Radiometric infrared focal plane array imaging system for thermographic applications

This document describes research performed under the Radiometric Infrared Focal Plane Array Imaging System for Thermographic Applications contract. This research investigated the feasibility of using platinum silicide (PtSi) Schottky-barrier infrared focal plane arrays (IR FPAs) for NASA Langley's specific radiometric thermal imaging requirements. The initial goal of this design was to develop a high spatial resolution radiometer with an NETD of 1 percent of the temperature reading over the range of 0 to 250 C. The proposed camera design developed during this study and described in this report provides: (1) high spatial resolution (full-TV resolution); (2) high thermal dynamic range (0 to 250 C); (3) the ability to image rapid, large thermal transients utilizing electronic exposure control (commandable dynamic range of 2,500,000:1 with exposure control latency of 33 ms); (4) high uniformity (0.5 percent nonuniformity after correction); and (5) high thermal resolution (0.1 C at 25 C background and 0.5 C at 250 C background)

Study of spin-scan imaging for outer planets missions

The constraints that are imposed on the Outer Planet Missions (OPM) imager design are of critical importance. Imager system modeling analyses define important parameters and systematic means for trade-offs applied to specific Jupiter orbiter missions. Possible image sequence plans for Jupiter missions are discussed in detail. Considered is a series of orbits that allow repeated near encounters with three of the Jovian satellites. The data handling involved in the image processing is discussed, and it is shown that only minimal processing is required for the majority of images for a Jupiter orbiter mission

Detection and analysis of single event upsets in noisy digital imagers with small to medium pixels

Camera sensors are shrinking, resulting in more defects seen through image analysis. Due to cosmic radiation, camera experience both permanent defects known as hot pixels and temporal defective spikes which are Single Event Upsets (SEUs). SEUs manifest themselves as temporal random bright areas in sequential dark-frame images that are taken with long exposure times. In the past, it was difficult to separate SEUs from noise in dark-frame images taken with DSLRs at high sensitivity levels (ISO) and cell phone cameras at modest sensitivity levels. However, recent software improvements in this research have enabled the analysis of defect rates in noisy digital imagers – by leveraging local area and pixel address distribution techniques. In addition, multiple experiments were performed to understand the relationship of SEUs and elevation. This study reports data from imagers with pixels ranging from 7 μm (DSLR cameras) down to 1.2 μm (cell phone cameras)

Defect and thickness inspection system for cast thin films using machine vision and full-field transmission densitometry

Quick mass production of homogeneous thin film material is required in paper, plastic, fabric, and thin film industries. Due to the high feed rates and small thicknesses, machine vision and other nondestructive evaluation techniques are used to ensure consistent, defect-free material by continuously assessing post-production quality. One of the fastest growing inspection areas is for 0.5-500 micrometer thick thin films, which are used for semiconductor wafers, amorphous photovoltaics, optical films, plastics, and organic and inorganic membranes. As a demonstration application, a prototype roll-feed imaging system has been designed to inspect high-temperature polymer electrolyte membrane (PEM), used for fuel cells, after being die cast onto a moving transparent substrate. The inspection system continuously detects thin film defects and classifies them with a neural network into categories of holes, bubbles, thinning, and gels, with a 1.2% false alarm rate, 7.1% escape rate, and classification accuracy of 96.1%. In slot die casting processes, defect types are indicative of a misbalance in the mass flow rate and web speed; so, based on the classified defects, the inspection system informs the operator of corrective adjustments to these manufacturing parameters. Thickness uniformity is also critical to membrane functionality, so a real-time, full-field transmission densitometer has been created to measure the bi-directional thickness profile of the semi-transparent PEM between 25-400 micrometers. The local thickness of the 75 mm x 100 mm imaged area is determined by converting the optical density of the sample to thickness with the Beer-Lambert law. The PEM extinction coefficient is determined to be 1.4 D/mm and the average thickness error is found to be 4.7%. Finally, the defect inspection and thickness profilometry systems are compiled into a specially-designed graphical user interface for intuitive real-time operation and visualization.M.S.Committee Chair: Tequila Harris; Committee Member: Levent Degertekin; Committee Member: Wayne Dale

Design and Characterization of an 8x8 Lateral Detector Array for Digital X-Ray Imaging

