. Thus, the question of whether ISA plays an intrinsic role in performance or energy efficiency is becoming important, and we seek to answer this question through a detailed measurement based study on real hardware running real applications. We analyze measurements on the ARM Cortex-A8 and Cortex-A9 and Intel Atom and Sandybridge i7 microprocessors over workloads spanning mobile, desktop, and server computing. Our methodical investigation demonstrates the role of ISA in modern microprocessors? performance and energy efficiency. We find that ARM and x86 processors are simply engineering design points optimized for different levels of performance, and there is nothing fundamentally more energy efficient in one ISA class or the other. The ISA being RISC or CISC seems irrelevant

Effective memory management for mobile environments

Smartphones, tablets, and other mobile devices exhibit vastly different constraints compared to regular or classic computing environments like desktops, laptops, or servers. Mobile devices run dozens of so-called “apps” hosted by independent virtual machines (VM). All these VMs run concurrently and each VM deploys purely local heuristics to organize resources like memory, performance, and power. Such a design causes conflicts across all layers of the software stack, calling for the evaluation of VMs and the optimization techniques specific for mobile frameworks. In this dissertation, we study the design of managed runtime systems for mobile platforms. More specifically, we deepen the understanding of interactions between garbage collection (GC) and system layers. We develop tools to monitor the memory behavior of Android-based apps and to characterize GC performance, leading to the development of new techniques for memory management that address energy constraints, time performance, and responsiveness. We implement a GC-aware frequency scaling governor for Android devices. We also explore the tradeoffs of power and performance in vivo for a range of realistic GC variants, with established benchmarks and real applications running on Android virtual machines. We control for variation due to dynamic voltage and frequency scaling (DVFS), Just-in-time (JIT) compilation, and across established dimensions of heap memory size and concurrency. Finally, we provision GC as a global service that collects statistics from all running VMs and then makes an informed decision that optimizes across all them (and not just locally), and across all layers of the stack. Our evaluation illustrates the power of such a central coordination service and garbage collection mechanism in improving memory utilization, throughput, and adaptability to user activities. In fact, our techniques aim at a sweet spot, where total on-chip energy is reduced (20–30%) with minimal impact on throughput and responsiveness (5–10%). The simplicity and efficacy of our approach reaches well beyond the usual optimization techniques