The IPS fidelity scale as a guideline to implement Supported Employment

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Placement and routing for reconfigurable systems.

Applications using reconfigurable logic have been widely demonstrated to offer better performance over software-based solutions. However, good performance rating is often destroyed by poor reconfiguration latency - time required to reconfigure hardware to perform the new task. Recent research focus on design automation techniques to address reconfiguration latency bottleneck. The contribution to novelty of this thesis is in new placement and routing techniques resulting in minimising reconfiguration latency of reconfigurable systems. This presents a part of design process concerned with positioning and connecting design blocks in a logic gate array. The aim of the research is to optimise the placement and interconnect strategy such that dynamic changes in system functionality can be achieved with minimum delay. A review of previous work in the field is given and the relevant theoretical framework developed. The dynamic reconfiguration problem is analysed for various reconfigurable technologies. Several algorithms are developed and evaluated using a representative set of problem domains to assess their effectiveness. Results obtained with novel placement and routing techniques demonstrate configuration data size reduction leading to significant reconfiguration latency improvements

Efficient quadratic placement for FPGAs.

Field Programmable Gate Arrays (FPGAs) are widely used in industry because they can implement any digital circuit on site simply by specifying programmable logic and their interconnections. However, this rapid prototyping advantage may be adversely affected because of the long compile time, which is dominated by placement and routing. This issue is of great importance, especially as the logic capacities of FPGAs continue to grow. This thesis focuses on the placement phase of FPGA Computer Aided Design (CAD) flow and presents a fast, high quality, wirelength-driven placement algorithm for FPGAs that is based on the quadratic placement approach. In this thesis, multiple iterations of equation solving process together with a linear wirelength reduction technique are introduced. The proposed algorithm efficiently handles the main problems with the quadratic placement algorithm and produces a fast and high quality placement. Experimental results, using twenty benchmark circuits, show that this algorithm can achieve comparable total wirelength and, on average, 5X faster run time when compared to an existing, state-of-the-art placement tool. This thesis also shows that the proposed algorithm delivers promising preliminary results in minimizing the critical path delay while maintaining high placement quality.Dept. of Electrical and Computer Engineering. Paper copy at Leddy Library: Theses & Major Papers - Basement, West Bldg. / Call Number: Thesis2005 .X86. Source: Masters Abstracts International, Volume: 44-04, page: 1946. Thesis (M.A.Sc.)--University of Windsor (Canada), 2005

Nanometer VLSI placement and optimization for multi-objective design closure

In a VLSI physical synthesis flow, placement directly defines the interconnection, which affects many other design objectives, such as timing, power consumption, congestion, and thermal issues. With the scaling of technology, the relative interconnect delay increases dramatically. As a result, placement has become a bottleneck in deep sub-micron physical synthesis. In this dissertation, I propose several optimization algorithms from global placement, placement migration, timing driven placements, to incremental power optimizations for multi-objective VLSI design closure. The first work is DPlace, a new global placement algorithm that scales well to the modern large-scale circuit placement problems. DPlace simulates the natural diffusion process to spread cells smoothly over the placement region, and uses both analytical and discrete techniques to improve the wire length. However, global placement is never sufficient for multi-objective design closure, a variety of design objectives have to be improved incrementally, such as timing, routing congestion, signal integrity, and heat distribution. Placement migration is a critical step to address the cell overlaps appearing during incremental optimizations. To achieve high placement stability, I propose a computational geometry based placement migration flow to cope with placement changes, and a new stability metric to measure the “similarity” between two placements accurately. Our placement migration algorithm has clear advantage over conventional legalization algorithms such that the neighborhood characteristics of the original placement are preserved. For timing closure in high performance designs, I present a linear programming based incremental timing driven placement to improve the timing on critical paths directly. I further present an efficient timing driven placement algorithm (Pyramids). Two formulations of Pyramids are proposed, which are suitable for different optimization stages in a physical synthesis flow. Both approaches find the optimal location for timing of a cell in constant time, through computational geometry based approaches. For fast convergence of design closure, placement should be integrated with other optimization techniques. I propose to combine placement, gate sizing and Vt swapping techniques to reduce the total power consumption, especially the leakage power, which is becoming increasingly critical for nanometer VLSI design closure.Electrical and Computer Engineerin

A Structured Design Methodology for High Performance VLSI Arrays

abstract: The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.Dissertation/ThesisPh.D. Electrical Engineering 201

Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, stress-induced carrier mobility variation in TSV-based 3D ICs is examined. In the third work, temperature inside TSV-based 3D ICs is investigated. In the final work, the quality trade-offs of TSV-based 3D-IC designs are explored. In the first work, a force-directed, 3D, and gate-level placement algorithm that efficiently handles TSVs is developed. The experiments based on synthesized benchmarks indicate that the developed algorithm helps generate GDSII layouts of 3D-IC designs that are optimized in terms of wirelength. In addition, the impact of TSVs on other physical aspects of 3D-IC designs is also studied by analyzing the GDSII layouts. In the second work, the model for carrier mobility variation caused by TSV and STI stresses is developed as well as the timing analysis flow considering the stresses. The impact of TSV and STI stresses on carrier mobility variation and performance of 3D ICs is studied. Furthermore, a TSV-stress-driven, force-directed, and 3D placement algorithm is developed. It exploits carrier mobility variation, caused by stress around TSVs after fabrication, to improve the timing and area objectives during placement. In addition, the impact of keep-out zone (KOZ) around TSVs on stress, carrier mobility variation, area, wirelength, and performance of 3D ICs is studied. In the third work, two temperature-aware global placement algorithms are developed. They exploit die-to-die thermal coupling in 3D ICs to improve temperature during placement. In addition, a framework used to evaluate the results from temperature-aware global placements is developed. The main component of the framework is a GDSII-level thermal analysis that considers all structures inside a TSV-based 3D IC while computing temperature. The developed placers are compared with several state-of-the-art placers published in recent literature. The experimental results indicate that the developed algorithms help improve the temperature of 3D ICs effectively. In the final work, three block-level design styles for TSV-based die-to-wafer bonded 3D ICs are discussed. Several 3D-IC layouts in the three styles are manually designed. The main difference among these layouts is the position of TSVs. Finally, the area, wirelength, timing, power, temperature, and mechanical stress of all layouts are compared to explore the trade-offs of layout quality.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Mukhopadhyay, Saibal; Committee Member: Swaminathan, Madhava