Fabrication and analysis of 4H-SiC diodes

Despite the excellent electrical and thermal properties of 4H-silicon carbide (SiC) and the advancements in the field of 4H-SiC epitaxial growth, the existence of defects in the material can considerably reduce the electrical performance of the SiC power devices. Defects can result in low carrier lifetime affecting the on-state resistance of bipolar devices, such as PiN diodes, and increased leakage current affecting the reverse blocking performance of power devices, such as Schottky diodes. A commonly found surface morphological defect in available 4H-SiC substrates is the triangular defect. In this thesis, the formation mechanism of this defect and its impact on the electrical performance of the fabricated 4H-SiC PiN diodes is discussed. 4H-SiC PiN diodes were intentionally fabricated on the triangular defects and in areas with no visible morphological defects. The devices were then packaged and tested to assess the impact of these defects on the resulting on-state and reverse leakage characteristics. It was shown for the first time the impact of triangular defects on switching characteristics of 4H-SiC PiN diodes fabricated on- and off-defects. Moreover, triangular defects were characterised using methods including AFM, SEM, Photoluminescence and HRTEM. Other complex structures were observed on the triangular defect using HRTEM such as double positioning boundary (DPB), which resulted in a leakage path through the drift region of the devices and increased the leakage current. Furthermore, this thesis focuses on the fabrication and analysis of 4H-SiC power diodes for high voltage applications with particular focus on improving the performance of 4H-SiC SBDs using a novel metal-semiconductor interface treatment and 4H-SiC PiN diodes using high temperature processing techniques to improve the carrier lifetime, on-state resistance and conductivity modulation of the diode. Carrier lifetime enhancement in 4H-SiC PiN diodes in this thesis was achieved using a combined high temperature oxidation and successive argon annealing process at 1550°C for 1 hour. This resulted in an increase of nearly 45% of the reverse recovery current and approximately 40% of the carrier lifetime. The findings of this study could be potentially used for other 4H-SiC bipolar devices such as IGBTs, BJTs and thyristors. This thesis has also investigated the impact of various surface passivation treatments to improve the quality of the 4H-SiC surface and the metal-semiconductor interface using Mo/Ti, and Ni-4H-SiC Schottky diodes. The most significant outcome of this investigation was the performance of P2O5 treated Mo/SiC Schottky diodes which retained a barrier height equivalent to that of titanium, but with a leakage current lower than any Ni diode, seemingly combining the benefits of both a low- and high-SBH metal. Furthermore, P2O5 treated Mo/SiC Schottky diodes were the only diodes to undergo any significant leakage current reduction after any of the pre-treatments exhibiting exceptionally low leakage, even at 300°C. XPS and SIMS analysis on all Mo/SiC SBDs revealed that the stoichiometry of the SiC underneath the contact was enhanced using P2O5 treatment and that traces of P2O5 were found after removal of the passivation layer and post-treatment metallisation. It was also found that the Mo-4HSiC interface on the P2O5 treated sample was very sharp and uniform compared to the untreated sample where Mo-SiC interface looks uneven and cloudy. The developed novel metal-semiconductor interface treatment can be potentially used for MOS interface improvements

Feature Papers in Electronic Materials Section

This book entitled "Feature Papers in Electronic Materials Section" is a collection of selected papers recently published on the journal Materials, focusing on the latest advances in electronic materials and devices in different fields (e.g., power- and high-frequency electronics, optoelectronic devices, detectors, etc.). In the first part of the book, many articles are dedicated to wide band gap semiconductors (e.g., SiC, GaN, Ga2O3, diamond), focusing on the current relevant materials and devices technology issues. The second part of the book is a miscellaneous of other electronics materials for various applications, including two-dimensional materials for optoelectronic and high-frequency devices. Finally, some recent advances in materials and flexible sensors for bioelectronics and medical applications are presented at the end of the book

The 2018 GaN power electronics roadmap

GaN is a compound semiconductor that has a tremendous potential to facilitate economic growth in a semiconductor industry that is silicon-based and currently faced with diminishing returns of performance versus cost of investment. At a material level, its high electric field strength and electron mobility have already shown tremendous potential for high frequency communications and photonic applications. Advances in growth on commercially viable large area substrates are now at the point where power conversion applications of GaN are at the cusp of commercialisation. The future for building on the work described here in ways driven by specific challenges emerging from entirely new markets and applications is very exciting. This collection of GaN technology developments is therefore not itself a road map but a valuable collection of global state-of-the-art GaN research that will inform the next phase of the technology as market driven requirements evolve. First generation production devices are igniting large new markets and applications that can only be achieved using the advantages of higher speed, low specific resistivity and low saturation switching transistors. Major investments are being made by industrial companies in a wide variety of markets exploring the use of the technology in new circuit topologies, packaging solutions and system architectures that are required to achieve and optimise the system advantages offered by GaN transistors. It is this momentum that will drive priorities for the next stages of device research gathered here

