Impact of 3D IC on NoC Topologies: A Wire Delay Consideration

International audienceIn this paper, we perform an exploration of 3D NoC architectures through physical design implementation based on two tiers Tezzaron 3D technology. The 3D NoC partitioning is done by dividing the NoC's datapath component into two blocks placed in the two tiers. Two Stacked NoC architectures namely Stacked 3D-Mesh NoC and Stacked 2D-Hexagonal NoC developed based on this partitioning strategy are analyzed by comparing their performances with Stacked 2D-Mesh NoC and classical 2D- Mesh and 3D-Mesh NoC. In order to measure the impact of wire delay on performance, two technology libraries (130 nm and 45 nm) representing old and advanced technologies have been used for the performance analysis. Results from physical implementations show that in advanced technologies such as 45 nm and below, the performance of Stacked 2D NoC topologies with datapath partitioning method have better performances compared with traditional 2D/3D Mesh topologies and Stacked 3D Mesh topology. We advocate here that with stacking there is no need for 3D NoC topologies for advanced 2-tier 3D IC and this is also confirmed for multistage networks like butterfly

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12{\deg}C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking

Optimization-based power and thermal management for dark silicon aware 3D chip multiprocessors using heterogeneous cache hierarchy

Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Prior innovative studies have addressed the dark silicon problem in the fields of power-efficient core design. However, addressing dark silicon challenges in uncore component designs such as cache hierarchy, on-chip interconnect etc. that consume significant portion of the on-chip power consumption is largely unexplored. In this paper, for the first time, we propose an integrated approach which considers the impact of power consumption of core and uncore components simultaneously to improve multi/many-core performance in the dark silicon era. The proposed approach dynamically (1) predicts the changing program behavior on each core; (2) re-determines frequency/voltage, cache capacity and technology in each level of the cache hierarchy based on the program's scalability in order to satisfy the power and temperature constraints. In the proposed architecture, for future chip-multiprocessors (CMPs), we exploit emerging technologies such as non-volatile memories (NVMs) and 3D techniques to combat dark silicon. Also, for the first time, we propose a detailed power model which is useful for future dark silicon CMPs power modeling. Experimental results on SPEC 2000/2006 benchmarks show that the proposed method improves throughput by about 54.3% and energy-delay product by about 61% on average, respectively, in comparison with the conventional CMP architecture with homogenous cache system. (A preliminary short version of this work was presented in the 18th Euromicro Conference on Digital System Design (DSD), 2015.) © 2017 Elsevier B.V

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Power supply noise analysis for 3D ICs using through-silicon-vias

3D design is being recognized widely as the next BIG thing in system integration. However, design and analysis tools for 3D are still in infancy stage. Power supply noise analysis is one of the critical aspects of a design. Hence, the area of noise analysis for 3D designs is a key area for future development. The following research presents a new parasitic RLC modeling technique for 3D chips containing TSVs as well as a novel optimization algorithm for power-ground network of a 3D chip with the aim of minimizing noise in the network. The following work also looks into an existing commercial IR drop analysis tool and presents a way to modify it with the aim of handling 3D designs containing TSVs.M.S.Committee Chair: Lim, Sung-Kyu; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Loh, Gabrie

Reducing dram access latency by exploiting dram leakage characteristics and common access patterns

