Social Insect-Inspired Adaptive Hardware

Modern VLSI transistor densities allow large systems to be implemented within a single chip. As technologies get smaller, fundamental limits of silicon devices are reached resulting in lower design yields and post-deployment failures. Many-core systems provide a platform for leveraging the computing resource on offer by deep sub-micron technologies and also offer high-level capabilities for mitigating the issues with small feature sizes. However, designing for many-core systems that can adapt to in-field failures and operation variability requires an extremely large multi-objective optimisation space. When a many-core reaches the size supported by the densities of modern technologies (thousands of processing cores), finding design solutions in this problem space becomes extremely difficult. Many biological systems show properties that are adaptive and scalable. This thesis proposes a self-optimising and adaptive, yet scalable, design approach for many-core based on the emergent behaviours of social-insect colonies. In these colonies there are many thousands of individuals with low intelligence who contribute, without any centralised control, to complete a wide range of tasks to build and maintain the colony. The experiments presented translate biological models of social-insect intelligence into simple embedded intelligence circuits. These circuits sense low-level system events and use this manage the parameters of the many-core's Network-on-Chip (NoC) during runtime. Centurion, a 128-node many-core, was created to investigate these models at large scale in hardware. The results show that, by monitoring a small number of signals within each NoC router, task allocation emerges from the social-insect intelligence models that can self-configure to support representative applications. It is demonstrated that emergent task allocation supports fault tolerance with no extra hardware overhead. The response-threshold decision making circuitry uses a negligible amount of hardware resources relative to the size of the many-core and is an ideal technology for implementing embedded intelligence for system runtime management of large-complexity single-chip systems

Development of ASIC for SiPM sensor readout

L'abstract è presente nell'allegato / the abstract is in the attachmen

Self-diagnosis implantable optrode for optogenetic stimulation

PhD ThesisAs a cell type-specific neuromodulation method, optogenetic technique holds remarkable potential for the realisation of advanced neuroprostheses. By genetically expressing light-sensitive proteins such as channelrhodopsin-2 (ChR2) in cell membranes, targeted neurons could be controlled by blue light. This new neuromodulation technique could then be applied into extensive brain networks and be utilised to provide effective therapies for neurological disorders. However, the development of novel optogenetic implants is still a key challenge in the field. The major requirements include small device dimensions, suitable spatial resolution, high safety, and strong controllability. In particular, appropriate implantable electronics are expected to be built into the device, accomplishing a new-generation intelligent optogenetic implant. To date, different microfabrication techniques, such as wave-guided laser/light-emitting diode (LED) structure and μLED-on-optrode structure, have been widely explored to create and miniaturise optogenetic implants. However, although these existing devices meet the requirements to some extent, there is still considerable room for improvement. In this thesis, a Complementary Metal-Oxide-Semiconductor (CMOS)-driven μLED approach is proposed to develop an advanced implantable optrode. This design is based on the μLED-on-optrode structure, where Gallium Nitride (GaN) μLEDs can be directly bonded to provide precise local light delivery and multi-layer stimulation. Moreover, an in-built diagnostic sensing circuitry is designed to monitor optrode integrity and degradation. This self-diagnosis function greatly improves system reliability and safety. Furthermore, in-situ temperature sensors are incorporated to monitor the local thermal effects of light emitters. This ensures both circuitry stability and tissue health. More importantly, external neural recording circuitry is integrated into the implant, which could observe local neural signals in the vicinity of the stimulation sites. Therefore, a CMOS-based multi-sensor optogenetic implant is achieved, and this closed-loop neural interface is capable of performing multichannel optical neural stimulation and electrical neural recording simultaneously. This optrode is expected to represent a promising neural interface for broad neuroprosthesis applications

Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours

Spin and magnetotransport properties of narrow gap semiconductors

Imperial Users onl

CMOS SPAD-based image sensor for single photon counting and time of flight imaging

The facility to capture the arrival of a single photon, is the fundamental limit to the detection of quantised electromagnetic radiation. An image sensor capable of capturing a picture with this ultimate optical and temporal precision is the pinnacle of photo-sensing. The creation of high spatial resolution, single photon sensitive, and time-resolved image sensors in complementary metal oxide semiconductor (CMOS) technology offers numerous benefits in a wide field of applications. These CMOS devices will be suitable to replace high sensitivity charge-coupled device (CCD) technology (electron-multiplied or electron bombarded) with significantly lower cost and comparable performance in low light or high speed scenarios. For example, with temporal resolution in the order of nano and picoseconds, detailed three-dimensional (3D) pictures can be formed by measuring the time of flight (TOF) of a light pulse. High frame rate imaging of single photons can yield new capabilities in super-resolution microscopy. Also, the imaging of quantum effects such as the entanglement of photons may be realised. The goal of this research project is the development of such an image sensor by exploiting single photon avalanche diodes (SPAD) in advanced imaging-specific 130nm front side illuminated (FSI) CMOS technology. SPADs have three key combined advantages over other imaging technologies: single photon sensitivity, picosecond temporal resolution and the facility to be integrated in standard CMOS technology. Analogue techniques are employed to create an efficient and compact imager that is scalable to mega-pixel arrays. A SPAD-based image sensor is described with 320 by 240 pixels at a pitch of 8μm and an optical efficiency or fill-factor of 26.8%. Each pixel comprises a SPAD with a hybrid analogue counting and memory circuit that makes novel use of a low-power charge transfer amplifier. Global shutter single photon counting images are captured. These exhibit photon shot noise limited statistics with unprecedented low input-referred noise at an equivalent of 0.06 electrons. The CMOS image sensor (CIS) trends of shrinking pixels, increasing array sizes, decreasing read noise, fast readout and oversampled image formation are projected towards the formation of binary single photon imagers or quanta image sensors (QIS). In a binary digital image capture mode, the image sensor offers a look-ahead to the properties and performance of future QISs with 20,000 binary frames per second readout with a bit error rate of 1.7 x 10-3. The bit density, or cumulative binary intensity, against exposure performance of this image sensor is in the shape of the famous Hurter and Driffield densitometry curves of photographic film. Oversampled time-gated binary image capture is demonstrated, capturing 3D TOF images with 3.8cm precision in a 60cm range