Noise Mitigation Analysis of a Pi-Filter for an Automotive Control Module

This paper has been reproduced on " InCompliance" magazine, May issue http://www.incompliancemag.com/ then "Issue Archive

Manufacturing process applications team (MATeam)

Activities of the manufacturing applications team (MATeam) in effecting widespread transfer of NASA technology to aid in the solution of manufacturing problems in the industrial sector are described. During the program's first year of operation, 450 companies, industry associations, and government agencies were contacted, 150 manufacturing problems were documented, and 20 potential technology transfers were identified. Although none of the technology transfers has been commercialized and put in use, several are in the applications engineering phase, and others are in the early stages of implementation. The technology transfer process is described and guidelines used for the preparation of problems statements are included

Greening Consumer Electronics: Moving Away From Bromine and Chlorine

Presents case studies of seven electronics companies that have engineered environmental solutions that eliminate the use of most brominated and chlorinated chemicals that generate toxic materials. Discusses global standards and regulations

Design of automatic vision-based inspection system for solder joint segmentation

Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under different illumination conditions. Design/methodology/approach: An illumination normalization approach is applied to an image, which can effectively and efficiently eliminate the effect of uneven illumination while keeping the properties of the processed image the same as in the corresponding image under normal lighting conditions. Consequently special lighting and instrumental setup can be reduced in order to detect solder joints. These normalised images are insensitive to illumination variations and are used for the subsequent solder joint detection stages. In the segmentation approach, the PCB image is transformed from an RGB color space to a YIQ color space for the effective detection of solder joints from the background. Findings: The segmentation results show that the proposed approach improves the performance significantly for images under varying illumination conditions. Research limitations/implications: This paper proposes a front-end system for the automatic detection, localisation, and segmentation of solder joint defects. Further research is required to complete the full system including the classification of solder joint defects. Practical implications: The methodology presented in this paper can be an effective method to reduce cost and improve quality in production of PCBs in the manufacturing industry. Originality/value: This research proposes the automatic location, identification and segmentation of solder joints under different illumination conditions

The export competitiveness of the newly industrialised east Asian economies: How real is the Chinese threat in electronics?

This paper examines the export performance of China in electronics compared to the east Asian NIEs exporting to the USA, the European Union, and Japan between 1988 and 2001 using a dynamic version of shift-share analysis to overcome some of the inherent drawbacks of the widely-used static shift-share methodology. Our findings suggest that China has now emerged as a serious contender in the export market for electronic goods, but this position has not been a dominant one. For electronics as a whole, the principal gainers after 1995 appear to be newcomers China and Malaysia at the expense of the older Tigers, like Singapore and Hong Kong. To some extent this represents a natural process of ‘catch-up’. Moreover, no single NIE has dominated all categories of electronic exports. In the east Asian region, the less developed members of ASEAN would appear to be most at risk in the immediate future since they compete head on with China in lower-end manufacturing and are in danger of being ‘leapfrogged’ in the value-added chain. The more advanced NIEs are in a better position since they have time to increase value-added before China catches up and may benefit more from the opportunities China offers in terms of production and service complementarities

Retention and application of Skylab experiences to future programs

The problems encountered and special techniques and procedures developed on the Skylab program are described along with the experiences and practical benefits obtained for dissemination and use on future programs. Three major topics are discussed: electrical problems, mechanical problems, and special techniques. Special techniques and procedures are identified that were either developed or refined during the Skylab program. These techniques and procedures came from all manufacturing and test phases of the Skylab program and include both flight and GSE items from component level to sophisticated spaceflight systems

Стійка технологія переробки відходів електричного та електронного обладнання

Об’єкт досліджень: технологічні основи «переробки відходів електричного та електронного обладнання». Предмет досліджень: механізм піролізу, отримання рідкого палива, подрібнення друкованих плат після піролізу, вібраційний млин та його сили, які впливають на подрібнення. Вихідні дані для проведення роботи: характеристики друкованих плат та їх переробка у світі. Наукова новизна: відокремлення металевої фракції від наповнювачів, за рахунок ковкості металевої фракції при подрібнені та подальшому розділення при грохочені. Практична цінність: поліпшення екологічної складової за рахунок втілення нових технологій в сектор управління відходів та рециклінгу вже добутих мінералів. Дипломна робота написана англійською мовою та надалі буде захищена в ТУ "Фрайберзька гірнича академія"

Infrared testing of electronic components Final report, 5 Apr. 1965 - 5 Jun. 1966

Infrared radiation nondestructive test technique for electrical/electronic equipmen

Intensity-based image registration using multiple distributed agents

Image registration is the process of geometrically aligning images taken from different sensors, viewpoints or instances in time. It plays a key role in the detection of defects or anomalies for automated visual inspection. A multiagent distributed blackboard system has been developed for intensity-based image registration. The images are divided into segments and allocated to agents on separate processors, allowing parallel computation of a similarity metric that measures the degree of likeness between reference and sensed images after the application of a transform. The need for a dedicated control module is removed by coordination of agents via the blackboard. Tests show that additional agents increase speed, provided the communication capacity of the blackboard is not saturated. The success of the approach in achieving registration, despite significant misalignment of the original images, is demonstrated in the detection of manufacturing defects on screen-printed plastic bottles and printed circuit boards

Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits

Printed Wiring Multilayer Board (PWMLB) structures for high speed, high density circuits are prone to failure due to the microcracking of electrolytic copper interconnections. The failure can occur in the foil that makes up the inner layer traces or in the plated through holes (PTH) deposit that forms the layer to layer interconnections. It is shown that there are some distinctive differences in the quality of Type E copper and that these differences can be detected before its use in a PWMLB. It is suggested that the strength of some Type E copper can be very low when the material is hot and that it is the use of this poor quality material in a PWMLB that results in PTH and inner layer microcracking. Since the PWMLB failure in question are induced by a thermal stress, and since the poorer grades of Type E materials used in these structures are susceptible to premature failure under thermal stress, the use of elevated temperature rupture and creep rupture testing is proposed as a means for screening copper foil, or its PTH equivalent, in order to eliminate the problem of Type E copper microcracking in advanced PWMLBs