11,655 research outputs found

    A Review of State-of-the-Art Large Sized Foam Cutting Rapid Prototyping and Manufacturing Technologies.

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    Purpose – Current additive rapid prototyping (RP) technologies fail to efficiently produce objects greater than 0.5?m3 due to restrictions in build size, build time and cost. A need exists to develop RP and manufacturing technologies capable of producing large objects in a rapid manner directly from computer-aided design data. Foam cutting RP is a relatively new technology capable of producing large complex objects using inexpensive materials. The purpose of this paper is to describe nine such technologies that have been developed or are currently being developed at institutions around the world. The relative merits of each system are discussed. Recommendations are given with the aim of enhancing the performance of existing and future foam cutting RP systems. Design/methodology/approach – The review is based on an extensive literature review covering academic publications, company documents and web site information. Findings – The paper provides insights into the different machine configurations and cutting strategies. The most successful machines and cutting strategies are identified. Research limitations/implications – Most of the foam cutting RP systems described have not been developed to the commercial level, thus a benchmark study directly comparing the nine systems was not possible. Originality/value – This paper provides the first overview of foam cutting RP technology, a field which is over a decade old. The information contained in this paper will help improve future developments in foam cutting RP systems

    Atomically thin mica flakes and their application as ultrathin insulating substrates for graphene

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    We show that it is possible to deposit, by mechanical exfoliation on SiO2/Si wafers, atomically thin mica flakes down to a single monolayer thickness. The optical contrast of these mica flakes on top of a SiO2/Si substrate, which depends on their thickness, the illumination wavelength and the SiO2 substrate thickness, can be quantitatively accounted for by a Fresnel law based model. The preparation of atomically thin insulating crystalline sheets will enable the fabrication of ultrathin defect-free insulating substrates, dielectric barriers or planar electron tunneling junctions. Additionally, we show that few-layer graphene flakes can be deposited on top of a previously transferred mica flake. Our transfer method relies on viscoelastic stamps, as those used for soft lithography. A Raman spectroscopy study shows that such an all-dry deposition technique yields cleaner and higher quality flakes than conventional wet-transfer procedures based on lithographic resists.Comment: 11 pages, 5 figures, 1 graphical abstrac

    From 3D Models to 3D Prints: an Overview of the Processing Pipeline

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    Due to the wide diffusion of 3D printing technologies, geometric algorithms for Additive Manufacturing are being invented at an impressive speed. Each single step, in particular along the Process Planning pipeline, can now count on dozens of methods that prepare the 3D model for fabrication, while analysing and optimizing geometry and machine instructions for various objectives. This report provides a classification of this huge state of the art, and elicits the relation between each single algorithm and a list of desirable objectives during Process Planning. The objectives themselves are listed and discussed, along with possible needs for tradeoffs. Additive Manufacturing technologies are broadly categorized to explicitly relate classes of devices and supported features. Finally, this report offers an analysis of the state of the art while discussing open and challenging problems from both an academic and an industrial perspective.Comment: European Union (EU); Horizon 2020; H2020-FoF-2015; RIA - Research and Innovation action; Grant agreement N. 68044

    Theory of Optical Nonlocality in Polar Dielectrics

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    Sub-wavelength confinement of mid-infrared light can be achieved exploiting the metal-like optical response of polar dielectric crystals in their Reststrahlen spectral region, where they support evanescent modes termed surface phonon polaritons. In the past few years the investigation of phonon polaritons localised in nanoresonators and layered heterostructures has enjoyed remarkable success, highlighting them as a promising platform for mid-infrared nanophotonic applications. Here we prove that the standard local dielectric description of phonon polaritons in nanometric objects fails due to the nonlocal nature of the phonon response and we develop the corresponding nonlocal theory. Application of our general theory to both dielectric nanospheres and thin films demonstrates that polar dielectrics exhibit a rich nonlocal phenomenology, qualitatively different from the one of plasmonic systems, due to the negative dispersion of phononic optical modes.Comment: 13 pages, 6 figure

    Hybrid Manufacturing System Design and Development

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    Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride

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    Insulating films are essential in multiple electronic devices because they can provide essential functionalities, such as capacitance effects and electrical fields. Two-dimensional (2D) layered materials have superb electronic, physical, chemical, thermal, and optical properties, and they can be effectively used to provide additional performances, such as flexibility and transparency. 2D layered insulators are called to be essential in future electronic devices, but their reliability, degradation kinetics, and dielectric breakdown (BD) process are still not understood. In this work, the dielectric breakdown process of multilayer hexagonal boron nitride (h-BN) is analyzed on the nanoscale and on the device level, and the experimental results are studied via theoretical models. It is found that under electrical stress, local charge accumulation and charge trapping/detrapping are the onset mechanisms for dielectric BD formation. By means of conductive atomic force microscopy, the BD event was triggered at several locations on the surface of different dielectrics (SiO2, HfO2, Al2O3, multilayer h-BN, and monolayer h-BN); BD-induced hillocks rapidly appeared on the surface of all of them when the BD was reached, except in monolayer h-BN. The high thermal conductivity of h-BN combined with the one-atom-thick nature are genuine factors contributing to heat dissipation at the BD spot, which avoids self-accelerated and thermally driven catastrophic BD. These results point to monolayer h-BN as a sublime dielectric in terms of reliability, which may have important implications in future digital electronic devices.Fil: Jiang, Lanlan. Soochow University; ChinaFil: Shi, Yuanyuan. Soochow University; China. University of Stanford; Estados UnidosFil: Hui, Fei. Soochow University; China. Massachusetts Institute of Technology; Estados UnidosFil: Tang, Kechao. University of Stanford; Estados UnidosFil: Wu, Qian. Soochow University; ChinaFil: Pan, Chengbin. Soochow University; ChinaFil: Jing, Xu. Soochow University; China. University of Texas at Austin; Estados UnidosFil: Uppal, Hasan. University of Manchester; Reino UnidoFil: Palumbo, FĂ©lix Roberto Mario. ComisiĂłn Nacional de EnergĂ­a AtĂłmica; Argentina. Universidad TecnolĂłgica Nacional; Argentina. Consejo Nacional de Investigaciones CientĂ­ficas y TĂ©cnicas; ArgentinaFil: Lu, Guangyuan. Chinese Academy of Sciences; RepĂşblica de ChinaFil: Wu, Tianru. Chinese Academy of Sciences; RepĂşblica de ChinaFil: Wang, Haomin. Chinese Academy of Sciences; RepĂşblica de ChinaFil: Villena, Marco A.. Soochow University; ChinaFil: Xie, Xiaoming. Chinese Academy of Sciences; RepĂşblica de China. ShanghaiTech University; ChinaFil: McIntyre, Paul C.. University of Stanford; Estados UnidosFil: Lanza, Mario. Soochow University; Chin
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