Methodology for Standby Leakage Power Reduction in Nanometer-Scale CMOS Circuits

In nanometer-scale CMOS technology, leakage power has become a major component of the total power dissipation due to the downscaling of threshold voltage and gate oxide thickness. The leakage power consumption has received even more attention by increasing demand for mobile devices. Since mobile devices spend a majority of their time in a standby mode, the leakage power savings in standby state is critical to extend battery lifetime. For this reason, low power has become a major factor in designing CMOS circuits. In this dissertation, we propose a novel transistor reordering methodology for leakage reduction. Unlike previous technique, the proposed method provides exact reordering rules for minimum leakage formation by considering all leakage components. Thus, this method formulates an optimized structure for leakage reduction even in complex CMOS logic gate, and can be used in combination with other leakage reduction techniques to achieve further improvement. We also propose a new standby leakage reduction methodology, leakage-aware body biasing, to overcome the shortcomings of a conventional Reverse Body Biasing (RBB) technique. The RBB technique has been used to reduce subthreshold leakage current. Therefore, this technique works well under subthreshold dominant region even though it has intrinsic structural drawbacks. However, such drawbacks cannot be overlooked anymore since gate leakage has become comparable to subthreshold leakage in nanometer-scale region. In addition, BTBT leakage also increases with technology scaling due to the higher doping concentration applied in each process technology. In these circumstances, the objective of leakage minimization is not a single leakage source but the overall leakage sources. The proposed leakage-aware body biasing technique, unlike conventional RBB technique, considers all major leakage sources to minimize the negative effects of existing body biasing approach. This can be achieved by intelligently applying body bias to appropriate CMOS network based on its status (on-/off-state) with the aid of a pin/transistor reordering technique

Cross-Layer Resiliency Modeling and Optimization: A Device to Circuit Approach

The never ending demand for higher performance and lower power consumption pushes the VLSI industry to further scale the technology down. However, further downscaling of technology at nano-scale leads to major challenges. Reduced reliability is one of them, arising from multiple sources e.g. runtime variations, process variation, and transient errors. The objective of this thesis is to tackle unreliability with a cross layer approach from device up to circuit level

Energy Aware Design and Analysis for Synchronous and Asynchronous Circuits

Power dissipation has become a major concern for IC designers. Various low power design techniques have been developed for synchronous circuits. Asynchronous circuits, however. have gained more interests recently due to their benefits in lower noise, easy timing control, etc. But few publications on energy reduction techniques for asynchronous logic are available. Power awareness indicates the ability of the system power to scale with changing conditions and quality requirements. Scalability is an important figure-of-merit since it allows the end user to implement operational policy. just like the user of mobile multimedia equipment needs to select between better quality and longer battery operation time. This dissertation discusses power/energy optimization and performs analysis on both synchronous and asynchronous logic. The major contributions of this dissertation include: 1 ) A 2-Dimensional Pipeline Gating technique for synchronous pipelined circuits to improve their power awareness has been proposed. This technique gates the corresponding clock lines connected to registers in both vertical direction (the data flow direction) and horizontal direction (registers within each pipeline stage) based on current input precision. 2) Two energy reduction techniques, Signal Bypassing & Insertion and Zero Insertion. have been developed for NCL circuits. Both techniques use Nulls to replace redundant Data 0\u27s based on current input precision in order to reduce the switching activity while Signal Bypassing & Insertion is for non-pipelined NCI, circuits and Zero Insertion is for pipelined counterparts. A dynamic active-bit detection scheme is also developed as an expansion. 3) Two energy estimation techniques, Equivalent Inverter Modeling based on Input Mapping in transistor-level and Switching Activity Modeling in gate-level, have been proposed. The former one is for CMOS gates with feedbacks and the latter one is for NCL circuits

Synthesis and Optimization of Reversible Circuits - A Survey

Reversible logic circuits have been historically motivated by theoretical research in low-power electronics as well as practical improvement of bit-manipulation transforms in cryptography and computer graphics. Recently, reversible circuits have attracted interest as components of quantum algorithms, as well as in photonic and nano-computing technologies where some switching devices offer no signal gain. Research in generating reversible logic distinguishes between circuit synthesis, post-synthesis optimization, and technology mapping. In this survey, we review algorithmic paradigms --- search-based, cycle-based, transformation-based, and BDD-based --- as well as specific algorithms for reversible synthesis, both exact and heuristic. We conclude the survey by outlining key open challenges in synthesis of reversible and quantum logic, as well as most common misconceptions.Comment: 34 pages, 15 figures, 2 table

FORCED STACK SLEEP TRANSISTOR (FORTRAN): A NEW LEAKAGE CURRENT REDUCTION APPROACH IN CMOS BASED CIRCUIT DESIGNING

Reduction in leakage current has become a significant concern in nanotechnology-based low-power, low-voltage, and high-performance VLSI applications. This research article discusses a new low-power circuit design the approach of FORTRAN (FORced stack sleep TRANsistor), which decreases the leakage power efficiency in the CMOS-based circuit outline in VLSI domain. FORTRAN approach reduces leakage current in both active as well as standby modes of operation. Furthermore, it is not time intensive when the circuit goes from active mode to standby mode and vice-versa. To validate the proposed design approach, experiments are conducted in the Tanner EDA tool of mentor graphics bundle on projected circuit designs for the full adder, a chain of 4-inverters, and 4-bit multiplier designs utilizing 180nm, 130nm, and 90nm TSMC technology node. The outcomes obtained show the result of a 95-98% vital reduction in leakage power as well as a 15-20% reduction in dynamic power with a minor increase in delay. The result outcomes are compared for accuracy with the notable design approaches that are accessible for both active and standby modes of operation