DRAM tabanlı bellek, bilgisayar sisteminde darboğaz oluşturarak sistemin başarımı sınırlayan en önemli bileşendir. Bunun sebebi işlemcilerin hız bakımından DRAM'lerin çok önünde olmasıdır. Bu tezde, ChargeCache ismini verdiğimiz, DRAM'lerin erişim gecikmesini azaltan bir yöntem geliştirdik. Bu yöntem, piyasadaki DRAM yongalarının mimarisinde bir değişiklik gerektirmediği gibi, bellek denetimcisinde de düşük donanım maliyeti olan ek birimlere ihtiyaç duymaktadır. ChargeCache, yeni erişilmiş DRAM satırlarının kısa bir süre sonra tekrar erişileceği gözlemine dayanmaktadır. Yeni erişilmiş satırlardaki DRAM hücreleri yüksek miktarda yük içerdiğinden, bunlara hızlı bir şekilde erişilebilir. Bu gözlemden faydalanmak için yeni erişilen satırların adreslerini bellek denetimcisi içerisinde bir tabloda tutmayı öneriyoruz. Sonraki erişim isteklerinin bu tablodaki satırlara erişmek istemesi durumunda, bellek denetimcisi yük miktarı yüksek hücrelerin erişilmek üzere olduğunu bileceğinden, DRAM erişim değiştirgelerini ayarlayarak erişimin düşük gecikmeyle tamamlanmasını sağlayabilir. Belirli bir süre sonra tablodaki satır adresleri silinerek, zaman içerisinde çok fazla yük kaybedip hızlı erişilebilme özelliğini yitirmiş satırların bu tablodan çıkarılması sağlanır. Önerdiğimiz yöntemi hem tek çekirdekli hem de çok çekirdekli mimarilerde benzetim ortamında deneyerek, yöntemin başarım ve enerji kullanımı açısından sistem üzerinde sağladığı iyileştirmeleri inceledik.DRAM-based memory is a critical factor that creates a bottleneck on the system performance since the processor speed largely outperforms the DRAM latency. In this thesis, we develop a low-cost mechanism, called ChargeCache, which enables faster access to recently-accessed rows in DRAM, with no modifications to DRAM chips. Our mechanism is based on the key observation that a recently-accessed row has more charge and thus the following access to the same row can be performed faster. To exploit this observation, we propose to track the addresses of recently-accessed rows in a table in the memory controller. If a later DRAM request hits in that table, the memory controller uses lower timing parameters, leading to reduced DRAM latency. Row addresses are removed from the table after a specified duration to ensure rows that have leaked too much charge are not accessed with lower latency. We evaluate ChargeCache on a wide variety of workloads and show that it provides significant performance and energy benefits for both single-core and multi-core systems

Memory-Aware Scheduling for Fixed Priority Hard Real-Time Computing Systems

As a major component of a computing system, memory has been a key performance and power consumption bottleneck in computer system design. While processor speeds have been kept rising dramatically, the overall computing performance improvement of the entire system is limited by how fast the memory can feed instructions/data to processing units (i.e. so-called memory wall problem). The increasing transistor density and surging access demands from a rapidly growing number of processing cores also significantly elevated the power consumption of the memory system. In addition, the interference of memory access from different applications and processing cores significantly degrade the computation predictability, which is essential to ensure timing specifications in real-time system design. The recent IC technologies (such as 3D-IC technology) and emerging data-intensive real-time applications (such as Virtual Reality/Augmented Reality, Artificial Intelligence, Internet of Things) further amplify these challenges. We believe that it is not simply desirable but necessary to adopt a joint CPU/Memory resource management framework to deal with these grave challenges. In this dissertation, we focus on studying how to schedule fixed-priority hard real-time tasks with memory impacts taken into considerations. We target on the fixed-priority real-time scheduling scheme since this is one of the most commonly used strategies for practical real-time applications. Specifically, we first develop an approach that takes into consideration not only the execution time variations with cache allocations but also the task period relationship, showing a significant improvement in the feasibility of the system. We further study the problem of how to guarantee timing constraints for hard real-time systems under CPU and memory thermal constraints. We first study the problem under an architecture model with a single core and its main memory individually packaged. We develop a thermal model that can capture the thermal interaction between the processor and memory, and incorporate the periodic resource sever model into our scheduling framework to guarantee both the timing and thermal constraints. We further extend our research to the multi-core architectures with processing cores and memory devices integrated into a single 3D platform. To our best knowledge, this is the first research that can guarantee hard deadline constraints for real-time tasks under temperature constraints for both processing cores and memory devices. Extensive simulation results demonstrate that our proposed scheduling can improve significantly the feasibility of hard real-time systems under thermal constraints