Komponente na bazi silicijum karbida u elektronskim kolima velike snage

Silicon has been the number one choice of materials for over 40 years. It has reached an almost perfected stage through extensive research for so many years; now it is cheap to be manufactured and performs very reliably at room temperature. However, as modem electronics move to a more advanced level with increasing complexity, materials other than silicon are under consideration. Several areas where Silicon shows shortcomings in high temperature environments and high voltage conditions. The Silicon devices need to be shielded – cooled, are limited to operation at low temperature and low blocking voltage by virtue physical and electric properties. So silicon devices are restricted and have focused on low power electronics applications only, these various limitations in the use of Si devices has led to development of wide band gap semiconductors such as Silicon carbide . And because there is an urgent need for high voltage electronics for advanced technology represented in (transportation - space - communications - power systems) in which silicon has failed to be used. Due to various properties of Silicon carbide like lower intrinsic carrier concentration (10–35 orders of magnitude), higher electric breakdown field (4–20 times), higher thermal conductivity (3–13 times), larger saturated electron drift velocity (2–2.5 times),wide band gap (2.2 eV) and higher, more isotropic bulk electron mobility comparable to that of Si. These properties make it a potential material to overcome the limitations of Si. The fact that wide band gap semiconductors are capable of electronic functionality, particularly in the case of SiC. 4H-SiC is a potentially useful material for high temperature devices because of its refractory nature. So Silicon Carbide (SiC) will bring solid-state power electronics to a new horizon by expanding to applications in the high voltage power electronics sectors. It is the better choice for use in high temperature environment and high voltage conditions. Silicon carbide is about to replace Si material very quickly and scientifically will force Si to get retired. The superior characteristics of silicon carbide, have suggested considering as the next generation of power semiconductor devices. And because our study will concentrate on the use of semiconductors on high voltage unipolar power electronics devices. DIMOSFET will be..

Analysis of performance of SiC bipolar semiconductor devices for grid-level converters

Recent commercialization of SiC bipolar devices, including SiC BJT, SiC MPS diode and SiC PiN diodes have enabled potential candidates to replace their SiC unipolar counterparts. However, the prospects of 4H-SiC power bipolar devices still need further investigation. This thesis compares the static and dynamic performance and reliability for the commercial SiC bipolar devices including SiC BJT, SiC MPS diode and SiC PiN diode and their similarly rated Silicon counterparts mainly by means of experimental measurements.Through comprehensive double-pulse measurements, the turn-on and turn-off transition in Silicon BJT is seen to be much slower than that of the SiC BJT while the transient time will increase with temperature and decreases with collector currents. The common-emitter current gain (β) of SiC BJT is also found to be much higher than its Silicon counterpart. Significant turn-off delay is observed in single Si BJT which becomes worse when in parallel connection as it aggravates the current mismatch across the two devices, while this delay is almost non-existent in SiC devices. The current collapse seen in single SiC BJT is mitigated by parallel connection. These are dependant on temperature and base resistance, especially in the case of Silicon BJT. The static performance of power Silicon and SiC BJT has also been evaluated. It has been found that the higher base-emitter junction voltage of SiC BJTs enables quasi-saturation mode of operation with low on-resistance, which is also the case for Silicon BJTs only at high base currents. In terms of DC gain measured under steady state operation, the observed negative temperature coefficient (NTC) of β in SiC BJTs and the positive coefficient (PTC) in Silicon BJTs can make the β of SiC BJT lower than that in Silicon at high temperatures. It has been found that parallel connection promotes both the on-state conductivity and current gain in Silicon BJTs and conductivity in SiC BJTs.The characterization of power diodes reveals that the superior switching performance of the SiC MPS & JBS diode when compared with the Si PiN diode is due to the absence of the stored charge. This also leads to the larger on-state voltage in both SiC diodes and becomes worse at high currents under high temperatures. Through comprehensive Unclamped Inductive Switching (UIS) measurements, it is seen that the avalanche ruggedness of SiC MPS & JBS diodes outperform that of the closely rated Silicon PiN diode taking advantage of the wide-bandgap properties of SiC. Higher critical avalanche energy and thus better avalanche ruggedness can also be observed in SiC JBS diode compared with the SiC MPS diode. SiC MPS diodes can compete with Si PiN diodes in terms of the surge current limits, while the SiC JBS diode failed under a lower electrothermal stress. This is observed by the dramatic increase in its reverse leakage current at lower voltages.The 15 kV SiC PiN diodes feature smaller device dimensions, less reverse recovery charge and less on-resistance when compared to the 15 kV Silicon PiN diodes. Nevertheless, when evaluating its long-term reliability by using the aggravated power cycling configuration, the high junction temperature together with the dislocation defects in the SiC PiN diode accelerate its degradation. Such degradations are not observed in Silicon PiN diodes for the same junction temperature and high-temperature stress periods

Journal of Telecommunications and Information Technology, 2000, nr 3,4

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