Impact of Technology Scaling on Leakage Reduction Techniques

CMOS technology is scaling down to meet the performance, production cost, and power requirements of the microelectronics industry. The increase in the transistor leakage current is one of the most important negative side effects of technology scaling. Leakage affects not only the standby and active power consumption, but also the circuit reliability, since it is strongly correlated to the process variations. Leakage current influences circuit performance differently depending on: operating conditions (e.g., standby, active, burn in test), circuit family (e.g., logic or memory), and environmental conditions (e.g., temperature, supply voltage). Until the introduction of high-K gate dielectrics in the lower nanometer technology nodes, gate leakage will remain the dominant leakage component after subthreshold leakage. Since the way designers control subthreshold and gate leakage can change from one technology to another, it is crucial for them to be aware of the impact of the total leakage on the operation of circuits and the techniques that mitigate it. Consequently, techniques that reduce total leakage in circuits operating in the active mode at different temperature conditions are examined. Also, the implications of technology scaling on the choice of techniques to mitigate total leakage are investigated. This work resulted in guidelines for the design of low-leakage circuits in nanometer technologies. Logic gates in the 65nm, 45nm, and 32nm nodes are simulated and analyzed. The techniques that are adopted for comparison in this work affect both gate and subthreshold leakage, namely, stack forcing, pin reordering, reverse body biasing, and high threshold voltage transistors. Aside from leakage, our analysis also highlights the impact of these techniques on the circuit's performance and noise margins. The reverse body biasing scheme tends to be less effective as the technology scales since this scheme increases the band to band tunneling current. Employing high threshold voltage transistors seems to be one of the most effective techniques for reducing leakage with minor performance degradation. Pin reordering and natural stacks are techniques that do not affect the performance of the device, yet they reduce leakage. However, it is demonstrated that they are not as effective in all types of logic since the input values might switch only between the highly leaky states. Therefore, depending on the design requirements of the circuit, a combination, or hybrid of techniques which can result in better performance and leakage savings, is chosen. Power sensitive technology mapping tools can use the guidelines found as a result of the research in the low power design flow to meet the required maximum leakage current in a circuit. These guidelines are presented in general terms so that they can be adopted for any application and process technology

Circuit designs for low-power and SEU-hardened systems

The desire to have smaller and faster portable devices is one of the primary motivations for technology scaling. Though advancements in device physics are moving at a very good pace, they might not be aggressive enough for now-a-day technology scaling trends. As a result, the MOS devices used for present day integrated circuits are pushed to the limit in terms of performance, power consumption and robustness, which are the most critical criteria for almost all applications. Secondly, technology advancements have led to design of complex chips with increasing chip densities and higher operating speeds. The design of such high performance complex chips (microprocessors, digital signal processors, etc) has massively increased the power dissipation and, as a result, the operating temperatures of these integrated circuits. In addition, due to the aggressive technology scaling the heat withstanding capabilities of the circuits is reducing, thereby increasing the cost of packaging and heat sink units. This led to the increase in prominence for smarter and more robust low-power circuit and system designs. Apart from power consumption, another criterion affected by technology scaling is robustness of the design, particularly for critical applications (security, medical, finance, etc). Thus, the need for error free or error immune designs. Until recently, radiation effects were a major concern in space applications only. With technology scaling reaching nanometer level, terrestrial radiation has become a growing concern. As a result Single Event Upsets (SEUs) have become a major challenge to robust designs. Single event upset is a temporary change in the state of a device due to a particle strike (usually from the radiation belts or from cosmic rays) which may manifest as an error at the output. This thesis proposes a novel method for adaptive digital designs to efficiently work with the lowest possible power consumption. This new technique improves options in performance, robustness and power. The thesis also proposes a new dual data rate flipflop, which reduces the necessary clock speed by half, drastically reducing the power consumption. This new dual data rate flip-flop design culminates in a proposed unique radiation hardened dual data rate flip-flop, Firebird\u27. Firebird offers a valuable addition to the future circuit designs, especially with the increasing importance of the Single Event Upsets (SEUs) and power dissipation with technology scaling.\u2

Nanowire systems: technology and design (invited paper)

Nanosystems are large-scale integrated systems exploiting nanoelectronic devices. In this work, we consider double independent gate, vertically-stacked nanowire FETs with gate-all-around structures and typical diameter of 20-nm. These devices, which we have successfully fabricated and evaluated, control the ambipolar behavior of the nanostructure by selectively enabling one type of carriers. These transistors work as switches with electrically-programmable polarity and thus realize an exclusive or operation. The intrinsic higher expressive power of these FETs, as compared to standard CMOS, enables us to realize more efficient library cells, which we organize as tiles to realize circuits by regular arrays. This article surveys both the technology for double independent gate FETs as well as physical and logic design tools to realize digital systems with this fabrication technology

Optimization of power and delay in VLSI circuits using transistor sizing and input ordering

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1994.Includes bibliographical references (p. 85-88).by Chin Hwee Tan.M.S