X-ray imaging has become one of the most pervasive and effective means of diagnosis in medical clinics today. As more imaging systems transition to digital modes of capture and storage, new applications of x-ray imaging, such as tomosynthesis, become feasible. These new imaging modalities have the potential to expose patients to large amounts of radiation so the necessity to use sensitive imagers that reduce dose and increase contrast is essential. An experimental design that utilizes laterally oriented detectors and amorphous semiconductors on crystalline silicon substrates has been undertaken in this study. Emphasis on fabricating a device suitable for medical x-ray imaging is the key principle throughout the design process. This study investigates the feasibility and efficiency of a new type of x-ray imager that combines the high speed, low noise, and potential complexity of CMOS circuit design with the high responsivity, large area uniformity, and flexibility of amorphous semiconductors. Results show that the design tradeoffs made in order to create a low cost, high fill factor, and high speed imager are realistic. The device exhibits good responsively to optical light, possesses a sufficient capacitive well, and maintains CMOS characteristics. This study demonstrates that with sufficient optimization it may be possible to design and deploy real time x-ray system on chip imagers similar to those used in optical imaging

INTEGRATED SINGLE-PHOTON SENSING AND PROCESSING PLATFORM IN STANDARD CMOS

Practical implementation of large SPAD-based sensor arrays in the standard CMOS process has been fraught with challenges due to the many performance trade-offs existing at both the device and the system level [1]. At the device level the performance challenge stems from the suboptimal optical characteristics associated with the standard CMOS fabrication process. The challenge at the system level is the development of monolithic readout architecture capable of supporting the large volume of dynamic traffic, associated with multiple single-photon pixels, without limiting the dynamic range and throughput of the sensor. Due to trade-offs in both functionality and performance, no general solution currently exists for an integrated single-photon sensor in standard CMOS single photon sensing and multi-photon resolution. The research described herein is directed towards the development of a versatile high performance integrated SPAD sensor in the standard CMOS process. Towards this purpose a SPAD device with elongated junction geometry and a perimeter field gate that features a large detection area and a highly reduced dark noise has been presented and characterized. Additionally, a novel front-end system for optimizing the dynamic range and after-pulsing noise of the pixel has been developed. The pixel is also equipped with an output interface with an adjustable pulse width response. In order to further enhance the effective dynamic range of the pixel a theoretical model for accurate dead time related loss compensation has been developed and verified. This thesis also introduces a new paradigm for electrical generation and encoding of the SPAD array response that supports fully digital operation at the pixel level while enabling dynamic discrete time amplitude encoding of the array response. Thus offering a first ever system solution to simultaneously exploit both the dynamic nature and the digital profile of the SPAD response. The array interface, comprising of multiple digital inputs capacitively coupled onto a shared quasi-floating sense node, in conjunction with the integrated digital decoding and readout electronics represents the first ever solid state single-photon sensor capable of both photon counting and photon number resolution. The viability of the readout architecture is demonstrated through simulations and preliminary proof of concept measurements

Trade-off analysis of modes of data handling for earth resources (ERS), volume 1

Data handling requirements are reviewed for earth observation missions along with likely technology advances. Parametric techniques for synthesizing potential systems are developed. Major tasks include: (1) review of the sensors under development and extensions of or improvements in these sensors; (2) development of mission models for missions spanning land, ocean, and atmosphere observations; (3) summary of data handling requirements including the frequency of coverage, timeliness of dissemination, and geographic relationships between points of collection and points of dissemination; (4) review of data routing to establish ways of getting data from the collection point to the user; (5) on-board data processing; (6) communications link; and (7) ground data processing. A detailed synthesis of three specific missions is included

Software-Defined Lighting.

For much of the past century, indoor lighting has been based on incandescent or gas-discharge technology. But, with LED lighting experiencing a 20x/decade increase in flux density, 10x/decade decrease in cost, and linear improvements in luminous efficiency, solid-state lighting is finally cost-competitive with the status quo. As a result, LED lighting is projected to reach over 70% market penetration by 2030. This dissertation claims that solid-state lighting’s real potential has been barely explored, that now is the time to explore it, and that new lighting platforms and applications can drive lighting far beyond its roots as an illumination technology. Scaling laws make solid-state lighting competitive with conventional lighting, but two key features make solid-state lighting an enabler for many new applications: the high switching speeds possible using LEDs and the color palettes realizable with Red-Green-Blue-White (RGBW) multi-chip assemblies. For this dissertation, we have explored the post-illumination potential of LED lighting in applications as diverse as visible light communications, indoor positioning, smart dust time synchronization, and embedded device configuration, with an eventual eye toward supporting all of them using a shared lighting infrastructure under a unified system architecture that provides software-control over lighting. To explore the space of software-defined lighting (SDL), we design a compact, flexible, and networked SDL platform to allow researchers to rapidly test new ideas. Using this platform, we demonstrate the viability of several applications, including multi-luminaire synchronized communication to a photodiode receiver, communication to mobile phone cameras, and indoor positioning using unmodified mobile phones. We show that all these applications and many other potential applications can be simultaneously supported by a single lighting infrastructure under software control.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111482/1/samkuo_1.pd

Satellite Ocean Color Sensor Design Concepts and Performance Requirements

In late 1978, the National Aeronautics and Space Administration (NASA) launched the Nimbus-7 satellite with the Coastal Zone Color Scanner (CZCS) and several other sensors, all of which provided major advances in Earth remote sensing. The inspiration for the CZCS is usually attributed to an article in Science by Clarke et al. who demonstrated that large changes in open ocean spectral reflectance are correlated to chlorophyll-a concentrations. Chlorophyll-a is the primary photosynthetic pigment in green plants (marine and terrestrial) and is used in estimating primary production, i.e., the amount of carbon fixed into organic matter during photosynthesis. Thus, accurate estimates of global and regional primary production are key to studies of the earth's carbon cycle. Because the investigators used an airborne radiometer, they were able to demonstrate the increased radiance contribution of the atmosphere with altitude that would be a major issue for spaceborne measurements. Since 1978, there has been much progress in satellite ocean color remote sensing such that the technique is well established and is used for climate change science and routine operational environmental monitoring. Also, the science objectives and accompanying methodologies have expanded and evolved through a succession of global missions, e.g., the Ocean Color and Temperature Sensor (OCTS), the Seaviewing Wide Field-of-view Sensor (SeaWiFS), the Moderate Resolution Imaging Spectroradiometer (MODIS), the Medium Resolution Imaging Spectrometer (MERIS), and the Global Imager (GLI). With each advance in science objectives, new and more stringent requirements for sensor capabilities (e.g., spectral coverage) and performance (e.g., signal-to-noise ratio, SNR) are established. The CZCS had four bands for chlorophyll and aerosol corrections. The Ocean Color Imager (OCI) recommended for the NASA Pre-Aerosol, Cloud, and Ocean Ecosystems (PACE) mission includes 5 nanometers hyperspectral coverage from 350 to 800 nanometers with three additional discrete near infrared (NIR) and shortwave infrared (SWIR) ocean aerosol correction bands. Also, to avoid drift in sensor sensitivity from being interpreted as environmental change, climate change research requires rigorous monitoring of sensor stability. For SeaWiFS, monthly lunar imaging accurately tracked stability at an accuracy of approximately 0.1% that allowed the data to be used for climate studies [2]. It is now acknowledged by the international community that future missions and sensor designs need to accommodate lunar calibrations. An overview of ocean color remote sensing and a review of the progress made in ocean color remote sensing and the variety of research applications derived from global satellite ocean color data are provided. The purpose of this chapter is to discuss the design options for ocean color satellite radiometers, performance and testing criteria, and sensor components (optics, detectors, electronics, etc.) that must be integrated into an instrument concept. These ultimately dictate the quality and quantity of data that can be delivered as a trade against mission cost. Historically, science and sensor technology have advanced in a "leap-frog" manner in that sensor design requirements for a mission are defined many years before a sensor is launched and by the end of the mission, perhaps 15-20 years later, science applications and requirements are well beyond the capabilities of the sensor. Section 3 provides a summary of historical mission science objectives and sensor requirements. This progression is expected to continue in the future as long as sensor costs can be constrained to affordable levels and still allow the incorporation of new technologies without incurring unacceptable risk to mission success. The IOCCG Report Number 13 discusses future ocean biology mission Level-1 requirements in depth

Active Matrix Flat Panel Bio-Medical X-ray Imagers

This work investigates the design, system integration, optimization, and evaluation of amorphous silicon (a-Si:H) active matrix flat panel imagers (AMFPI) for bio-medical applications. Here, two hybrid active pixel sensor (H-APS) designs are introduced that improve the dynamic range while maintaining the desirable attributes of high speed and low noise readout. Also presented is a systematic approach for noise analysis of thin film transistors (TFT) and pixel circuits in which circuit analysis techniques and TFT noise models are combined to evaluate circuit noise performance. We also explore different options of system integration and present measurement results of a high fill-factor (HFF) array with segmented photodiode